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In this work, the sensing and actuating elements are designed with interdigitated capacitors away from the sensitive element on which the droplet is placed. This pattern helps to prevent interference of electrical elements with the droplet. Choosing shear resonance mode at this proposed structure minimizes the damping effect of droplet touch by the resonator structure. The glass-based standard fabrication method of the proposed biosensor is presented exactly.

Mechanical resonator sensors are extremely limited because of the high damping factor and the high electrical conductivity in the aqueous environment. In this work, a molecule detector biosensor is proposed for droplet analysis, which is possible to fabricate using micro-electro-mechanical systems (MEMS) technology. By electromechanical coupling of resonators as a mechanical resonator structure, a standing mechanical wave is formed at this structure by electrostatic actuating elements.

In this paper, a mechanical resonator structure as a biosensor is proposed for micro-droplet analysis that can be fabricated by MEMS technology. It is designed at a lower cost fabrication method using electrostatic technology and interdigitated capacitors. The response of the biosensor displacement frequency at the resonance frequency of the desired mode is reasonable for measuring the capacitive changes of its output. The mass sensitivity of the proposed biosensor is in the range of 1 ng, and it has a large sensitive area for capturing target molecules.

To evaluate the quality of the proposed design, the stimulated analysis is conducted by COMSOL and results are presented.

The objective of this paper is to compare and evaluate the environmental performance of steel supply chains considering relevant environmental loss factors using Taguchi loss function (TLF) and design of experiments (DOE).

The different environmental loss factors in steel manufacturing supply chain were studied and the significant factors were identified. Their combined contributions along the significant factors were estimated using TLF and DOEs comparing environment losses at different scenarios.

The proposed methodology using TLF and DOEs was applied to three Indian steel manufacturing companies (Company A, Company B and Company C). The Company A with minimal average environmental loss score is found to be operating its supply chain with higher efficiency and has better environmental performance compared to the other two companies (B and C).

The results obtained are based on the study carried out in three Indian steel manufacturing companies. Therefore, the results cannot be generalized.

This paper will definitely show the direction for comparative environmental performance assessment of manufacturing industries in general and steel industries in specific considering environmental loss factors and environmental conditions. It determines individual performance across each environmental loss factor and their combined impact.

Although there is a need to have comparative performance analysis with respect to environmental losses among steel companies in developing countries such as India, but hardly any study has been reported in this direction. This work will definitely add the value to the supply chain literature in general and environment losses in steel manufacturing supply chain in specific.

This study aims to investigate the factors responsible for substrate cracking reliability problem in through-glass vias (TGVs), which are critical components for glass-based 2.5 D integration.

Numerical models were used to examine the driving force for substrate cracking in glass interposers due to stress coupling during heating. An analytical solution was used to demonstrate how the energy release rate (ERR) for the glass substrate cracking is affected by the via design and the mismatch in thermal strain. Then, the numerical models were implemented to investigate the design factors effects, such as the pitch distance, via diameter, via pattern, via design, effect from a stress buffer layer and the interposer materials selection on the susceptibility to substrate cracking.

ERR for substrate cracking was found to be directly proportional to the via diameter and the thermal mismatch strain. When a via pattern is implemented for high-density integration, a coupling in the stress fields was identified. This coupling effect was found to depend on the pitch distance, the position of the vias, and the via arrangement, suggesting a via pattern-dependent reliability behavior for glass interposers. Changing the design of the via to an annular shape or a substrate-cored via was found to be a promising approach to reduce the susceptibility to substrate cracking compared to a fully filled solid via. Also, the use of a stress buffer layer, an encouraging design prospect presented for the first time for TGVs in this study, was found to significantly reduce cracking. Finally, alternative via and substrate materials showed lower tendency for substrate cracking, indicating that the reliability of glass interposers can be further enhanced with the implementation of such new materials.

This study signifies the first attempt to comprehensively evaluate the susceptibility to crack formation in glass interposers during heating. Therefore, this study provides new perspectives on how to achieve a significant potential reliability improvement for TGVs.

The purpose of this paper is to investigate the behavior of interconnections between solar cells in a glass-free solar modules. As glass weight can be a limitation, it is still interesting to investigate other types of systems, especially when the glass was replaced with a polymeric front sheet. Such systems can be more sensitive for the solar cell interconnection ribbon fatigue.

To examine this effect, the set of glass-based and glass-free modules were prepared using various ribbon thickness and treatment concerning its stretching or curving before lamination. Furthermore, additional reinforcement of the connection between the ribbon and the solar cell was proposed. The prepared modules were exposed to the cyclic temperature variation in the environment chamber. The number of cycles after which the interconnection maintains its conductivity was noted.

Changing the outer layers into more elastic ones requires additional care for the ribbon treatment because interconnections become more sensitive for a system relative displacement. To secure interconnection before fatigue an additional curving of ribbon between solar cells can be introduced whereas the best results were obtained for a system with aluminum plate laminated as an interlayer.

The paper presents a new system of a glass-free solar module based on epoxy-glass fiber composite as a backsheet. The glass front sheet was replaced with an elastic, transparent polymer. Such construction can be used in a system where the glass weight is a limitation. As glass has a structural function in traditional modules and limits fatigues of interconnections the proposed system requires additional ribbon treatment to preserve long module life-span.

The purpose of this paper is to study high-voltage interactions in polymer thick-film resistors, namely, polyvinyl chloride (PVC)-graphite thick-film resistors, and their applications in universal trimming of these resistors.

The authors applied high voltages in the form of pulses and impulses of various pulse durations and with different amplitudes to polymer thick-film resistors and observed the variation of resistance of these resistors with high voltages.

