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Aligning corporate communications through different information sources is a great challenge for marketers, especially those operating in the tourism sector, which has been harshly affected by the recent COVID-19 pandemic. This paper provides a deep analysis of the implementation of seven basic principles of the integrated marketing communications (IMC) paradigm in a crisis situation.

In-depth interviews with tourism and hospitality service providers were conducted in the fourth quarter of 2021 in Croatia, a destination that showed remarkable results in terms of the number of international tourist arrivals during the pandemic.

Most firms successfully transitioned from tactical to strategic IMC implementation. Some problems were reported in the coordination of communication tools and channels. Whereas the use of digital technology was enhanced, database management did not receive sufficient attention. Message clarity represented the greatest challenge, while consumer-centric communication was the most neglected principle. Relationship building was pursued mainly through B2B rather than B2C communication, whereas brand equity development pursued through communication mix mostly focused on increases in awareness, perceived quality and attitudinal loyalty.

This research is qualitative in nature and provides opinions on IMC adoption from the managerial perspective only.

This paper provides guidelines for the successful integration of marketing communications (marcom) in an extremely ambiguous and uncertain environment.

The contribution of this work lies in the proposal of a new refined and expanded theoretical framework of IMC principles and numerous marcom strategies for operating during the COVID-19 pandemic, thus providing relevant implications for academia and industry.

The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.

A four‐factor factorial design with three replications is selected in the experiment. The input variables are the peak temperature, the duration of time above solder liquidus temperature (TAL), solder alloy and thermal shock. The peak temperature has three levels, 12, 22 and 32°C above solder liquidus temperatures (or 230, 240 and 250°C for SAC305 and 195, 205, and 215°C for SnPb). The TAL has two levels, 30 and 90 s. The thermally shocked test vehicles are subjected to air‐to‐air thermal shock conditioning from −40 to 125°C with 30 min dwell times (or 1 h/cycle) for 500 cycles. Samples both from the initial time zero and after thermal shock are cross‐sectioned. The IMC thickness is measured using scanning electron microscopy. Statistical analyses are conducted to compare the difference in IMC thickness growth between SAC305 solder joints and SnPb solder joints, and the difference in IMC thickness growth between after thermal shock and after thermal aging.

The IMC thickness increases with higher reflow peak temperature and longer time above liquidus. The IMC layer of SAC305 soldered joints is statistically significantly thicker than that of SnPb soldered joints when reflowed at comparable peak temperatures above liquidus and the same time above liquidus. Thermal conditioning leads to a smoother and thicker IMC layer. Thermal shock contributes to IMC growth merely through high‐temperature conditioning. The IMC thickness increases in SAC305 soldered joints after thermal shock or thermal aging are generally in agreement with prediction models such as that proposed by Hwang.

It is still unknown which thickness of IMC layer could result in damage to the solder.

The IMC thickness of all samples is below 3 μm for both SnPb and SAC305 solder joints reflowed at the peak temperature ranging from 12 to 32°C above liquidus temperature and at times above liquidus ranging from 30 to 90 s. The IMC thickness is below 4 μm after subjecting to air‐to‐air thermal shock from −40 to 125°C with 30 min dwell time for 500 cycles or thermal aging at 125°C for 250 h.

The paper reports experimental results of IMC thickness at different thermal conditions. The application is useful for understanding the thickness growth of the IMC layer at various thermal conditions.

The purpose of this paper is to investigate the effect of geometric size on intermetallic compound (IMC) growth and elements diffusion of Cu/Sn/Cu solder joint and establish the correlation model between the thickness of the IMC layer and size of the solder joint on the dozens of microns scale.

The sandwich-structured Cu/Sn/Cu solder joints with different gaps between two copper-clad plates (δ) are fabricated using a reflow process. The microstructure and composition of solder joints are observed and analyzed by scanning electron microscopy.

After reflow, the thickness of the IMC and Cu concentration in solder layers increase with the reduction of δ from 50, 40, 30, 20 to 10 μm. During isothermal aging, the thickness of the IMC fails to increase according to the traditional parabolic rule due to changes in Cu concentration. The reduction of δ is the root cause of changes in Cu concentration and the growth rule of the IMC layer. A correlation model between the thickness of the IMC layer and δ is established. It is found that the thickness of the IMC layer is the function of aging time and δ. With δ reducing, the main control element of IMC growth transfers from Cu to Sn.

This paper shows the changes of IMC thickness and elements concentration with the reduction of the size of solder joints on the dozens of microns scale. A correlation model is established to calculate the thickness of the IMC layer during aging.

The aim of this paper is to investigate the growth behaviours of intermetallic compound (IMC) layers in solid‐liquid interfacial reactions of Sn1.5Cu/Cu in various intensities of high‐magnetic field.

Sn1.5Cu solder was prepared and melted in a vacuum furnace at 873 K and cast into solder bars. Samples were mounted using resin and etched after being carefully polished. Then the IMC layers were observed by using scanning electron microscopy.

