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Electric motor heating during biomass recovery and its handling on conveyor is a serious concern for the motor performance. Thus, the purpose of this paper is to design and develop a hardware prototype of master–slave electric motors based biomass conveyor system to use the motors under normal operating conditions without overheating.

The hardware prototype of the system used master–slave electric motors for embedded controller operated robotic arm to automatically replace conveyor motors by one another. A mixed signal based embedded controller (C8051F226DK), fully compliant with IEEE 1149.1 specifications, was used to operate the entire system. A precise temperature measurement of motor with the help of negative temperature coefficient sensor was possible due to the utilization of industry standard temperature controller (N76E003AT20). Also, a pulse width modulation based speed control was achieved for master–slave motors of biomass conveyor.

As compared to conventional energy based mains supply, the system is self-sufficient to extract more energy from solar supply with an energy increase of 11.38%. With respect to conventional energy based \ of 47.31%, solar energy based higher energy saving of 52.69% was reported. Also, the work achieved higher temperature reduction of 34.26% of the motor as compared to previous cooling options.

The proposed technique is free from air, liquid and phase-changing material based cooling materials. As a consequence, the work prevents the wastage of these materials and does not cause the risk of health hazards. Also, the motors are used with their original dimensions without facing any leakage problems.

The purpose of this study is to investigate the thermomechanical condition on the shape memory property of Polybutylene adipate-co-terephthalate (PBAT). PBAT is a widely researched and rapidly developed biodegradable copolyester. In a tensile test, we found that the fractured PBAT samples had a heat-driven shape memory effect which piqued our interest, and it will lay a foundation for the application of PBAT in new fields (such as heat shrinkable film).

The shape memory effect of PBAT and the effect of the thermomechanical condition on its shape memory property were confirmed and systematically investigated by a thermal mechanical analyzer and tensile machine.

The results showed that the PBAT film had broad shape memory transform temperature and exhibited excellent thermomechanical stability and shape memory properties. The shape memory fixity ratio (Rf) of the PBAT films was increased with the prestrain temperature and prestrain, where the highest Rf exceeded 90%. The shape memory recovery ratio (Rr) of the PBAT films was increased with the shape memory recovery temperature and decreased with the prestrain value, and the highest Rr was almost 100%. Moreover, the PBAT films had high shape memory recovery stress which increased with the prestrain value and decreased with the prestrain temperature, and the highest shape memory recovery stress can reach 7.73 MPa.

The results showed that PBAT had a broad shape memory transform temperature, exhibited excellent thermomechanical stability and shape memory performance, especially for the sample programmed at high temperature and had a larger prestrian, which will provide a reference for the design, processing and application of PBAT-based heat shrinkable film and smart materials.

This study confirmed and systematically investigated the shape memory effect of PBAT and the effect of the thermomechanical condition on the shape memory property of PBAT.

Au stud bump bonding technology is an effective means to realize heterogeneous integration of commercial chips in the 2.5D electronic packaging. The purpose of this paper is to study the long-term reliability of the Au stud bump treated by four different high temperature storage times (200°C for 0, 100, 200 and 300 h).

The bonding strength and the fracture behavior are investigated by chip shear test. The experiment is further studied by microstructural characterization approaches such as scanning electron microscope, energy dispersive spectrometer and so on.

It is recognized that there were mainly three typical fracture models during the chip shear test among all the Au stud bump samples treated by high temperature storage. For solder bump before aging, the fracture occurred at the interface between the Cu pad and the Au stud bump. As the aging time increased, the fracture mainly occurred inside the Au stud bump at 200°C for 100 and 200 h. When aging time increased to 300 h, it is found that the fracture transferred to the interface between the Au stud bump and the Al Pad.

In addition, the bonding strength also changed with the high temperature storage time increasing. The bonding strength does not change linearly with the high temperature storage time increasing but decreases first and then increases. The investigation shows that the formation of the intermetallic compounds because of the reaction between the Au and Al atoms plays a key role on the bonding strength and fracture behavior variation.

This study examines the effect of temperature-dependent material models for normal-strength (NSC) and high-strength concrete (HSC) on the thermal analysis of reinforced concrete (RC) walls.

