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1 – 10 of 179
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Article
Publication date: 1 December 2003

31

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Microelectronics International, vol. 20 no. 3
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 1 December 2003

75

Abstract

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Soldering & Surface Mount Technology, vol. 15 no. 3
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 1 March 2004

54

Abstract

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Circuit World, vol. 30 no. 1
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 1 February 1995

K. Akinade, R. Burgess, M. Campbell, S. Carver, L. Sanderson, R. Wade and C. Melton

The increased interest in the electronics industry to search for alternatives to lead‐containing solders is evidenced by the number of recently published articles on lead‐free

Abstract

The increased interest in the electronics industry to search for alternatives to lead‐containing solders is evidenced by the number of recently published articles on lead‐free solders in this journal and other journals. At the latest Surface Mount International conference, several papers were presented on lead‐free solder alloys, conductive adhesives and organic preservatives, all in search of replacements for lead‐containing finishes. The efforts to find a replacement for tin/lead are in response to possible legislation banning lead or possible taxation on the use of lead. In an attempt to reduce the use of lead in this company's assembly operation, five lead‐free solder pastes and four corresponding flux vehicles (for A, B, C and E pastes) were evaluated. All of the flux vehicles passed the standard industry tests except for two flux vehicles (pastes B and C) that failed the copper mirror test. An assembly trial of the lead‐free pastes was carried out by building liquid crystal display panels with minimal process modification. Printability, process compatibility and solder joint reliability were assessed. This paper describes the preliminary results of the authors' investigation.

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Soldering & Surface Mount Technology, vol. 7 no. 2
Type: Research Article
ISSN: 0954-0911

Abstract

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Circuit World, vol. 32 no. 3
Type: Research Article
ISSN: 0305-6120

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Content available
Article
Publication date: 1 December 2004

68

Abstract

Details

Soldering & Surface Mount Technology, vol. 16 no. 3
Type: Research Article
ISSN: 0954-0911

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Content available
Article
Publication date: 1 December 1999

33

Abstract

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Soldering & Surface Mount Technology, vol. 11 no. 3
Type: Research Article
ISSN: 0954-0911

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Content available
Article
Publication date: 1 December 1999

24

Abstract

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Soldering & Surface Mount Technology, vol. 11 no. 3
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 1 June 2005

Girish S. Wable, Quyen Chu, Purushothaman Damodaran and Krishnaswami Srihari

Historically, tin‐lead solder has been a commonly used joining material in electronics manufacturing. Environmental and health concerns, due to the leaching of lead from landfills…

Abstract

Purpose

Historically, tin‐lead solder has been a commonly used joining material in electronics manufacturing. Environmental and health concerns, due to the leaching of lead from landfills into ground water, have necessitated legislation that restricts the use of lead in electronics. The transition from tin‐lead solder to a lead‐free solder composition is imminent. Several alternative solder alloys (and their fluxes) have been researched for electronics assembly in the last few years. The objective of this research was to develop a systematic selection process for choosing a “preferred” lead‐free solder paste, based on its print and reflow performance.

Design/methodology/approach

After a detailed study of industry preferences, published experimental data, and recommendations of various industrial consortia, a near eutectic tin‐silver‐copper (SAC) composition was selected as the preferred alloy for evaluation. Commercially available SAC solder pastes with a no‐clean chemistry were extensively investigated in a simulated manufacturing environment. A total of nine SAC pastes from seven manufacturers were evaluated in this investigation. A eutectic Sn/Pb solder paste was used as a baseline for comparison. While selecting the best lead‐free paste, it was noted that the selected paste has to perform as good as, if not better than, the current tin‐lead paste configuration used in electronics manufacturing for a particular application. The quality of the solder pastes was characterized by a series of analytical and assembly process tests consisting of, but not limited to, a printability test, a solder ball test, a slump test, and post reflow characteristics such as the tendency to form voids, self‐centring and wetting ability.

Findings

Each paste was evaluated for desirable and undesirable properties. The pastes were then scored relative to each other in each individual test. An aggregate of individual test scores determined the best paste.

Originality/value

This paper summarizes a systematic approach adopted to evaluate lead‐free solder pastes for extreme reflow profiles expected to be observed in reflow soldering lead‐free boards.

Details

Soldering & Surface Mount Technology, vol. 17 no. 2
Type: Research Article
ISSN: 0954-0911

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Content available
Article
Publication date: 1 April 2000

19

Abstract

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Soldering & Surface Mount Technology, vol. 12 no. 1
Type: Research Article
ISSN: 0954-0911

Keywords

1 – 10 of 179