Search results

1 – 10 of 120
Article
Publication date: 1 January 1992

H. Nakahara

Driven by the demand for higher density in electronic packaging, each signal plane of printed wiring board must accommodate more conductors. As a result, conductor width is…

Abstract

Driven by the demand for higher density in electronic packaging, each signal plane of printed wiring board must accommodate more conductors. As a result, conductor width is becoming narrower each year. This chapter reviews some of the important steps of forming finer line conductors in printed wiring boards, such as surface preparation, plating/etching, photo‐exposure, automatic optical inspection, etc.

Details

Circuit World, vol. 18 no. 2
Type: Research Article
ISSN: 0305-6120

Article
Publication date: 1 March 1991

K. Minten and J. Toth

Two current full build electroless copper deposits were investigated. This paper demonstrates that there are fundamental differences in the nature of their deposits. The…

Abstract

Two current full build electroless copper deposits were investigated. This paper demonstrates that there are fundamental differences in the nature of their deposits. The consequences of these differences are highlighted for the PWB manufacturer.

Details

Circuit World, vol. 17 no. 4
Type: Research Article
ISSN: 0305-6120

Article
Publication date: 1 February 1987

H. Nakahara

First, a short history of surface mount technology is given, followed by a section describing the current status of surface mount components and the impact of these on printed…

Abstract

First, a short history of surface mount technology is given, followed by a section describing the current status of surface mount components and the impact of these on printed wiring boards. Then, two essential steps of SMT, component mounting and soldering, as practised in Japan, are discussed. The advantage of additive technology for SMT is briefly reviewed.

Details

Circuit World, vol. 13 no. 3
Type: Research Article
ISSN: 0305-6120

Article
Publication date: 1 February 1994

H. Nakahara

The economic growth of Pacific Asian countries in the last three decades is unmatched elsewhere. Financial muscle in Tokyo, Hong Kong and Singapore is comparable to that in New…

Abstract

The economic growth of Pacific Asian countries in the last three decades is unmatched elsewhere. Financial muscle in Tokyo, Hong Kong and Singapore is comparable to that in New York, London and Frankfurt. Electronics has been one of the industries favoured by this region of poor natural resources but rich in well‐trained manpower. Fuelled by desire and strong financial backing, Pacific Asia is now responsible for 70% of the world output of consumer electronic products. Malaysia is becoming a central focus for IC assembly and the manufacture of consumer electronic goods. Singapore is the disc drive manufacturing centre of the world. Taiwan accounts for 10% of the world PC production. Hong Kong may be a model for future China when the British colony is returned to China in June 1997. Korea is becoming a power house in IC memory. Japan is a threat to the United States in every industrial field imaginable. In this paper, the author will examine the status today and in the year 2000 and beyond of Asian electronics with a special emphasis on the Asian PWB industry which already accounts for 45% of the world production. In addition to production and market assessment, technologies and manufacturing costs will be studied in comparison with the rest of the world.

Details

Circuit World, vol. 20 no. 3
Type: Research Article
ISSN: 0305-6120

Article
Publication date: 1 February 1985

H. Nakahara

This paper discusses the future trends of electronic interconnections to produce electronic equipment being manufactured in the Far East. Reviewed are details of simplistic…

Abstract

This paper discusses the future trends of electronic interconnections to produce electronic equipment being manufactured in the Far East. Reviewed are details of simplistic circuits, as well as relatively complex multilayer boards used in new computer technology. The size of the market, techniques for component assembly, and various other aspects of the approach to electronic packaging are discussed.

Details

Circuit World, vol. 11 no. 3
Type: Research Article
ISSN: 0305-6120

Article
Publication date: 1 February 1994

K. Minten, K. Kitchens and J. Cisson

In the preceding three parts of this series, the authors have extensively reviewed and quantified the special processing sequences required for the ‘additive’ and ‘semi‐additive’…

Abstract

In the preceding three parts of this series, the authors have extensively reviewed and quantified the special processing sequences required for the ‘additive’ and ‘semi‐additive’ process strategies of PWB manufacture. In this, the fourth part of the series of five, they wish to present a series of full build processes which meet all the interconnect requirements of the 1990s while eliminating the drawbacks traditionally associated with additive processes.

