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A review has been made of the various factors involved in the design and manufacture of bonded heat sinks for printed circuit boards. Among the factors discussed are the design of heat sink thicknesses and the interrelationship with component lead geometry, the design of heat sink geometry as related to the fabrication of the heat sinks and bonding media, and the complexities of the bonding process itself.

The purpose of the study is to optimise the cross-sectional shape of passively cooled horizontally mounted pin-fin heat sink for higher cooling performance and lower material usage.

Multi-objective shape optimisation technique is used to design the heat sink fins. Non-dominated sorting genetic algorithm (NSGA-II) is combined with a geometric module to develop the shape optimiser. High-fidelity computational fluid dynamics (CFD) is used to evaluate the design objectives. Separate optimisations are carried out to design the shape of bottom row fins and middle row fins of a pin-fin heat sink. Finally, a computational validation was conducted by generating a three-dimensional pin-fin heat sink using optimised fin cross sections and comparing its performance against the circular pin-fin heat sink with the same inter-fin spacing value.

Heat sink with optimised fin cross sections has 1.6% higher cooling effectiveness than circular pin-fin heat sink of same material volume, and has 10.3% higher cooling effectiveness than the pin-fin heat sink of same characteristics fin dimension. The special geometric features of optimised fins that resulted in superior performance are highlighted. Further, Pareto-optimal fronts for this multi-objective optimisation problem are obtained for different fin design scenarios.

For the first time, passively cooled heat sink’s cross-sectional shapes are optimised for different spatial arrangements, using NSGA-II-based shape optimiser, which makes use of CFD solver to evaluate the design objectives. The optimised, high-performance shapes will find direct application to cool power electronic equipment.

The purpose of this paper is to present a way to determine the optimum values of design parameters in a cylindrical heat sink with branched fins. Investigations into the effect of design parameters, such as the number of fins, length of fin, height of fin and outer diameter of the heat sink on heat transfer are reported here. In this analysis, branch angle (α = 10°) is considered.

The Taguchi method, a powerful tool to design optimization, is applied for the tests and standard L9 orthogonal array with three factors, and three levels for each factor are selected. Nine test samples are analyzed in which the total heat transfer rate for each test sample is found. Contribution ratios for each parameter are also found. The results obtained from this analysis are used to find the optimum design parameter values relating to the heat sink performance.

The optimum design parameters are analyzed in this paper. The reliability of the optimum test samples is verified. Also, the variation of the average heat transfer rate of optimum sample is reported when it is compared with the reference sample.

Effective design of a cylindrical heat sink has been reported for cooling light-emitting diode (LED) lights, which have recently attracted the attention of the illumination industry. In this analysis, the contribution ratios have an important role to set out the performance characteristics of a heat sink.

The reliability of the optimum test samples is verified. Also, the variation of the average heat transfer rate of optimum sample is reported when it is compared with the reference sample.

Porous media can provide excellent performance in thermal energy transport applications. This study aims to optimise the square porous slabs (placed in the middle of the channel) parameters to enhance the cooling performance of the jet-impingement microchannel heat sink.

Three levels of each design parameters, i.e. porous slab side, porous slab height, type of material, permeability and quadratic drag factor, are studied; and an L₂₇ orthogonal array is adopted to generate the design points in the specified design space. Optimum designs of the porous media slabs are achieved to minimise the maximum-wall temperature, thermal resistance and pressure drop and maximise the average heat transfer coefficient and figure of merit (FOM).

Results exhibited that the porous media material and permeability are the most, whereas drag factor is the least significant factors with respect to the overall performance of the heat sink. The optimum value of FOM for the proposed hybrid heat sink model belongs to the set of design variables, i.e. 0.4 mm slab side, 0.6 mm slab height, 5 × 10⁻¹¹ m² permeability, 0.21 drag factor and copper as substrate material.

This study proposes a novel design and a hybrid approach to investigate and optimise the hydrothermal performance of jet impingements on porous slabs inserted in the microchannels.

To fabricate and characterise novel heat sinks manufactured by selective laser melting (SLM). The investigation explores features of SLM produced heat sinks that may be exploited to improve their heat transfer capability.