The results show that the growth of IMC layers has been accelerated by high‐magnetic field through the comparison of growth kinetics of IMC layers among 0‐2.5 T magnetic filed. IMC grains in high‐magnetic field are much bigger than that in 0 T. By the analyzing of X‐ray diffractometer patterns of IMC layers, it can be found that the orientations of IMC have been changed by magnetic field.

This paper investigates the growth behaviour of IMC layers during the solid‐liquid interfacial reactions of Sn1.5Cu/Cu in a high magnetic field.

The purpose of this paper is to investigate the effect of typical morphologies of Au-Sn IMCs (intermetallic compounds) at the interfaces of solder and pads on shear properties of laser reflowed micro-solder joints.

Sn-2.0Ag-0.75Cu-3.0Bi (SnAgCuBi) solder balls (120 μm in diameter), pads with 0.1, 0.5, 0.9 or 4.0 μm thickness of Au surface finish, and different laser input energies were utilized to fabricate micro-solder joints with Au-Sn IMCs having different typical morphologies. The joints were performed by a shear test through a DAGE bond test system. Fracture surfaces of the joints were analyzed by scanning electron microscopy and energy-dispersive X-ray spectrometry to identify fracture modes and locations.

Morphologies of Au-Sn IMCs would affect shear properties of the joints remarkably. When needle-like AuSn4 IMCs formed at the interfaces of solder and pads, almost entire surfaces presented the manner of ductile fracture. Moreover, shear forces of this kind of solder joints were higher than those of joints without Au-Sn IMCs or with a nearly continuous/continuous Au-Sn IMCs layer. The reason was that the shear performance of the solder joints with needle-like AuSn4 IMCs was enhanced by an interlocking effect between solder and needle-like AuSn4 IMCs. As a nearly continuous or continuous Au-Sn IMCs layer formed, the fracture surfaces presented more character of brittle than ductile fracture. However, if an Au layer still remained under Au-Sn IMCs, the shear performance of the joints would be enhanced.

The results in this study can be used to optimize microstructures and shear properties of laser reflowed micro-solder joints.

The Kirkendall void had been a well-known issue for long-term reliability of semiconductor interconnects; while even the KVs exist at the interfaces of Cu and Sn, it may still be able to pass the condition of unbias long-term reliability testing, especially for 2,000 cycles of temperature cycling test and 2,000 h of high temperature storage. A large number of KVs were observed after 200 cycles of temperature cycling test at the intermetallic Cu₃Sn layer which locate between the intermetallic Cu₆Sn₅ and Cu layers. These kinds of voids will grow proportional with the aging time at the initial stage. This paper aims to compare various IMC thickness as a function of stress test, the Cu₃Sn and Cu₆Sn₅ do affected seriously by heat, but Ni₃Sn₄ is not affected by heat or moisture.

The package is the design in the flip chip-chip scale package with bumping process and assembly. The package was put in reliability stress test that followed AEC-Q100 automotive criteria and recorded the IMC growing morphology.

The Cu₆Sn₅ intermetallic compound is the most sensitive to continuous heat which grows from 3 to 10 µm at high temperature storage 2,000 h testing, and the second is Cu₃Sn IMC. Cu₆Sn₅ IMC will convert to Cu₃Sn IMC at initial stage, and then Kirkendall void will be found at the interface of Cu and Cu₃Sn IMC, which has quality concerning issue if the void’s density grows up. The first phase to form and grow into observable thickness for Ni and lead-free interface is Ni₃Sn₄ IMC, and the thickness has little relationship to the environmental stress, as no IMC thickness variation between TCT, uHAST and HTSL stress test. The more the Sn exists, the thicker Ni₃Sn₄ IMC will be derived from this experimental finding compare the Cu/Ni/SnAg cell and Ni/SnAg cell.

The research found that FCCSP can pass automotive criteria that follow AEC-Q100, which give the confidence for upgrading the package type with higher efficiency and complexities of the pin design.

This result will impact to the future automotive package, how to choose the best package methodology and what is the way to do the package. The authors can understand the tolerance for the kind of flip chip package, and the bump structure is then applied for high-end technology.

The overall three kinds of bump structures, Cu/Ni/SnAg, Cu/SnAg and Ni/SnAg, were taken into consideration, and the IMC growing morphology had been recorded. Also, the IMC had changed during the environmental stress, and KV formation was reserved.

Integrated marketing communications (IMC) is possibly “the richest and most accessible service-learning experience” in the marketing curriculum (Petkus, 2000, p. 68). Yet, despite this recognition, scholars and practitioners continue to lament the pronounced theory-practice gap between how IMC is taught and the practice of it in industry (Schultz and Patti, 2009; Kerr and Kelly, 2017). This research embeds IMC practice within a classroom setting and subsequently explores student marketers' perceptions of their skill development through experiential client-based learning.

