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A ‘no‐wire’ infrared thermometer from Land Infrared has been designed for use in ‘unsafe’ environments.

A guide to the various technologies available for measuring and monitoring temperature in the power generation industry. Outlines the parameters to be considered when choosing a measurement system: budgets, location, operating environment. Describes the various technologies of thermocouples, resistance thermometers, infrared thermometry and fibre‐optic temperature sensors and discusses the applications for which each is best suited.

This paper aims to overcome the defect of single-source temperature measurement method and improve the measurement accuracy of FTR. The friction temperature rise (FTR) of brake affects braking performance seriously. However, it was mainly detected by single-source indirect thermometry, which has obvious deviations.

A three-point temperature measurement system was built based on three kinds of single-resource thermometry. Temperature characteristics of these thermometry were analyzed to achieve a standard FTR curve. Two fusion-monitoring models for FTR based on multi-source information were established by artificial neural network (ANN) and support vector machine (SVM).

Finally, the two models were verified based on the experimental results. The results showed that the fusion-monitoring model of SVM was more accurate than that of ANN in monitoring of FTR.

Then the temperature characteristics of the three single-source thermometry were analyzed, and the fusion-monitoring models based on multi-source information were established by ANN and SVM. Finally, the accuracy of the two models was compared by the experimental results. The more suitable fusion-monitoring model for FTR monitoring was determined which would be of theoretical and practical significance for remedying the monitoring defect of FTR.

This paper aims to analyze the conical-shaped compensator applied to infrared (IR) thermometry for planar materials.

The compensator for the IR thermometry system has been analyzed by means of numerical simulations performed in a commercial finite element analysis tool. Afterwards, the characteristics of a final system have been proposed. The simulation results have been validated by means of experimental measurements performed in a prototype of the proposed system.

The proposed conical shape geometry of the compensator is suitable to reduce the errors associated with the temperature estimation by IR thermometry when emissivity of the material is not known with adequate accuracy.

This work proposed an arrangement of conical-shaped compensator to increase the precision in the IR radiation thermometry of planar materials.

In this paper, the conical shape geometry is proposed instead of the classical semi-spherical geometry for the compensator of an IR radiation thermometry system with the purpose of reducing the thickness of the complete system. This new proposal can be advantageous when geometrical constraints are imposed.

The goal of this review paper is to provide information on several commonly used thermography techniques in semiconductor and micro‐device industry and research today.

The temperature imaging or mapping techniques include thin coating methods such as liquid crystal thermography and fluorescence microthermography, contact mechanical methods such as scanning thermal microscopy, and optical techniques such as infrared microscopy and thermoreflectance. Their principles, characteristics and applications are discussed.

Thermal issues play an important part in optimizing the performance and reliability of high‐frequency and high‐packing density electronic circuits. To improve the performance and reliability of microelectronic devices and also to validate thermal models, accurate knowledge of local temperatures and thermal properties is required.

The paper provides readers, especially technical engineers in industry, a general knowledge of several commonly used thermography techniques in the semiconductor and micro‐device industries.

The purpose of this paper is to calibrate the surface emissivity of micro drill bit and to investigate the effect of different drilling parameters on the temperature of micro drill bit in printed circuit board (PCB) micro drilling process.

The surface emissivity of micro drill bit was obtained by experiments. Analysis of variance (ANOVA) was applied in this study to analysis the effect of different drilling parameters on the temperature of micro drill bit in PCB micro hole drilling. The most significant influencing factor on micro drill bit temperature was achieved by ANOVA.

First, the surface emissivity of cemented carbide rod decreased from 0.4 to 0.32 slowly with temperature in the range of 50-220°C. Second, the most significant influencing factor on the micro drill bit temperature was spindle speed among the drilling parameters including spindle speed, retract rate and infeed rate.

In this paper, the influence of roughness of black coating, carbide rod and micro drill bit on the surface emissivity calibration and the temperature measurement was not considered.

A new simple method has been presented to calibrate the surface emissivity of micro drill bit. Through calibrating the surface emissivity of micro drill bit, the temperature of micro drill bit can be measured accurately by infrared thermometry. Analyzing the influences of different drilling parameters on the temperature of micro drill bit, the mechanism of drilling parameters on drilling temperature is achieved. The basis for the selection of drilling parameters to improve the hole quality is enhanced.

Infrared sensors are the fastest growing segment of a $1 billion a year temperature sensor market. Matt Guerreiri of Raytek explains why.