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The purpose of this paper is to illustrate how the numerical solution of the Burgers' equation is obtained using the methods of cubic B‐spline collocation and quadratic B‐spline Galerkin over the geometrically graded mesh.

The spatial domain is partitioned into geometrically graded mesh. The finite element methods are constructed within the Galerkin and collocation methods using an expansion of the quadratic and cubic B‐splines as an approximate function, respectively, over this mesh.

When the higher errors are observed at near boundaries for shock‐like and travelling wave solutions of the Burgers' equation, accuracy of the defined methods increase by using finer mesh at near this boundary.

Over the geometrically graded mesh definitions of the quadratic B‐spline Galerkin and cubic B‐spline collocation are given.

This paper presents an algorithm for automatic generation of graded initial quadrilateral meshes targeted for the finite element analysis of metal‐forming processes. Meshing the domain geometry deals with a universe of shapes, and the procedure therefore takes into account the initial geometry of the billet. A grid‐based approach is utilised for generating an initial coarse mesh with well‐shaped (internal) elements, and in cases where non‐rectangular shapes are to be discretized, linking with the boundary is performed on the basis of constrained Delaunay triangulation. By analysing the contact situation between dies and mesh, an attempt is made to identify regions where plastic deformation is likely to be concentrated during the early stages of processing, and accordingly refinement of the mesh is performed locally by elemental subdivision. Simulation examples for closed‐die forging, forward rod and backward can extrusion substantiate the feasibility of this approach in terms of lowering the overall calculation error and limiting the interference between mesh and die.

Gives a bibliographical review of the finite element meshing and remeshing from the theoretical as well as practical points of view. Topics such as adaptive techniques for meshing and remeshing, parallel processing in the finite element modelling, etc. are also included. The bibliography at the end of this paper contains 1,727 references to papers, conference proceedings and theses/dissertations dealing with presented subjects that were published between 1990 and 2001.

This paper deals with structural shape and thickness optimization of axisymmetric shell structures loaded symmetrically. In the finite element stress analysis use is made of newly developed linear, quadratic, and cubic, variable thickness, C(0) elements based on axisymmetric Mindlin‐Reissner shell theory. An integrated approach is used to carry out the whole shape optimization process in a fully automatic manner. A robust, versatile and flexible mesh generator is incorporated with facilities for generating either uniform or graded meshes, with constant, linear, or cubic variation of thickness, pressure etc. The midsurface geometry and thickness variations of the axisymmetric shell structure are defined using cubic splines passing through certain key points. The design variables are chosen as the coordinates and/or the thickness at the key points. Variable linking procedures are also included. Sensitivity analysis is carried out using either a semi‐analytical method or a global finite difference method. The objective of the optimization is the weight minimization of the structure. Several examples are presented illustrating optimal shapes and thickness distributions for various shells. The changes in the bending, membrane and shear strain energies during the optimization process are also monitored.

Considers the extension of a new class of higher‐order compact methods to nonuniform grids and examines the effect of pollution that arises with differencing the associated metric coefficients. Numerical studies for the standard model convection diffusion equation in 1D and 2D are carried out to validate the convergence behaviour and demonstrate the high‐order accuracy.

This paper aims to show that simple geometry‐based hp‐algorithms using an explicit a posteriori error estimator are efficient in wave propagation computation of complex structures containing geometric singularities.

Four different hp‐algorithms are compared with common h‐ and p‐adaptation in electrostatic and time‐harmonic problems regarding efficiency in number of degrees of freedom and runtime. An explicit a posteriori error estimator in energy norm is used for adaptive algorithms.

Residual‐based error estimation is sufficient to control the adaptation process. A geometry‐based hp‐algorithm produces the smallest number of degrees of freedom and results in shortest runtime. Predicted error algorithms may choose inappropriate kind of refinement method depending on p‐enrichment threshold value. Achieving exponential error convergence is sensitive to the element‐wise decision on h‐refinement or p‐enrichment.

Initial mesh size must be sufficiently small to confine influence of phase lag error.

Information on implementation of hp‐algorithm and use of explicit error estimator in electromagnetic wave propagation is provided.

The paper is a resource for developing efficient finite element software for high‐frequency electromagnetic field computation providing guaranteed error bound.

The lead‐free solder joint reliability of several printed circuit board mounted high‐density packages, when subjected to temperature cycling was investigated by finite element modelling. The packages were a 256‐pin plastic ball grid array (PBGA), a 388‐pin PBGA, and a 1657‐pin ceramic column grid array. Emphasis was placed on the determination of the creep responses (e.g. stress, strain, and strain energy density) of the lead‐free solder joints of these packages.

Gives a bibliographical review of the error estimates and adaptive finite element methods from the theoretical as well as the application point of view. The bibliography at the end contains 2,177 references to papers, conference proceedings and theses/dissertations dealing with the subjects that were published in 1990‐2000.

This paper is intended to be of interest to those involved in electronic applications of the screen printing process, including PCBs, membrane switches, thick film printing and instrument control panels. In recent years there have been a number of advances in screen printing technology which have significantly increased the capabilities and versatility of the process. Developments have included improvements in performance of screen printing machinery, mesh fabrics, stretching equipment, screen frame design, exposure devices, stencil systems and ink rheology and printability. In spite of these advances, there are many applications in PCB production where screen printing is under‐utilised, despite its cost effectiveness for volume board production when compared with dry film resists. This paper outlines some of the developments which have produced the modern screen stencils, and describes the rôle of mesh and stencil in determining the properties of the final printed result.