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This paper aims to study the influence of microparticles on the surface cavitation behavior of 2Cr3WMoV steel; microparticle suspensions of different concentration, particle size, material and shape were prepared based on ultrasonic vibration cavitation experimental device.

2Cr3WMoV steel was taken as the research object for ultrasonic cavitation experiment. The morphology, quantity and distribution of cavitation pits were observed and analyzed by metallographic microscope and scanning electron microscope.

The study findings showed that the surface cavitation process produced pinhole cavitation pits on the surface of 2Cr3WMoV steel. High temperature in the process led to oxidation and carbon precipitation on the material surface, resulting in the “rainbow ring” cavitation morphology. Both the concentration and size of microparticles affected the number of pits on the material surface. When the concentration of microparticles was 1 g/L, the number of pits reached the maximum, and when the size of microparticles was 20 µm, the number of pits reached the minimum. The microparticles of Fe3O4, Al2O3, SiC and SiO2 all increased the number of pits on the surface of 2Cr3WMoV steel. In addition, the distribution of pits of spherical microparticles was more concentrated than that of irregularly shaped microparticles in turbidity.

Most of the current studies have not systematically focused on the effect of each factor of microparticles on the cavitation behavior when they act separately, and the results of the studies are more scattered and varied. At the same time, it has not been found to carry out the study of microparticle cavitation with 2Cr3WMoV steel as the research material, and there is a lack of relevant cavitation morphology and experimental data.

This study aims to explore the feasibility of adding Si₃N₄ nanoparticles to Sn58Bi and provides a theoretical basis for designing and applying new lead-free solder materials for the electronic packaging industry.

In this paper, Sn58Bi-xSi₃N₄ (x = 0, 0.2, 0.4, 0.6, 0.8, 1.0 Wt.%) was prepared for bonding Cu substrate, and the changes in thermal properties, wettability, microstructure, interfacial intermetallic compound and mechanical properties of the composite solder were systematically studied.

The experiment results demonstrate that including Si₃N₄ nanoparticles does not significantly impact the melting point of Sn58Bi solder, and the undercooling degree of solder only fluctuates slightly. The molten solder spreading area reached a maximum of 96.17 mm², raised by 19.41% relative to those without Si₃N₄, and the wetting angle was the smallest at 0.6 Wt.% of Si₃N₄, with a minimum value of 8.35°. When the Si₃N₄ nanoparticles reach 0.6 Wt.%, the solder joint microstructure is significantly refined. Appropriately adding Si₃N₄ nanoparticles will slightly increase the solder alloy hardness. When the concentration of Si₃N₄ reaches 0.6 Wt.%, the joints shear strength reached 45.30 MPa, representing a 49.85% increase compared to those without additives. A thorough examination indicates that legitimately incorporating Si₃N₄ nanoparticles into Sn58Bi solder can enhance its synthetical performance, and 0.6 Wt.% is the best addition amount in our test setting.

In this paper, Si₃N₄ nanoparticles were incorporated into Sn58Bi solder, and the effects of different contents of Si₃N₄ nanoparticles on Sn58Bi solder were investigated from various aspects.

The purpose of this study is to delve into the mechanism of Si3N4 nanowires (NWs) in Sn-based solder, thereby furnishing a theoretical foundation for the expeditious design and practical implementation of innovative lead-free solder materials in the electronic packaging industry.

This study investigates the effect of adding Si₃N₄ NWs to Sn58Bi solder in various mass fractions (0, 0.1, 0.2, 0.4, 0.6 and 0.8 Wt.%) for modifying the solder and joining the Cu substrate. Meanwhile, the melting characteristics and wettability of solder, as well as the microstructure, interfacial intermetallic compound (IMC) and mechanical properties of joint were evaluated.

The crystal plane spacing and lattice constant of Sn and Bi phase increase slightly. A minor variation in the Sn58Bi solder melting point was caused, while it does not impact its functionality. An appropriate Si₃N₄ NWs content (0.2∼0.4 Wt.%) significantly improves its wettability, and modifies the microstructure and interfacial IMC layer. The shear strength increases by up to 10.74% when adding 0.4 Wt.% Si₃N₄ NWs, and the failure mode observed is brittle fracture mainly. However, excessive Si₃N₄ will cause aggregation at the junction between the solder matrix and IMC layer, this will be detrimental to the joint.

The Si₃N₄ NWs were first used for the modification of lead-free solder materials. The relative properties of composite solder and joints were evaluated from different aspects, and the optimal ratio was obtained.

This paper aims to summarise the effects of ZnO nanoparticles (0.1, 0.3, 0.5, 0.7 and 1.0 Wt.%) on the structure, mechanical, electrical and thermal stability of Sn–3.5Ag–0.5Cu (SAC355) solder alloys for high-performance applications.

