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The purpose of this paper is to study the pipe-type electromagnetic induction heating device under power frequency condition.

To reduce eddy current loss and improve heating efficiency, the structure of a pipe-type power-frequency electromagnetic heating device was optimized. Based on the maximum load flow formula, a parallel excitation winding structure is designed, and the distribution of electromagnetic field under four different powers is analyzed by simulation. Four heating modes were proposed according to the structure of diversion ring, inner wall and outer wall. Two heating modes with better heating effect were obtained by comprehensively considering the factors such as magnetic field distribution, thermal power and energy consumption.

The double-wall structure of the pipe-type electromagnetic heating device can make the heat source distribution more uniform, and the use of power-frequency power supply can increase security, the installation of diversion ring can make the heating more sufficient and the heating efficiency of the two heating methods selected according to the structural performance is more than 90%.

In view of the medium or high frequency of pipe-type electromagnetic heating device, it is necessary to configure high power electronic frequency conversion drive system, and eddy current can only be produced on the tube wall, resulting in uneven distribution of heat sources. A pipe-type power-frequency electromagnetic heating device with double-wall structure was proposed.

This study aims to provide information on how to monitor the temperature setting of a heating device in order to implement a heating unit successfully in the smart clothing by observing voluntary heating behavior of wearers.

Subjects wearing base layers and additional clothing were asked to turn on and off the switch when wanted in the cold environmental chamber. Tolerable range of skin temperature (TST) depending on the location of body was obtained by observing the temperature at the time when the heating device was turned on and off during a rest–running–rest protocol.

The TST was 32.8–49.4 °C and decreased to 31.3–37.6 °C around abdomen and back waist, respectively. Changes in the wearers' voluntary control behavior were observed depending on the individual's level of cold-sensitivity and activity level of rest and running. TST was 35.8–49.4 °C (Rest 1: rest before exercise), 40.0–42.0 °C (Running) and 35.3–43.2 °C (Rest 2: rest after exercise) for cold-sensitive group, whereas it was 32.8–36.2 °C (Running) and 34.4–45.7 °C (Rest 2: rest after exercise) for cold-insensitive group.

In this study, results with detailed body locations and wearer's thermal sensitivity provide practical references for the implementation of a heating device to the comfortable multilayered smart clothing.

Wide-bandgap (WBG) semiconductors have emerged as a disruptive technology in the power electronics sphere. This paper aims to analyse and discuss the importance for induction heating systems and gives some examples and highlights some future design trends and perspectives.

The benefits of WBG semiconductors are reviewed with a special emphasis on induction heating applications.

WBG devices enable the design of higher-performance induction heating power supplies. A significant selection of the reported converters is discussed, highlighting the benefits of this technology.

This paper highlights the benefits of WBG semiconductors and their potential to change and improve induction heating technology in the next years.

This is the final part of an abridged version of the previously unpublished writings of Paul Eisler, universally acknowledged as the inventor of the printed circuit board and many other technical innovations. The content of the extracts presented has concentrated mainly on Dr Eisler's efforts in the field of printed circuit technology, followed by a few details of some of his other areas of invention.

The purpose of this paper is to quantify the effects of thermal conductivity (TC), dielectric constant and dissipation factor (DF) of circuit laminates on the temperature rise with active components and RF trace heating.

Temperature rise measurements were made on surface mounted chip resistors (to simulate active components) at various dissipated power levels, with and without “via farms”. The RF heating temperature rise of 50 ohm microstrip transmission lines on 0.5 mm laminates was also measured by the same method.

The chip resistor temperature rise correlated with the independently measured TC of the laminate materials. The use of a “via farm” substantially reduced the temperature rise in all materials, but the higher TC laminates still conferred a measurable advantage. The trace temperature rise due to RF heating correlated with both TC and DF.

It was shown that the one‐dimensional heat transfer model does not accurately calculate the temperature rise due to significant in‐plane heat spreading, particularly with lower TC materials.

This paper details how temperature rise of both active components and 50 ohm transmission lines is affected by the thermal and electrical properties of the circuit laminate.

The transient thermal behaviour, based on a rigorous transient thermodynamic treatment, of a power VDMOS transistor during turn‐off is presented. The time variation of the interior lattice temperature within the device is calculated by self‐consistently solving the fully coupled Poisson's equation and transient electron continuity equation together with the transient heat flow equation. The simulation takes account of temperature dependent heat conduction and capacity and includes thermoelectric currents due to temperature gradient. To make the transient thermal simulation more robust, a new analytical expression for heat capacity is used.

The paper seeks to present a methodology of computer simulation of coupled magneto‐thermo‐mechanical processes in various electrical engineering devices. The methodology allows determining their parameters, characteristics and behaviour in various operation regimes.