The study was conducted on heat sinks manufactured from 316L stainless steel and aluminium 6061. The heat transfer devices' thermal and pressure drop performances were determined by experimental test.

The research demonstrates the performance enhancements that can be realised by using novel heat sink designs, fabricated by SLM, over conventional pin fin arrays. aluminium 6061 is used with the process to illustrate the improvement in heat transfer provided by higher conductivity feedstock materials.

Although the manufacturing technique is still in the development stage and the heat transfer devices that have so far been manufactured should not be considered optimal, the potential for creative new designs and applications is clear. This study highlights the need to develop the SLM process parameters to allow the repeatable production of heat transfer devices from higher conductivity metals with controllable surface finishes.

This paper outlines the design issues and performance of novel heat transfer devices fabricated using SLM. A new material, aluminium 6061, is introduced to the family of materials that can be processed with SLM and example heat sinks are tested.

The purpose of this paper is to show how, with a view to the shortcomings of traditional optimization methods, a multi‐objective optimization concerning the structure sizes of micro‐channel heat sink is performed by adaptive genetic algorithm. The optimized micro‐channel heat sink is simulated by computational fluid dynamics (CFD) method, and the total thermal resistance is calculated to compare with that of thermal resistance network model.

Taking the thermal resistance and the pressure drop as goal functions, a multi‐objective optimization model was proposed for the micro‐channel cooling heat sink based on the thermal resistance network model. The coupled solution of the flow and heat transfer is considered in the optimization process, and the aim of the procedure is to find the geometry most favorable to simultaneously maximize heat transfer while obtaining a minimum pressure drop. The optimized micro‐channel heat sink was numerically simulated by CFD software.

The results of optimization show that the base convection thermal resistance contributes to maximum the total thermal resistance, and base conduction thermal resistance contributes to least. The width of optimized micro‐channel and fin are 197 and 50 μm, respectively, and the corresponding total thermal resistance of the whole micro‐channel heat sink is 0.838 K/W, which agrees well with the analysis result of thermal resistance network model.

The convection heat transfer coefficient is calculated approximately here for convenience, and that may induce some errors.

The maximum difference in temperature of the optimized micro‐channel cooling heat sink is 84.706 K, which may satisfy the requirement for removal of high heat flux in new‐generation chips. The numerical simulation results are also presented, and the results of numerical simulation show that the optimized micro‐channel heat sink can enhance thermal transfer performance.

This study aims to provide an insight into the relationship between design parameters and thermal performance of plate fin heat sinks (PFHSs) incorporating longitudinal vortex generators (VGs) inside a PFHS channel.

A computational fluid dynamics model of a delta winglet pair VG mounted inside a PFHS geometry is detailed, and the model is validated by comparison with experimental data. The validated model is used to perform a virtual design of experiments study of the heat sink with bottom plate and vertical plate mounted VGs. Data from this study is used to regress a response surface enabling the influence of each of the assessed design variables on thermal performance and flow resistance to be determined.

The results of this study show that the thermal hydraulic performances of a PFHS with bottom plate mounted VG and vertical plate fin mounted VG are, respectively, 1.12 and 1.17 times higher than the baseline PFHS. Further, the performance variation of the heat sink with VG, relative to delta winglet’s arrangement (common flow up and common flow down), trailing edge gap length and Reynolds number were also evaluated and reported.

For the first time, performance characteristics of delta winglet VGs mounted inside the PFHS are evaluated against different design variables and a polynomial regression model is developed. The developed regression model and computed results can be used to design high performance PFHSs mounted with delta winglet VGs.

The purpose of this study is to use an electric field technique to design novel heat sinks capable of rejecting as much heat as possible in a limited space. Configuration of electrodes in this study can be used for increasing the efficiency of heat sinks.

This study investigates a novel electrohydrodynamic (EHD)-based heat sink for thermal management of electronic devices and thermal systems. The significant part of designing an EHD heat sink is the arrangement of the electrodes. A numerical simulation is performed for a heat sink with two parallel plates to determine the optimum dimensional configuration of electrodes. The upper plate of this heat sink is the ground electrode with a constant atmosphere temperature, and the lower plate of it with flush-mounted high-voltage electrodes has uniform heat flux.

