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Nowadays, the most important challenge in mechanical engineering, power engineering and electronics is a development of effective cooling systems for heat-generating units. Taking into account this challenge, this study aims to deal with computational investigation of thermogravitational energy transport of pseudoplastic nanoliquid in an electronic chamber with a periodic thermally producing unit placed on the bottom heat-conducting wall of finite thickness under an influence of isothermal cooling from vertical side walls.

The control equations formulated using the Boussinesq approach, Ostwald–de Waele power law and single-phase nanofluid model with experimentally based correlations of Guo et al. for nanofluid dynamic viscosity and Jang and Choi for nanofluid thermal conductivity have been worked out by the in-house computational procedure using the finite difference technique. The impact of the Rayleigh number, nanoadditives concentration, frequency of the periodic heat generation from the local element and thickness of the bottom solid substrate on nanoliquid circulation and energy transport has been studied.

It has been found that a raise of the nanoadditives concentration intensifies the cooling of the heat-generating element, while a growth of the heat-generation frequency allows reducing the amplitude of the heater temperature.

Mathematical modeling of a pseudoplastic nanomaterial thermogravitational energy transport in an electronic cabinet with a periodic thermally generating unit, a heat-conducting substrate and isothermal cooling vertical surfaces to identify the possibility of intensifying heat removal from a heated surface.

Module technology has become the most successful technology for power devices. The sandwich structure of the module serves as both an electrical insulator and heat sink to remove the heat generated in the device. Typical heat fluxes of 200 W/cm2 through the chip substrate interface make it necessary to develop modules with a lower thermal resistance than those available today. With the recent advances in diamond technology, diamond substrates which have unique heat conducting properties are now available. Presented here are the first applications of diamond films in power device modules in combination with a new joining technology. The thermal behaviour of these modules has been simulated. Following the simulations, power device modules with a diamond film were produced. Investigations with a scanning acoustic microscope showed that there is good mechanical contact between the diamond and the adjacent layers. The thermal resistance of the modules was measured. The results are in good agreement with those of the simulations. They show that the application of diamond films in power modules for heat conduction and heat spreading is feasible. It is demonstrated that diamond films together with an advanced joining technology provide a considerable improvement in thermal management compared with state‐of‐the‐art technologies.

The purpose of this paper is to establish a mathematical model to investigate the propagation of waves at an imperfect boundary between heat conducting micropolar elastic solid and fluid media.

Wave propagation and reflection methods have been applied to solve the problem. The expressions for reflection and transmission coefficients are obtained. The corresponding derivation for the normal force stiffness, transverse force stiffness, transverse couple stiffness and perfect bonding has also been included.

A computer program is developed and numerical results are computed to obtain the reflection and transmission coefficients of various reflected waves with incident waves. Some special and particular cases are also discussed.

In this paper, stiffness effect on these amplitude ratios with the angle of incidence has been observed and depicted graphically.

The purpose of this paper is to study using thermoelectric module to harvest the waste heat from spindle units of machine tools and drive wireless sensors stable, thermal structure design and optimization of the thermoelectric module.

In this paper, mesh-free-based method, rather than the standard finite element method, is used to analyze the thermal behavior of the thermoelectric modules with different structure. After that, experiments are done to obtain the real power output performance of those modules and evaluate the performance of driving a wireless sensor with those modules.

The paper provides that the difference in geometry structure can cause apparent change in surface temperature of heat-conducting plate, and the optimized thermoelectric module could increase the output voltage by about 7 per cent compared with the one without optimization.

It is found that the structure changing of the thermoelectric module is not the only way to increase the harvesting power, so a high efficiency power manage system is needed to be studied in the future.

The paper includes implications for the development of self-powered wireless sensors in the spindle unit for machine tool monitoring.

The paper develops models of thermoelectric modules with different structures on a rotating spindle, and tests the performance of driving wireless sensors with those thermoelectric modules.

An important disadvantage of conducting adhesives is their inferior heat conductivity when compared with soft solder such as Sn60Pb40. Thermal simulations, however, show that, by using thinner layers of adhesive than of solder, the module's thermal resistance does not increase greatly. Test modules with four different silver filled epoxy adhesives and tin/lead solder were manufactured. These test modules contained power diodes, 30 A, 1000 V, die bonded onto Ag/Pt thick film conductors on alumina. The die bond adhesive layer thicknesses were typically 30 or 40 μm. For die bond solder layers the thickness was 90 μm. The alumina substrates were connected to 3 mm thick copper plates with filled epoxy or silicone adhesive. The thickness of these layers was 150 μm or 50 μm, respectively. Thermal resistance of the structures was measured. The results showed that good adhesion between joined surfaces is essential for optimised heat flow. The heat conductivity of an adhesive was only a secondary factor affecting the structure's thermal resistance. When the adhesive joint is of good quality, the replacement of solder with conductive adhesives does not increase the module's thermal resistance any more than as shown by the simulations. It should, however, be remembered that the printing of thin (< 20 μm) uniform layers is not always possible.