The phase identification and morphology of the solders were studied using X-ray diffraction and scanning electron microscopy. Thermal parameters were investigated using differential scanning calorimetry. The elastic parameters such as Young's modulus (E) and internal friction (Q⁻¹) were investigated using the dynamic resonance technique, whereas the Vickers hardness (Hv) and creep indentation (n) were examined using a Vickers microhardness tester.

Microstructural analysis revealed that ZnO nanoparticles (NPs) were distributed uniformly throughout the Sn matrix. Furthermore, addition of 0.1, 0.3 and 0.7 Wt.% of ZnO NPs to the eutectic (SAC355) prevented crystallite size reduction, which increased the strength of the solder alloy. Mechanical parameters such as Young's modulus improved significantly at 0.1, 0.3 and 0.7 Wt.% ZnO NP contents compared to the ZnO-free alloy. This variation can be understood by considering the plastic deformation. The Vickers hardness value (Hv) increased to its maximum as the ZnO NP content increased to 0.5. A stress exponent value (n) of approximately two in most composite solder alloys suggested that grain boundary sliding was the dominant mechanism in this system. The electrical resistance (ρ) increased its maximum value at 0.5 Wt.% ZnO NPs content. The addition of ZnO NPs to plain (SAC355) solder alloys increased the melting temperature (T_m) by a few degrees.

Development of eutectic (SAC355) lead-free solder doped with ZnO NPs use for electronic packaging.

Polyethylene terephthalate (PET) as a fiber molding polymer is widely used in aerospace, electrical and electronic, clothing and other fields. The purpose of this study is to improve the thermal insulation performance of polyethylene terephthalate (PET), the SiO₂ aerogel/PET composites slices and fibers were prepared, and the effects of the SiO₂ aerogel on the morphology, structure, crystallization property and thermal conductivity of the SiO₂ aerogel/PET composites slices and their fibers were systematically investigated.

The mass ratio of purified terephthalic acid and ethylene glycol was selected as 1:1.5, which was premixed with Sb₂O₃ and the corresponding mass of SiO₂ aerogel, and SiO₂ aerogel/PET composites were prepared by direct esterification and in-situ polymerization. The SiO₂ aerogel/PET composite fibers were prepared by melt-spinning method.

The results showed that the SiO₂ aerogel was uniformly dispersed in the PET matrix. The thermal insulation coefficient of PET was significantly reduced by the addition of SiO₂ aerogel, and the thermal conductivity of the 1.0 Wt.% SiO₂ aerogel/PET composites was reduced by 75.74 mW/(m · K) compared to the pure PET. The thermal conductivity of the 0.8 Wt.% SiO₂ aerogel/PET composite fiber was reduced by 46.06% compared to the pure PET fiber. The crystallinity and flame-retardant coefficient of the SiO₂ aerogel/PET composite fibers showed an increasing trend with the addition of SiO₂ aerogel.

The SiO₂ aerogel/PET composite slices and their fibers have good thermal insulation properties and exhibit good potential for application in the field of thermal insulation, such as warm clothes. In today’s society where the energy crisis is becoming increasingly serious, improving the thermal insulation performance of PET to reduce energy loss will be of great significance to alleviate the energy crisis.

In this study, SiO₂ aerogel/PET composite slices and their fibers were prepared by an in situ polymerization process, which solved the problem of difficult dispersion of nanoparticles in the matrix and the thermal conductivity of PET significantly reduced.

The purpose of this study was to examine the influence of adding a small amount of Ti to a Cu-based alloy, specifically the commercial Hyper Titanium Copper alloy (C1990 HP), which contains Cu-3.28 wt.% Ti, on its interfacial reaction with Sn-9.0 wt.% Zn (SnZn) solder, using the liquid/solid reaction couple technique.

The SnZn/C1990 HP couples were subjected to a reaction temperature of 240–270°C for a duration of 0.5–5 h. The resulting reaction couple was characterized using a scanning electron microscope, energy dispersive spectrometer, electron probe microanalyzer and X-ray diffractometer.

It was observed that the scallop-shaped CuZn5 and planar Cu5Zn8 phases were formed in almost all SnZn/C1990 HP couples. With increased reaction duration and temperature, the Cu-rich intermetallic compound (IMC)-Cu5Zn8 phase became a dominant IMC formed at the interface. The total thickness of the IMCs was increased with the increase in the reaction duration and temperature. The IMC growth obeyed the parabolic law, and the IMC growth mechanism was diffusion controlled. The activation energy of the SnZn/C1990 HP couple was 64.71 kJ/mol.

This article presents an analysis of the IMC thickness in each sample using ImageJ software, followed by kinetic analysis using Origin software at various reaction temperatures of SnZn/C1990 HP in liquid/solid couples. The study also includes detailed reports on the morphology, interface composition and X-ray diffraction analysis, as well as the activation energy. The findings can serve as a valuable reference for electronic packaging companies that utilize C1990 HP substrates.

The purpose of this study is to model steam condensing flows through steam turbine blades and find the most suitable condensation model to predict the condensation phenomenon.