Details

Circuit World, vol. 20 no. 3
Type: Research Article
ISSN: 0305-6120

Article
Publication date: 1 January 1993

K. Minten and J. Cisson

This, the third in a series of papers, reports an investigation of the semi‐additive process strategies of PWB manufacture. It will show that, although the adoption of a ‘naked’…

Abstract

This, the third in a series of papers, reports an investigation of the semi‐additive process strategies of PWB manufacture. It will show that, although the adoption of a ‘naked’ palladium catalyst is the optimal production strategy in terms of cost, caution must be exercised in its implementation, particularly with regard to material process flow and solder mask type employed. It will be demonstrated that the use of a thin, sacrificial ‘flash’ of electroless copper prior to circuitisation and full build deposition will be required for the liquid photoimageable soldermask (LPISM) approach.

Details

Circuit World, vol. 19 no. 2
Type: Research Article
ISSN: 0305-6120

Article
Publication date: 1 April 1992

The Electronic Industries Association (EIA) has announced the release of EIA‐364–71, Solder Wicking Test Procedure for Electrical Connectors/ Sockets (Wave Solder Technique)…

Abstract

The Electronic Industries Association (EIA) has announced the release of EIA‐364–71, Solder Wicking Test Procedure for Electrical Connectors/ Sockets (Wave Solder Technique), formerly Standards Proposal No. 2185‐A. The object of this test is to determine whether a connector can be wave soldered to a printed wiring board without sustaining damage caused by solder wicking onto the contact surfaces or other areas that might alter its operating characteristics.

Details

Circuit World, vol. 19 no. 1
Type: Research Article
ISSN: 0305-6120

Article
Publication date: 1 February 1990

The fifth in the series of Printed Circuit World Conventions is being held in Glasgow, Scotland, from 12—15 June 1990. It is organised by the UK Printed Circuit World Convention…

Abstract

The fifth in the series of Printed Circuit World Conventions is being held in Glasgow, Scotland, from 12—15 June 1990. It is organised by the UK Printed Circuit World Convention Committee under the direction of the co‐sponsors: EIPC (Europe), IMF (UK), IPC (USA), JPCA (Japan) and PCIF (UK).

Details

Circuit World, vol. 16 no. 3
Type: Research Article
ISSN: 0305-6120

Article
Publication date: 28 February 2023

Megumi Ikeda

In recent years, scholars have questioned the linear relationship between challenge stressors and positive outcomes. Nevertheless, few studies have examined whether challenge…

Abstract

Purpose

In recent years, scholars have questioned the linear relationship between challenge stressors and positive outcomes. Nevertheless, few studies have examined whether challenge stressors and workplace learning outcomes have an inverse U-shaped relationship. Therefore, this study aims to determine whether challenge stressors have an inverse U-shaped relationship with workplace learning outcomes among young Japanese employees.

Design/methodology/approach

Data were collected from 1,257 individuals in two time periods through an internet survey and analyzed using regression analysis.

Findings

The findings suggest that challenge stressors have an inverse U-shaped relationship with workplace learning outcomes.

Practical implications

The relationship between challenge stressors and workplace learning outcomes is positive until a certain point and becomes negative after a certain point. Hence, when promoting learning outcomes among young employees, supervisors should be careful to avoid subjecting employees to very little or excessive amount of challenge stressors.

Originality/value

This study provides evidence supporting the assumption that the relationship between challenge stressors and positive outcomes has an inverted U-shape.

Details

Journal of Workplace Learning, vol. 35 no. 4
Type: Research Article
ISSN: 1366-5626

Keywords

1 – 10 of 120