The purpose of this study is a numerical analysis of transient natural convection in a square partially porous cavity with a heat-generating and heat-conducting element using the local thermal non-equilibrium model under the effect of cooling from the vertical walls. It should be noted that this research deals with a development of passive cooling system for the electronic devices.

The domain of interest is a square cavity with a porous layer and a heat-generating element. The vertical walls of the cavity are kept at constant cooling temperature, while the horizontal walls are adiabatic. The heat-generating solid element is located on the bottom wall. A porous layer is placed under the clear fluid layer. The governing equations, formulated in dimensionless stream function, vorticity and temperature variables with corresponding initial and boundary conditions, are solved using implicit finite difference schemes of the second order accuracy. The governing parameters are the Darcy number, viscosity variation parameter, porous layer height and dimensionless time. The effects of varying these parameters on the average total Nusselt number along the heat source surface, the average temperature of the heater, the fluid flow rate inside the cavity and on the streamlines and isotherms are analyzed.

The results show that in the case of local thermal non-equilibrium the total average Nusselt number is an increasing function of the interphase heat transfer coefficient and the porous layer thickness, while the average heat source temperature decreases with the Darcy number and viscosity variation parameter.

An efficient numerical technique has been developed to solve this problem. The originality of this work is to analyze unsteady natural convection within a partially porous cavity using the local thermal non-equilibrium model in the presence of a local heat-generating solid element. The results would benefit scientists and engineers to become familiar with the analysis of convective heat transfer in enclosures with local heat-generating heaters and porous layers, and the way to predict the heat transfer rate in advanced technical systems, in industrial sectors including transportation, power generation, chemical sectors and electronics.

The purpose of this paper is to assess the reliability of thermoelectric generators after ageing at elevated temperature and to determine the influence of the technology used (i.e. type of thermoelectric material, type of substrate and soldering technology) for thermogenerator (TGE) assembly.

In this paper, the Seebeck coefficient and the current voltage were measured for lead telluride doped with either manganese (PMT), germanium (PGT) or sulfur (PST) TGEs. The Seebeck coefficient measurements were taken at temperatures between 230 and 630 K.

The Seebeck coefficient determined for PMT, PGT and PST TGEs increases approximately linearly with increasing temperature and is greater by about 40 per cent for PST and about 30 per cent for PMT than in commercially available PbTe TGEs. The best outcome in terms of stability after long-term ageing was that of PMT material.

The choice of proper technology (i.e. thermoelectric materials, type of substrate and soldering technology) for the TGE assembly is essential for their functioning overtime and reliability.

A review has been made of the various factors involved in the design and manufacture of bonded heat sinks for printed circuit boards. Among the factors discussed are the design of heat sink thicknesses and the interrelationship with component lead geometry, the design of heat sink geometry as related to the fabrication of the heat sinks and bonding media, and the complexities of the bonding process itself.

A surface‐mount in‐line light emitting diode (LED) array was developed for mounting an LED dot matrix display on a single‐sided insulated metal substrate (IMS). This LED array has heat dissipating cathode leads and an anode lead that works as a jumper wire. Good heat dissipation of the LED array was obtained on an aluminium IMS.

An IC manufacturer's experience with a new technology for connecting bare chips to flexible PCBs is described. The process produces low‐cost fine line flexible PCBs and also direct chip to PCB connection as an integral step in PCB production. The paper is addressed to managers and technologists involved in MCM or bare chip packaging development and fabrication. The technology described was developed by AMEG in conjunction with a number of specialist companies and presents an approach of strategic significance to the industry. IC (integrated circuit) packaging technology is a priority issue, as systems' performance is no longer silicon driven, but is now determined by the interconnection systems used between ICs. This problem is not new, but is rapidly escalating. There is an abundance of technical offerings addressing this question. However, those capable of acceptable performance are distinguished by their high level of both complexity and cost. Of greater consequence is their inability to be effectively implemented in the ‘real world’. One IC house has identified this as a key strategic issue. It accepts that a solution must also make managerial sense, consider the logistics issues, be cost‐effective and enable a practical implementation strategy. The results of this development are the subject of this paper. Despite its divergent development terms of reference, technical performance is not compromised.