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Collaboration in agricultural value chains (AVCs) has the potential to increase smallholders’ participation in international value chains and increase their benefits from participation. This scoping review explores existing collaboration models among stakeholders of AVCs in developing countries, examines enablers and constraints of collaboration and identifies policy gaps.

We systematically searched three databases, CAB Abstracts, Econlit (EBSCO) and Agricola, for studies published between 2005 and 2023 and included 59 relevant studies on AVC collaboration.

The primary motivations for collaboration are to enhance market access and improve product quality. Key outcomes of collaboration include improvements in farmers’ welfare, market participation and increased production; only a few studies consider improved risk management as an important outcome. Robust support from government and non-governmental entities is a primary enabler of collaboration. Conversely, conflicts of interest among stakeholders and resource limitations constrain collaboration possibilities. Collaboration involving high-value crops prioritizes income increases, whereas collaboration involving staple crops focuses on improving household food security.

This study may have publication bias as unsuccessful instances of collaboration are less likely to be published.

This study is unique in highlighting collaboration models’ characteristics and identifying AVC policy and programmatic areas where private firms, farmers’ groups, local governments and donor agencies can contribute.

The purpose of this paper is to investigate the effects of chloride ion concentration and applied bias voltage on the electrochemical migration (ECM) behavior between Cu and Ag under an NaCl thin electrolyte layer (TEL).

A self-made experimental setup for the ECM behavior between Cu and Ag was designed. An HD video measurement microscopy was used to observe the typical dendrite/corrosion morphology and pH distribution. Short-circuit time (SCT), short-circuit current density and the influence of the galvanic effect between Cu and Ag on their ECM behavior were studied by electrochemical tests. The surface morphology and composition of dendrite were characterized by FESEM/EDS.

The SCT increased with increasing NaCl concentration but decreased with increasing applied bias voltage, and the SCT between Cu and Ag was less than that between Cu and Cu because their galvanic effect accelerated the dissolution and migration of Cu. When NaCl concentration was less than or equal to 6 mmol/L, cedar-like dendrite was formed, whereas no dendrite formed and only precipitation occurred at high chloride ion concentration (100 mmol/L). The composition of the dendrite between Cu and Ag was copper.

The significance of this study is to clarify the ECM failure mechanism of printed circuit board (PCB) with an immersion silver surface finish (PCB-ImAg).

This study provides a basic theoretical basis for the selection of protective measures and metal coatings for PCB.

The social implication of this study is to predict the service life of PCB.

The ECM behavior of dissimilar metals under a TEL was investigated, the influence of the galvanic effect between them on their ECM was discussed, and the SCT increased with increasing NaCl concentration.