An in-depth qualitative study demonstrates the value of integrating experiential learning within an IMC course, captured through students' reflective practice.

Evidence suggests that experiential, client-based projects are suitable for fostering key practice-based skills in the classroom through students “experiencing” IMC at work. However, this is not always easy. In fact, building key skills such as leadership, motivation, communications, organisation and teamwork presents various challenges for students, whilst students appear unaware of other pertinent skills (e.g. persuasion, critical thinking) gained through exposure to “real-world” IMC tasks.

Instructors adopting experiential learning in the marketing classroom have an opportunity to actively design tasks to embed key workplace skills to bridge the theory-practice gap. Client-based projects offer fertile ground for students to experience marketing in action whilst ultimately bolstering their confidence in their workplace skills.

This research contributes to the marketing education literature and acknowledges the importance of embedding key workplace skills into the contemporary marketing curriculum. An overview of challenges and solutions for instructors seeking to adopt experiential learning via client-based projects in the IMC classroom is presented within this research.

The purpose of this study was to examine the influence of adding a small amount of Ti to a Cu-based alloy, specifically the commercial Hyper Titanium Copper alloy (C1990 HP), which contains Cu-3.28 wt.% Ti, on its interfacial reaction with Sn-9.0 wt.% Zn (SnZn) solder, using the liquid/solid reaction couple technique.

The SnZn/C1990 HP couples were subjected to a reaction temperature of 240–270°C for a duration of 0.5–5 h. The resulting reaction couple was characterized using a scanning electron microscope, energy dispersive spectrometer, electron probe microanalyzer and X-ray diffractometer.

It was observed that the scallop-shaped CuZn5 and planar Cu5Zn8 phases were formed in almost all SnZn/C1990 HP couples. With increased reaction duration and temperature, the Cu-rich intermetallic compound (IMC)-Cu5Zn8 phase became a dominant IMC formed at the interface. The total thickness of the IMCs was increased with the increase in the reaction duration and temperature. The IMC growth obeyed the parabolic law, and the IMC growth mechanism was diffusion controlled. The activation energy of the SnZn/C1990 HP couple was 64.71 kJ/mol.

This article presents an analysis of the IMC thickness in each sample using ImageJ software, followed by kinetic analysis using Origin software at various reaction temperatures of SnZn/C1990 HP in liquid/solid couples. The study also includes detailed reports on the morphology, interface composition and X-ray diffraction analysis, as well as the activation energy. The findings can serve as a valuable reference for electronic packaging companies that utilize C1990 HP substrates.

This study reviewed three customer-perceived components of integrated marketing communications (IMCs): consistency, interactivity and connectivity, as predictors of positive customer evaluation (product and retail service satisfaction).

The customer data from 260 surveys were analysed using structural equation modelling (SEM). The data were collected from the emerging economy in the Moscow region (Russia).

The results reported that IMC consistency positively impacts product and service satisfaction. However, the effect of IMC interactivity was only significant in the case of service satisfaction. Meanwhile, IMC connectivity positively influenced only product satisfaction.

The study contributes to the marketing communications theory by defining three components of omnichannel IMC. It also adds to the customer behaviour theory by confirming the diverse nature of product and service evaluation. This study focuses on the retail industry.

This research suggests that three components of IMC should be applied together towards enhancing the customer's positive post-purchase evaluation. Meanwhile, consistency enhances product and service satisfaction, interactive impacts satisfaction with the organization and connectivity with the retail service.

The shift toward omnichannel marketing requires a broader perspective on communication integration. This research reports a novelty result of estimating the separate effect of each component of omnichannel IMC (consistency, interactivity and connectivity) on product and service satisfaction.

Despite many years of academic research into organisational integration and effectiveness, organisations still struggle to successfully implement strategy and achieve competitive advantage. However, the rapid evolution of marketing technologies such as big data, marketing analytics, artificial intelligence and personalised consumer interactions offer potential for an integrated marketing communication technological capability that aligns and integrates an organisation. Programmatic advertising is one such integrated marketing communication (IMC) technology capability, applying and learning from customer information and behaviours to align and integrate organisational activity. The literature on programmatic is embryonic and a conceptual framework that links its potential to organisational effectiveness is timely. This paper aims to develop a framework showing the potential for programmatic advertising as an IMC technology capability to enhance organisational integration and performance.

An exploratory methodology gained insight from 15 depth interviews with senior marketing executives from both organisations and external advertising agencies.

Four elements of a programmatic integrated organisation were identified and aligned with seven marketing activity levers to deliver firm performance measures.

This research contributes to theory, affirming IMC as a capability and positioning programmatic as a means of organisational integration.

The model also offers guidance for practitioners looking to integrate programmatic into their organisation.

To the best of the authors’ knowledge, this is the first paper to look at programmatic from an IMC perspective and as a means of organisational integration. It is also the first to apply Moorman and Day’s (2016) model to explore organisational integration and programmatic, developing a new model, specifically contextualised for programmatic advertising.