The study performs an one-at-a-time (OAT) sensitivity analysis to assess the impact of variables defining the constitutive and parametric fire models on the wall's thermal response. Moreover, it extends the sensitivity analysis to a variance-based analysis to assess the effect of constitutive model type, fire model type and constitutive model uncertainty on the RC wall's thermal response variance. The study determines the wall’s thermal behaviour reliability considering the different constitutive models and their uncertainty.

It is found that the impact of the variability in concrete’s conductivity is determined by its temperature-dependent model, which differs for NSC and HSC. Therefore, more testing and improving material modelling are needed. Furthermore, the heating rate of the fire scenario is the dominant factor in deciding fire-resistance performance because it is a causal factor for spalling in HSC walls. And finally the reliability of wall's performance decreased sharply for HSC walls due to the expected spalling of the concrete and loss of cross-section integrity.

Limited studies in the current open literature quantified the impact of constitutive models on the behaviour of RC walls. No studies have examined the effect of material models' uncertainty on wall’s response reliability under fire. Furthermore, the study's results contribute to the ongoing attempts to shape performance-based structural fire engineering.

Polyurethane concrete (PUC), as a new type of steel bridge deck paving material, the bond-slip pattern at the interface with the steel plate is not yet clear. In this study, the mechanical properties of the PUC and steel plate interface under the coupled action of temperature, normal force and tangential force were explored through shear tests and numerical simulations. An analytical model for bond-slip at the PUC/steel plate interface and a predictive model for the shear strength of the PUC/steel plate interface were developed.

The new shear test device designed in this paper overcomes the defect that the traditional oblique shear test cannot test the interface shear performance under the condition of fixed normal force. The universal testing machine (UTM) test machine was used to adjust the test temperature conditions. Combined with the results of the bond-slip test, the finite element simulation of the interface is completed by using the COHENSIVE unit to analyze the local stress distribution characteristics of the interface. The use of variance-based uncertainty analysis guaranteed the validity of the simulation.

The shear strength (τ_f) at the PUC-plate interface was negatively correlated with temperature while it was positively correlated with normal stress. The effect of temperature on the shear properties was more significant than that of normal stress. The slip corresponding to the maximum shear (D₁) positively correlates with both temperature and normal stress. The interfacial shear ductility improves with increasing temperature.

Based on the PUC bond-slip measured curves, the relationship between bond stress and slip at different stages was analyzed, and the bond-slip analytical model at different stages was established; the model was defined by key parameters such as elastic ultimate shear stress τ₀, peak stress τ_f and interface fracture energy G_f.

Living walls (LWs), vegetated walls with an integrated growth layer behind, are being increasingly incorporated in buildings. Examining plant characteristics’ comparative impacts on LWs’ energy efficiency-related thermal behavior was aimed, considering that studies on their relative effects are limited. LWs of varying leaf albedo, leaf transmittance and leaf area index (LAI) were studied for Antalya, Turkey for typical days of four seasons.

Dynamic simulations run by Envi-met were used to assess the plant characteristics’ influence on seasonal and orientation-based heat fluxes. After model calibration, a sensitivity analysis was conducted through 112 simulations. The minimum, mean and maximum values were investigated for each plant characteristic. Energy need (regardless of orientation), temperature and heat flux results were compared among different scenarios, including a building without LW, to evaluate energy efficiency and variables’ impacts.

LWs reduced annual energy consumption in Antalya, despite increasing energy needs in winter. South and west facades were particularly advantageous for energy efficiency. The impacts of leaf albedo and transmittance were more significant (44–46%) than LAI (10%) in determining LWs’ effectiveness. The changes in plant characteristics changed the energy needs up to ca 1%.

This study can potentially contribute to generating guiding principles for architects considering LW use in their designs in hot-humid climates.

The plant characteristics’ relative impacts on energy efficiency, which cannot be easily determined by experimental studies, were examined using parametric simulation results regarding three plant characteristics.

The purpose of the present work is to study the impacts of rapid cooling and Tb rare-earth additions on the structural, thermal and mechanical behavior of Bi–0.5Ag lead-free solder for high-temperature applications.

Effect of rapid solidification processing on structural, thermal and mechanical properties of Bi-Ag lead-free solder reinforced Tb rare-earth element.