To find the most suitable condensation model, five nucleation equations and four droplet growth equations are combined, and 20 cases are considered for modelling the wet steam flow through steam turbine blades. Finally, by the comparison between the numerical results and experiments, the most suitable case is proposed. To find out whether the proposed case is also valid for other boundary conditions and geometries, it is used to simulate wet steam flows in de Laval nozzles.

The results indicate that among all the cases, combining the Hale nucleation equation with the Gyarmathy droplet growth equation results in the smallest error in the simulation of wet steam flows through steam turbine blades. Compared with experimental data, the proposed model’s relative error for the static pressure distribution on the blade suction and pressure sides is 2.7% and 2.3%, respectively, and for the liquid droplet radius distribution it totals to 1%. This case is also reliable for simulating condensing steam flows in de Laval nozzles.

The selection of an appropriate condensation model plays a vital role in the simulation of wet steam flows. Considering that the results of numerical studies on condensation models in recent years have not been completely consistent with the experiments and that there are still uncertainties in this field, further studies aiming to improve condensation models are of particular importance. As condensation models play an important role in simulating the condensation phenomenon, this research can help other researchers to better understand the purpose and importance of choosing a suitable condensation model in improving the results. This study is a significant step to improve the existing condensation models and it can help other researchers to gain a revealing insight into choosing an appropriate condensation model for their simulations.

The final properties of ductile iron are decided by the inoculant processing while pouring the melt. The shape and size of nodules generated during solidification are of paramount importance in solidification of ductile cast iron. The purpose of this study is to examine the effect of different inoculant addition on the solidification of ductile cast iron melt through thermal analysis.

Thermal analysis has recently grown as a tool for modeling the solidification behavior of ductile cast irons. Iron properties will be predicted by analyzing the cooling curve patterns of the melts and predicting the related effectiveness of inoculant processing. In this study, thermal analysis is used to evaluate the need for inoculation.

The amount and type of inoculation will affect the amount of undercooling during the solidification of ductile cast iron. It is found that the addition of 0.1 to 0.4 Wt.% inoculant lowers the austenite dendrite formation starting temperature while increasing the eutectic freezing temperature. Microstructure analysis revealed that the addition of inoculation increases the nodule count from 103 to 242 nodules. The beneficial effects of inoculation are sustained by an improved graphitization factor, which shows the formation of graphite nodules in the second phase of the eutectic reaction.

The inoculation treatment has improved metallurgical occurrences such as carbide to graphite conversion, graphite microstructure control, graphite nodule count at the start of solidification and the last stage of solidification, which determines the soundness of casting. The foundry industry can follow these steps for monitoring the solidification of ductile iron castings.

The purpose of this study is to perform comprehensive investigation to assess the mechanical properties of nano-modified ternary cement concrete blend. Nano silica (NS) (1%, 2% and 3%) and waste marble dust powder (MD) (5%, 10% and 15%) was incorporated as a fractional substitution of cement in the concrete matrix.

In this experimental study, 10 cementitious blends were prepared and tested for compressive strength, flexural strength, splitting tensile strength and static modulus of elasticity. The microstructural characteristics of these blends were also explored using a scanning electron microscope along with energy dispersive spectroscopy and X-ray reflection.

The results indicate an enhancement in mechanical properties and refinement in pore structure due to improved pozzolanic activities of NS and the filling effect of MD.

To the best of the authors’ knowledge, no study has reported the mechanical and microstructural behavior of concrete containing marble and NS.

The research aims to investigate the impact of thermo-mechanical aging on SBR under cyclic-loading. By conducting experimental analyses and developing a 3D finite element analysis (FEA) model, it seeks to understand chemical and physical changes during aging processes. This research provides insights into nonlinear mechanical behavior, stress softening and microstructural alterations in SBR compounds, improving material performance and guiding future strategies.

This study combines experimental analyses, including cyclic tensile loading, attenuated total reflection (ATR), spectroscopy and energy-dispersive X-ray spectroscopy (EDS) line scans, to investigate the effects of thermo-mechanical aging (TMA) on carbon-black (CB) reinforced styrene-butadiene rubber (SBR). It employs a 3D FEA model using the Abaqus/Implicit code to comprehend the nonlinear behavior and stress softening response, offering a holistic understanding of aging processes and mechanical behavior under cyclic-loading.

This study reveals significant insights into SBR behavior during thermo-mechanical aging. Findings include surface roughness variations, chemical alterations and microstructural changes. Notably, a partial recovery of stiffness was observed as a function of CB volume fraction. The developed 3D FEA model accurately depicts nonlinear behavior, stress softening and strain fields around CB particles in unstressed states, predicting hysteresis and energy dissipation in aged SBRs.

This research offers novel insights by comprehensively investigating the impact of thermo-mechanical aging on CB-reinforced-SBR. The fusion of experimental techniques with FEA simulations reveals time-dependent mechanical behavior and microstructural changes in SBR materials. The model serves as a valuable tool for predicting material responses under various conditions, advancing the design and engineering of SBR-based products across industries.