The mathematical model consisting of three equations describing magnetic field, temperature field and field of mechanical strains and stresses (or thermoelastic displacements) is solved numerically, partially in the hard‐coupled formulation.

The methodology seems to be sufficiently robust, reliable and applicable to a wide spectrum of devices.

At this stage of research, the hard‐coupled formulation of thermo‐mechanical (or thermoelastic) problems is still possible only in 2D.

The methodology can successfully be used for design of numerous machines, apparatus and devices from the area of low‐frequency electrical engineering ranging from small actuators to large synchronous generators.

Complete numerical analysis of coupled magneto‐thermo‐mechanical phenomena in electrical devices.

Self‐consistent electrothermal simulation of modern semiconductor devices is required for the accurate and efficient design and optimization of many semiconductor devices. The need to perform this type analysis in order to predict the behavior of power devices was realized many years ago. It is now clear that nonisothermal analysis can be very important for VLSI devices as well.

The main objective of the present study is to investigate the effects of various lengths and different locations of the heater on the left sidewall in a square lid‐driven cavity.

The non‐dimensional equations are discretized by the finite‐volume method. The upwind scheme and the central difference scheme are implemented for the convection and the diffusion terms, respectively.

On increasing the Richardson number, the overall heat transfer is increased whether the length and the location of the heater is considered or not. Among the various lengths of the heater considered, the total heat transfer is better only for the length LH=1/3 of the heater if it is extended from top or bottom of the cavity. In the case of location of the heater, the average heat transfer enhances for center location of the heater. Existence of the magnetic field suppresses the convective heat transfer and the fluid flow.

The results can be used in the cooling of electronic devices and heat transfer improvement in heat exchangers.

The numerical results obtained here focus on the detailed investigation of flow and temperature field in a discretely heated lid‐driven square cavity. The findings will be helpful in many applications such as heat exchangers and cooling of electronic devices.

This paper aims to compute demand, consumption and other avoidance saving by replacing existing geysers with split and integrated type air source heat pump (ASHP) water heaters, to prove the potential of both ASHP water heaters in both winter and summer by virtue of their coefficient of performance (COP) during the vapour compression refrigeration cycles and to demonstrate that despite the viability of both split and integrated ASHP system, the latter exhibits a better performance in terms of its COP and achievable savings and load factor.

This research emphasised the use of the data acquisition system housing various temperature sensors, power metres, flow metre, ambient temperature and relative humidity sensor to determine electrical energy consumption and useful thermal energy gained by the hot water in a geyser and storage tanks of residential ASHP water heaters. The load factors, average power and electrical energy consumptions for the 150 L high-pressure geyser, a 150 L split and integrated type ASHP water heaters were evaluated based on the controlled volume (150, 50 and 100 L) of daily hot water drawn off.

The results depicted that the average electrical energy consumed and load factors of the summer months for the geyser, split and integrated type ASHP water heaters were 312.3, 111.7 and 121.1 kWh and 17.9, 10.2 and 16.7 per cent, respectively. Finally, the simple payback period for both the split and integrated type ASHP water heaters were determined to be 3.9 and 5.2 years, respectively. By the application of the Eskom’s projected tariff hikes over the years, the payback periods for the split and integrated ASHP water heaters could be reduced to 3.3 and 4.1 years, respectively.

The experiments were conducted in a controlled outdoor research facility as it was going to be of great challenge in conducting both experiments simultaneously in a specific home. The category of the different types of ASHP water heaters was limited to one due to the cost implication. The experiment was also conducted at a single location, which is not a full representation of all the ambient conditions of the different regions of South Africa.

The experiments were done with a specific controlled volume of hot water drawn off from each of the three hot water heating devices. The experiments was structuring controlled to a specific volume of hot water drawn off and at specific period of the day and hence to not cater for random drawers and intermittent drawn off.

The findings help to assure homeowners that irrespective of the type of ASHP water heaters installed in their residence, they can be guarantee of year-round performance and a favourable payback period provided their hot water consumption is over 200 L per day. Also, although the split type ASHP water heater performed better than the integrated system the cost of installation and maintenance will be higher in a split type in comparison to the integrated type. Finally, by successful implementation of either of the ASHP water heaters the home owner can substantially save of his hot water bill.

The experimental design and methodology is the first of its kind to be conducted in South Africa. The results and interpretation were obtained from original data collected from the set of experiments conducted. Also, the authors are able to show that the introduction of back up element in an ASHP unit to run simultaneously with the vapour compression refrigeration cycles of the ASHP can reduce the COP of the overall system.