Integration of lasers and fibre optics into robotic systems provides new opportunities in sensing and material processing. Increased productivity and application of robots in hostile environments are other possibilities.
In the last few years many new types of light‐guiding optical film structures have been developed. Several applications have been published in the field of optical and optoelectronic integrated circuits, sensor‐elements, etc. The basic component of these systems is the optical waveguide which can be realised with optical fibres or fabricated as a layer structure from different dielectrics and many kinds of glasses. The purpose of this paper is to describe some problems and solutions of optical waveguide thick film manufacturing and also connecting techniques with optical fibres.
The International Electronic Components Show in Paris in November, 1983, provided the occasion for a very successful meeting of ISHM‐France which attracted 170 attendees. The following presentations were given:
Eighty‐five participants attended the 4th ISHM Display meeting at the Jaarbeurs Congress Centre in Utrecht on 16 October, 1986. The programme of the day started with the annual general membership meeting of the Benelux Chapter. The chairman, Mr T. Kwikkers, gave a short review of the state of affairs of ISHM‐Benelux and of the activities of the last year. He mentioned the temporary enlargement of the executive committee to give a new generation a chance to gain experience in the ISHM organisation and to take up some new activities. In order to raise publicity for ISHM and Hybrid Circuits a new brochure has been designed and a set of material for demonstration purposes was collected. With the material every member of the chapter can easily set up a presentation for schools or customers. This year ISHM‐Benelux has grown from 85 to 100 members and enjoys a healthy financial situation. Next year again emphasis will be put on public relations. Professor R. Govaerts signified that he was no longer available for a position in the executive committee. As Prof. Govaerts has been very active and stimulating for the ISHM‐Benelux Chapter from its foundation in 1976 up to now, the general membership meeting decided to appoint him as (the first) honorary member of this chapter. Except for Professor Govaerts, the sitting executive committee, consisting of 15 members, was re‐elected for another year. After the European conferences in Bournemouth and Hamburg the ISHM‐Benelux chapter is asked to organise the 1991 Conference. The executive committee is already looking out for candidates for a function in the organising committee, which must be formed in the coming year.
A review of integrated optical circuit technologies [OIC] and their relevance to potential OIC sensor application. Describes the manufacture of OICs and the varied range of material technologies used. Active Silicon Integrated Optical Circuits have been developed which may have applications for many optical sensor and fibre optic sensor systems. Concludes however that silicon integrated optics will not enjoy large‐scale success until their manufacturing costs have been dramatically reduced.
Propagation of electromagnetic waves through InP‐based integrated optics structures is directly simulated by solving the full vectorial wave equation in parabolic…
Propagation of electromagnetic waves through InP‐based integrated optics structures is directly simulated by solving the full vectorial wave equation in parabolic approximation for the transversal components Hx and Hy of the magnetic intensity vector H. A novel scheme based on the alternating‐directions split‐step finite‐difference technique in combination with the Crank Nicolson scheme is introduced providing exact treatment of the field quantities at the dielectric interfaces between waveguide core and cladding. The method described is applied to the solution of the fundamental mode in a buried rectangular dielectric waveguide and to the numerical optimization of a tapered matching structure.
Many waveguide problems in integrated optics may mathematically be described by a scalar Helmholtz equation. In this paper it will be shown, that the same equation arises…
Many waveguide problems in integrated optics may mathematically be described by a scalar Helmholtz equation. In this paper it will be shown, that the same equation arises in the analysis of a mechanical vibration problem (elastically bedded membrane). One can utilize this analogy for calculating the propagation characteristics and field distribution of optical waveguides by one of the wide spread mechanics Finite‐Element codes, which are available on many computer systems, including personal computers in recent years. As an example this computation by analogy method is employed for the computation of the propagation characteristic of a symmetric film waveguide.
The purpose of this paper is to consider a detailed investigation of transversal magnetic (TM) nonlinear magnetooptical integrated optical sensor. The sensitivities of two…
The purpose of this paper is to consider a detailed investigation of transversal magnetic (TM) nonlinear magnetooptical integrated optical sensor. The sensitivities of two sensors are presented. The first sensor composed of a dielectric thin film surrounded by a lossless, nonmagnetic, isotropic cladding exhibiting a local Kerr‐like dielectric nonlinearity, and a magnetic substrate chosen to be an iron garnet. The second sensor is formed by exchanging the cladding and the substrate media of the first sensor. The homogenous sensitivities of both sensors are calculated as a function of the waveguide thickness and the effective refractive index. The effect of nonlinearity on the sensitivities for both sensors is investigated.
The homogenous sensitivities of both sensors are calculated as a function of the waveguide thickness and the effective refractive index. The effect of nonlinearity on the sensitivities for both sensors is investigated. Numerical calculations are performed using the Maple program.
It was found that the sensitivity for the first sensor sensitivity increases with nonlinearity. While the sensitivity for the second sensor is hardly affected by the change of nonlinearity. It was also found that the thickness of the guiding layer is a critical parameter for the sensitivity of the optical sensor with the optimum thickness being just above cut‐off in case of the first structure and at the cut‐off in the case of the second structure.
A detailed investigation of TM nonlinear magnetooptical integrated optical sensor is considered. The two proposed structures are used to investigate the parameters to get the optimal sensitivity, which is an important issue is the sensor design.
Heating is a major cause of failure in integrated circuits. The authors have designed thermoreflectance‐based systems operating at various wavelengths in order to obtain…
Heating is a major cause of failure in integrated circuits. The authors have designed thermoreflectance‐based systems operating at various wavelengths in order to obtain temperature images. This paper aims to explore the possibilities of each wavelength range and detail the charge coupled device (CCD)‐based thermal imaging tools dedicated to the high‐resolution inspection of integrated circuits.
Thermoreflectance is a non‐contact optical method using the local reflectivity variations induced by heating to infer temperature mappings, and can be conducted at virtually any wavelength, giving access to different types of information. In the visible, the technique is now well established. It can probe temperatures through several micrometers of transparent encapsulation layers, with sub‐μm spatial resolution and 100 mK thermal resolution.
In the ultraviolet range, dielectric encapsulation layers are opaque and thermoreflectance gives access to the surface temperature. In the near infrared, thermoreflectance is an interesting solution to examine chips turned upside down, since these wavelengths can penetrate through silicon substrates and give access to the temperature of the active layers themselves.
The authors show that the illumination wavelength of thermoreflectance should be chosen with care depending on the region of the integrated circuit (surface, above, or below the substrate) to be investigated.
This set of versatile and sensitive tools makes thermoreflectance an interesting tool for the semiconductor industry, either during prototyping or as a characterization tool after fabrication.
The CCD‐based thermoreflectance approach adopted here allows fast, non‐contact, high‐resolution thermal imaging of integrated circuits.