The paper finds that high voltages can be used for trimming of polymer thick-film resistors in both directions, i.e. upwards and downwards.

The research implication of this paper is that polymer thick-film resistors can be trimmed downwards or upwards practically using this method.

The practical implications of this paper is that one can trim the polymer thick-film resistors, namely, PVC–graphite thick-film resistors, in both directions, i.e. upwards and downwards, by using this method.

The value of the paper is in showing that high voltages can be used to trim downwards and also upwards in the case of polymer thick-film resistors. This type of trimming is called universal trimming, developed first time for polymer thick-film resistors.

Looks at pioneering technology that could revolutionize the way that people interact with their media on the move has achieved a major step towards full scale commercialisation

With the building of the world's first commercial scale plant for making semiconductors out of plastic rather than silicon, Plastic Logic will initially produce flexible active‐matrix displays for electronic readers.

Outlines developments made in the ability to read electronic books

The company believes that its “printable” plastic electronics technology has the potential to transform the economics of key segments of the electronics industry.

This paper aims to present combination of poly-jet technology and ink-jet technology in a multidisciplinary way in order to exploit advantages of these rapid prototyping techniques in manufacturing a demonstrator device – a variable interdigital capacitor.

The platform of 3D complex geometry, with optimized design and cavity under the capacitor's fingers (plates), was fabricated using Alaris 3D printer, whereas silver conductive segments were fabricated using Dimatix ink-jet printer and thanks to the mechanical flexibility the platform has been covered using these segments.

When one side of the capacitor's structure changes angular position (in the range from 0 to 90°) with reference to the fixed part, the variation in total capacitance is obtained. The total capacitance decreases (in the range from 20.2 to 1.5 pF) with decrease in effective overlapping area for the variation of angular position from 0 to 90° The maximum measured tuning ratio for the proposed design of the variable capacitor was 13.5:1.

Presented variable capacitor can be used for detection angular position in the range from 0 to 90°.

The new horizon has been opened combining the rapid prototyping equipment in electronics and mechanical engineering in an interdisciplinary way to manufacture, for the first time, variable capacitor using poly-jet and ink-jet technologies. These techniques do not require higher mask counts which makes the fabrication fast and cost-effective.

This work, for the first time, demonstrates the combination of ALARIS 30 3D printer and Dimatix DMP-3000 materials deposition printer in order to fabricate the interdigital capacitor with complex 3D geometry. ALARIS 3D printer has been used for manufacturing plastic platform (with the possibility to precisely adjust angular position of one comb related to another) and Dimatix printer has been used to print silver conductive inks on flexible substrates (Kapton film), and this mechanically flexible structure was used to cover capacitor's fingers on the platform (assembly).

The purpose of this paper is to consider the adequacy of various microstrip filters’ behaviour based on different low-temperature co-fired ceramic (LTCC) dielectrics in the high frequency (HF) area up to 13 GHz.

Low pass, band pass and band stop filters for ultra-wideband radar systems were designed, simulated, fabricated and measured using three various dielectric substrates: Dupont GreenTape 951, Dupont GreenTape 9K7 and Murata LFC.

It is not possible to unambiguously determine the most suitable LTCC dielectric for these filter design because, in general, all designed filters fulfilled requirements (attenuation, cut off frequencies) with minimal divergences, but temperature-stable dielectric and physical properties of Murata LFC make them a promising ceramic for HF application (repeatability of realised experiments).

The novelty of this work lies in unconventional usage of LTCC as material with defined dielectric properties proper for HF applications.

Glass is a promising interposer substrate for 2.5 D integration; yet detailed analysis of the interfacial reliability of through-glass vias (TGVs) has been lacking. The purpose of this paper is to investigate the design and material factors responsible for the interfacial delamination in TGVs and identify methods to improve reliability.

The interfacial reliability of TGVs is studied both analytically and numerically. An analytical solution is presented to show the dependence of the energy release rate (ERR) for interfacial delamination on the via design and the thermal mismatch strain. Then, finite element analysis (FEA) is used to investigate the influence of detailed design and material factors, including the pitch distance, via aspect ratio, via geometry and the glass and via materials, on the susceptibility to interfacial delamination.

ERR for interfacial delamination is directly proportional to the via diameter and the thermal mismatch strain. Thinner wafers with smaller aspect ratios show larger ERRs. Changing the via geometry from a fully filled via to an annular via leads to lower ERR. FEA results also show that certain material combinations have lower thermal mismatch strains, thus less prone to delamination.

The results and approach presented in this paper can guide the design and development of more reliable 2.5 D glass interposers.

This paper represents the first attempt to comprehensively evaluate the impact of design and material selection on the interfacial reliability of TGVs.

The purpose of this paper is to highlight a novel manufacturing process for a biochip with a multi‐electrode array (MEA) that is specifically designed for use in characterising cardio‐active substances and to demonstrate a novel proposed solution prototype that has been constructed to meet the needs of end‐users.

Practical problems encountered with conventional MEA biochips are described and a novel biochip design to tackle these problems is presented. The manufacturing approach used to produce the prototypes of that design is described and depicted.

The novel prototype MEA biochips were successfully manufactured using conventional electronics manufacturing approaches. Prototypes demonstrated limited successes in the early stages of testing. Further revisions of the feature geometry are required to implement an alternative MEA biochip that is suitably reliable.

Basic photolithography techniques have been used to construct a base substrate for proof‐of‐principle studies. Increased sophistication in manufacturing stages is required in future iterations of the proposed concept.

This paper introduces a problem encountered by MEA system adopters that requires a suitable solution. The scale up of an electronics manufacturing process‐based solution to the problems described holds much promise for the screening of new chemical entities.