Following the discussion at our recent Annual General Meeting, a questionnaire was sent out to all members. Almost half of them replied despite the fact that the time allowed for returning the questionnaire had been kept very short. Some members even provided detailed comments.
The traditional methods for process modeling emphasize the process workflow considerations at the cost of the associated process structure and resource communication. In…
The traditional methods for process modeling emphasize the process workflow considerations at the cost of the associated process structure and resource communication. In the real process world, however, all these aspects are integrated and appear simultaneously: the workflows are driven by communication across the structure of resources. The aim of this paper is to explore a new approach based on an innovative, two‐dimensional view of the process world in an enterprise, integrating the workflow, the structure, and the communication from the beginning on.
Contrary to the traditional methods, the workflow diagrams are not directly designed by the process modeler, but rather they are automatically generated from the connectivity of specified resource communication. The modular documentation contains text and graphic information about the entire process world (structure of process resources, structure of process workflows, resource communication and interaction, communication through internal/external interfaces).
A new systematic approach to modular, process‐oriented enterprise description has been developed. Its two‐dimensional model allows an integrated visualization of the entire process world. The resulting process documentation is absolutely consistent and of very high quality. The user‐friendly access to information is made possible by clear interdependencies of process‐defining objects embedded in a relational documentation model. An update of the complete documentation can be performed automatically from the common database. The successful software implementation of the prototype application and its use in small customer projects demonstrate the practical feasibility of the two‐dimensional approach.
The two‐dimensional process modeling (2DPM) is a new systematic approach to modular process‐oriented enterprise description. A software implementation based on the underlying model together with professional programming tools and principles would be necessary to arrive at a marketable product.
A recent meeting involved co‐operation with the organisers of the Canadian High Technology Show and the local Chapter of the SMTA. The programme included an inspiring keynote address by Mr Frank J. Pipp, Xerox Corporation. The topic of the address was ‘Malcolm Baldridge National Quality Control and the Evaluation of Total Quality Control in Xerox Corporation.’
ISHM invites papers for the above Conference, to be held on 29–31 May 1991 in Rotterdam, The Netherlands. Papers should cover areas such as: design, manufacturing, packaging and interconnection, materials and processing, applications, reliability, components, new technologies, marketing and economics, optoelectronics. Summaries should be in English, length 200–300 words. The deadline for receipt of summaries is 30 September 1990. (For full details, see announcement on pp. 54–55.)
‘The Choice between Chip and Wire and High Density Surface Mount Packages (MCM‐X, COB, etc.)’ was the title of the above event. One of a regular series held by ISHM‐France, this technical seminar was attended by over 100 members and non‐members of ISHM who were eager to hear of the latest developments in the field of multichip modules. The eight papers presented are summarised below:
Dates: 29–31 May 1991 Venue: De Doelen Conference Centre, Rotterdam, The Netherlands The Benelux Chapter of the International Society for Hybrid Microelectronics will be organising the 8th European Microelectronics Conference. The event will take place at ‘De Doelen’, Rotterdam, The Netherlands, from 29 to 31 May 1991.
‘Soldering and Cleaning in Electronics’ international conference, including an exposition, took place in Brno on 12–13 October 1993. The conference was organised by…
‘Soldering and Cleaning in Electronics’ international conference, including an exposition, took place in Brno on 12–13 October 1993. The conference was organised by SMT‐Info, together with the ISHM‐Czech and Slovak Chapter. The purpose of this common action was to bring together the professionals in surface mount technology and thick film technology. In the framework of the conference, in which 130 home and foreign delegates participated, the annual meeting of the ISHM‐Czech and Slovak Chapter took place.
The members of the chapter at the annual meeting held on 27 November 1992 in Brno decided not to split after the separation of Czechoslovakia. It was suggested to organise a larger chapter from the Central European States to provide greater co‐operation and better functioning of the smaller chapters. A new name for the chapter was proposed — Central European Chapter (CEC) — to express neutrality and to point out that the chapter is open to other neighbouring chapters and to new members from the states where no national chapter yet exists.