The results show that heat transfer changes by the size of the vortices and the number of them. These vortices are emerged by the electric field, and the number of them increases with increasing the number of electrodes. The interaction of vortices size and number leads to having the lowest average temperature in the optimum case by two high voltage electrodes with widths of 7.5 mm and a 17.5 mm gap between them. In comparison with the case without the electric field, with increasing the applied voltage to 30 kV, the efficiency of this EHD heat sink increases up to 37%.

Improvements in electrical equipment make them more compact with higher heat fluxes. Hence, the amount of heat to be dissipated per area increases and needs thermal management to operate at their design temperatures. Therefore, to improve the performance and life span of electronic components and increase their efficiency, it is necessary to design heat sinks to decrease their maximum (peak) temperature.

With development of the modern electronic and mechanical devices, cooling requirement has become a serious challenge. Innovative heat transfer enhancement methods are generally accompanied by undesirable increase of pressure drop and consequently a pumping power penalty. The current study aims to present a novel and easy method to manufacture a mini heat sink using porous fins and magnetite nanofluid (Fe₃O₄/water) as the coolant for simultaneous heat transfer enhancement and pressure drop reduction.

A three-dimensional numerical study is carried out to evaluate the thermal and hydrodynamic performance of the mini heat sink at different volume fractions, porosities and Reynolds numbers, using finite volume method. The solver specifications for discretization of the domain involve the SIMPLE, second-order upwind and second order for pressure, momentum and energy, respectively.

Results show that porous fins have a favorable effect on both heat transfer and pressure drop compared to solid fins. Creation of a virtual velocity slip on the channel-fin interfaces similar to the micro scale conditions and the flow permeation into the porous fins are the main mechanisms of pressure drop reduction. On the other hand, the heat transfer enhancement is attributed to the increase of the solid-fluid contact area and the improvement of the flow mixing because of the flow permeation into the porous fins. An optimal porosity for maximum convective heat transfer enhancement is obtained as a function of Reynolds number. However, taking both pressure drop and heat transfer effects into account, the overall heat sink performance is shown to be improved at high of Reynolds numbers, volume fractions and fin porosities.

Thermal radiation and gravity effects are ignored, and thermal equilibrium is assumed between solid and fluid phases.

A maximum of 32 per cent increase of convective heat transfer is achieved along with a maximum of 33 per cent reduction in the pressure drop using porous fins and ferrofluid in heat sink.

This study investigates the impact of three parameters such as: number of LED chips, pitch and LED power on the junction temperature of LEDs using a best heat sink configuration selected according to a lower temperature. This study provides valuable insights into how to design LED arrays with lower junction temperatures.

To determine the best configuration of a heat sink, a numerical study was conducted in Comsol Multiphysics on 10 different configurations. The configuration with the lowest junction temperature was selected for further analysis. The number of LED chips, pitch and LED power were then varied to determine the optimal configuration for this heat sink. A general equation for the average LED temperature as a function of these three factors was derived using Minitab software.

Among 10 configurations of the rectangular heat sink, we deduce that the best configuration corresponds to the first design having 1 mm of width, 0.5 mm of height and 45 mm of length. The average temperature for this design is 50.5 C. For the power of LED equal to 50 W–200 W, the average temperature of this LED drops when the number of LED chips reduces and the pitch size decreases. Indeed, the best array-LED corresponds to 64 LED chips and a pitch size of 0.5 mm. In addition, a generalization equation for average temperature is determined as a function of the number of LED chips, pitch and power of LED which are key factors for reducing the Junction temperature.

The study is original in its focus on three factors that have not been studied together in previous research. A numerical simulation method is used to investigate the impact of the three factors, which is more accurate and reliable than experimental methods. The study considers a wide range of values for the three factors, which allows for a more comprehensive understanding of their impact. It derives a general equation for the average temperature of the LED, which can be used to design LED arrays with desired junction temperatures.