The obtained results indicated that the microstructure consists of rhombohedral Bi-rich phase and Ag99.5Bi0.5 intermetallic compound (IMC). The addition of Tb could effectively reduce the onset and melting point. The elastic modulus of Tb-containing solders was enhanced to about 90% at 0.5 Tb. The higher elastic modulus may be attributed to solid solution strengthening effect, solubility extension, microstructure refinement and precipitation hardening of uniform distribution Ag99.5Bi0.5 IMC particles which can reasonably modify the microstructure, as well as inhibit the segregation and hinder the motion of dislocations.

It is recommended that the lead-free Bi-0.5Ag-0.5Tb solder be a candidate instead of common solder alloy (Sn-37Pb) for high temperature and high performance applications.

This study aims to provide an alternative adoption to overcome the energy crisis and environmental effluence by comparative theoretical and trial testing analysis of an innovative combined condenser unit over traditional individual condenser unit water heating systems.

The presented innovative new unit of the combined condenser heat pipe works efficiently through its improved idea and unique design, providing uniform heating to improve the heat transfer and, finally, the temperature of water increases without enhancing the cost. In this design, all these five evaporator units were connected with a single combined condenser unit in such a manner that after the condensation of heat transfer fluid vapour, it goes equally into the evaporator pipe.

The maximum temperature of hot water obtained from the combined condenser heating system was 60.6, 55.5 and 50.3°C at a water flow rate of 0.001, 0.002 and 0.003 kg/s, respectively. The first and second law thermodynamic efficiency of the combined condenser heating system were 55.4%, 60.5% and 89.0% and 2.6%, 3.7% and 4.1% at 0.001, 0.002 and 0.003 kg/s of water flow rates, respectively. The combined condenser heat pipe solar evacuated tube heating system promoting progressive performance is considered efficient and environment-friendly compared to the traditional condenser unit water heating system.

Innovative combined condenser heat pipe evacuated tube collector assembly was designed and developed for the study. A comparative theoretical and experimental energy-exergy performance analysis was performed of innovated collective condenser and traditional individual condenser heat pipe water heating system at various mass flow rate.

The purpose of this paper is to understand the effect of basin water depth towards the cumulative distillate yield of the traditional and developed single basin double slope solar still (DSSS).

Modified single basin DSSS integrated with solar operated vacuum fan and external water cooled condenser was fabricated using aluminium material. During sunny season, experimental investigations have been performed in both conventional and modified DSSS at a basin water depth of 3, 6, 9 and 12 cm. Production rate and cumulative distillate yield obtained in traditional and developed DSSS at different water depths were compared and best water depth to attain the maximum productivity and cumulative distillate yield was found out.

Results indicated that both traditional and modified double SS produced maximum yield at the minimum water depth of 3 cm. Cumulative distillate yield of the developed SS was 16.39%, 18.86%, 15.22% and 17.07% higher than traditional at water depths of 3, 6, 9 and 12 cm, respectively. Cumulative distillate yield of the developed SS at 3 cm water depth was 73.17% higher than that of the traditional SS at 12 cm depth.

Performance evaluation of DSSS at various water depths by integrating the combined solar operated Vacuum fan and external Condenser.

This paper aims to investigate the bonding of the photonic integrated circuit (PIC) chip with the heat sink using the AlNi self-propagating soldering method.

Compared to industrial optical modules, optical modules for aerospace applications require better reliability and stability, which is hard to achieve via the dispensing adhesive process that is used for traditional industrial optical modules. In this paper, 25 µm SAC305 solder foils and the AlNi nanofoil heat source were used to bond the back of the PIC chip with the heat sink. The temperature field and temperature history were analyzed by the finite element analysis (FEA) method. The junction-to-case thermal resistance is 0.0353°C/W and reduced by 85% compared with the UV hybrid epoxy joint.

The self-propagating reaction ends within 2.82 ms. The maximum temperature in the PIC operating area during the process is 368.5°C. The maximum heating and cooling rates of the solder were 1.39 × 107°C/s and −5.15 × 106°C/s, respectively. The microstructure of SAC305 under self-propagating reaction heating is more refined than the microstructure of SAC305 under reflow. The porosity of the heat sink-SAC305-PIC chip self-propagating joint is only 4.7%. Several metastable phases appear as AuSn3.4 and AgSn3.

A new bonding technology was used to form the bonding between the PIC chip with the heat sink for the aerospace optical module. The reliability and thermal resistance of the joint are better than that of the UV hybrid epoxy joint.