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This paper aims to cover the recent (2010-2016) techniques for carrying out hardness evaluation on lead-free solders. Details testing configuration/design were compiled and discussed accordingly to each of the measurement techniques: Vickers microhardness, Brinell microhardness and nanoindentation.

A brief introduction on lead-free solders and the concept of hardness testing has been described at the beginning of the review. Equipment setup, capabilities, test configuration and outcomes were presented for each technique and discussed in parallel along with the case studies from selected articles.

Comparison, outcomes and insight regarding each of the methods were highlighted to observe the recent trends, scientific challenges, limitations and probable breakthroughs of the particular hardness testing methods.

The compilation of latest reports, technical setup plus with the critics and perception from the authors are the main key value in this review. This provides an in-depth understanding and guidance for conducting hardness evaluation on lead-free solders.

Briefly discusses the development of touchscreen testing for use in hardness testing for analysis and control.

THE employment of so many types of hardness testing machines, each designed with the object of meeting special requirements, has without doubt given rise to much misunderstanding and some confusion. In order to reach some common understanding of hardness values it has been the practice to prepare tables or curves or provide factors, so that values obtained by one of the various hardness testing methods may be converted to another, or to the generally accepted Brinell value.