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Article
Publication date: 1 September 2004

Wei‐Ping Dow and Hsiang‐Hao Chen

Printed circut boards (PCBs) have diminished in size and, simultaneously, their circuit densities have increased. Conventional multi‐layered PCBs have a limitation to…

Abstract

Printed circut boards (PCBs) have diminished in size and, simultaneously, their circuit densities have increased. Conventional multi‐layered PCBs have a limitation to higher packaging densities. This paper introduces a new copper electroplating formula that is able to fill vias and through holes simultaneously and is used in a DC plating method, in which the copper thickness deposited on the board surface is relatively very thin after the electroplating is completed.

Details

Circuit World, vol. 30 no. 3
Type: Research Article
ISSN: 0305-6120

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