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Article
Publication date: 13 August 2018

Chongxu Liu and Youdong Chen

The glass substrate transfer robot uses flexible arm and fork to transport the glass substrate which will generate vibration. To reduce the settling time and increase…

Abstract

Purpose

The glass substrate transfer robot uses flexible arm and fork to transport the glass substrate which will generate vibration. To reduce the settling time and increase productivity, the authors proposed a vibration suppression method that integrated the continuous input shaping into the S-curve feedrate profiling.

Design/methodology/approach

The quasi-optimal S-curve feedrate profiling is achieved by the robot model. Then the outputs of the S-curve are shaped by the continuous input shaper, which can greatly lower the vibration and shorten the settling time.

Findings

The robot produces vibrations because of the flexibility of the belt system and the forks; the vibration of the robot is especially obvious in the acceleration and deceleration stage and the low-speed operation stage. Because the fork fingers are flexible, vibration at the end of the fork is enlarged.

Originality/value

The effectiveness of the proposed method is verified by the comparative experiments conducted on a glass substrate transfer robot.

Details

Industrial Robot: An International Journal, vol. 45 no. 4
Type: Research Article
ISSN: 0143-991X

Keywords

Article
Publication date: 31 May 2022

Yong Tian, Xiang Yue, Lin Wang and Yan Feng

The paper aims to reduce the low-frequency resonance and residual vibration of the robot during the operation, improve the working accuracy and efficiency. A reduced weight and…

Abstract

Purpose

The paper aims to reduce the low-frequency resonance and residual vibration of the robot during the operation, improve the working accuracy and efficiency. A reduced weight and large load-to-weight ratio can improve the practical application of a collaborative robot. However, flexibility caused by the reduced weight and large load-to-weight ratio leads to low-frequency resonance and residual vibration during the operation of the robot, which reduces the working accuracy and efficiency. The vibrations of the collaborative robot are suppressed using a modified trajectory-planning method.

Design/methodology/approach

A rigid-flexible coupling dynamics model of the collaborative robot is established using the finite element and Lagrange methods, and the vibration equation of the robot is derived. Trajectory planning is performed with the excitation force as the optimization objective, and the trajectory planning method is modified to reduce the vibration of the collaborative robot and ensure the precision of the robot terminal.

Findings

The vibration amplitude is reduced by 80%. The maximum torque amplitude of the joint before the vibration suppression reaches 50 N·m. After vibration suppression, the maximum torque amplitude of the joint is 10 N·m, and the resonance phenomenon is eliminated during the operation process. Consequently, the effectiveness of the modified trajectory planning method is verified, where the vibration and residual vibration in the movement of the collaborative robot are significantly reduced, and the positioning accuracy and working efficiency of the robot are improved.

Originality/value

This method can greatly reduce the vibration and residual vibration of the collaborative robot, improve the positioning accuracy and work efficiency and promote the rapid application and development of collaborative robots in the industrial and service fields.

Details

Industrial Robot: the international journal of robotics research and application, vol. 50 no. 1
Type: Research Article
ISSN: 0143-991X

Keywords

Article
Publication date: 6 January 2012

Yanjie Liu, Meng Xu and Yumei Cao

Wafer transfer robots play a significant role in IC manufacturing industry and the end effector is an important component of the robots. The purpose of this paper is to improve…

Abstract

Purpose

Wafer transfer robots play a significant role in IC manufacturing industry and the end effector is an important component of the robots. The purpose of this paper is to improve transfer efficiency of a wafer transfer robot through study of its end effector, and at the same time to reduce wafer deformation.

Design/methodology/approach

Finite element method is adopted to analyze wafer deformation. For wafer transfer robot working in vacuum, for the first time, the authors apply the research of microfiber arrays inspired by gecko to the design of robot's end effector, and present equations between robot's transit acceleration and parameters of microfiber arrays. Based on these studies, a kind of micro‐array bump is designed and fixed to a structure optimized end effector. For wafer transfer robot working in atmospheric environment, the authors have analyzed the effects of different factors on wafer deformation. The pressure distributions in absorption area and calculation formula of maximal transfer acceleration are put forward. Finally, a new kind of end effector for atmospheric robot is designed according to these studies.

Findings

The experiments results show that transfer efficiency of wafer transfer robot has been significantly improved through application of the research in this paper. Also wafer deformation under absorption force has been controlled.

Practical implications

Through experiments it can be seen that the research in this paper can be used to improve robot transfer ability and decrease wafer deformation in the production environment. Also the studies of end effector lay a solid foundation for further improvement.

Originality/value

This is the first application of the research of gecko‐inspired microfiber arrays to vacuum wafer transfer robot. This paper also carefully analyzes effects of different factors on wafer deformation through finite element method.

Details

Industrial Robot: An International Journal, vol. 39 no. 1
Type: Research Article
ISSN: 0143-991X

Keywords

Content available
Article
Publication date: 1 August 2003

Jon Rigelsford

57

Abstract

Details

Industrial Robot: An International Journal, vol. 30 no. 4
Type: Research Article
ISSN: 0143-991X

Keywords

Article
Publication date: 1 August 2002

Martin Hosek and Timothy Bleigh

Increasing complexity and aggressive throughput performance of precision robotic manipulators for semiconductor and flat‐panel‐display manufacturing applications require…

Abstract

Increasing complexity and aggressive throughput performance of precision robotic manipulators for semiconductor and flat‐panel‐display manufacturing applications require innovative control system architectures and advanced trajectory planning and motion control techniques. Brooks Automation, a global supplier of integrated automation solutions for the semiconductor and flat‐panel‐display manufacturing industries, has developed a number of advances that accelerate technological development in these areas of robot control in an effort to set new industry standards in performance and reliability.

Details

Industrial Robot: An International Journal, vol. 29 no. 4
Type: Research Article
ISSN: 0143-991X

Keywords

Article
Publication date: 20 November 2007

George K. Stylios

Examines the thirteenth published year of the ITCRR. Runs the whole gamut of textile innovation, research and testing, some of which investigates hitherto untouched aspects…

1544

Abstract

Examines the thirteenth published year of the ITCRR. Runs the whole gamut of textile innovation, research and testing, some of which investigates hitherto untouched aspects. Subjects discussed include cotton fabric processing, asbestos substitutes, textile adjuncts to cardiovascular surgery, wet textile processes, hand evaluation, nanotechnology, thermoplastic composites, robotic ironing, protective clothing (agricultural and industrial), ecological aspects of fibre properties – to name but a few! There would appear to be no limit to the future potential for textile applications.

Details

International Journal of Clothing Science and Technology, vol. 19 no. 6
Type: Research Article
ISSN: 0955-6222

Keywords

Article
Publication date: 22 May 2007

Florian Schuessler, Klaus Feldmann and Thomas Bigl

This paper seeks to give an overview on the benefits and challenges of moulded interconnect devices‐technology and the use of flexible printed circuits (FPC) in electronics…

Abstract

Purpose

This paper seeks to give an overview on the benefits and challenges of moulded interconnect devices‐technology and the use of flexible printed circuits (FPC) in electronics production.

Design/methodology/approach

Each process step was adapted to the boundary conditions of manufacturing three‐dimensional substrates and FPC. The substrate materials were examined under the specific requirements of electronics production with a special focus on the thermal stability of the materials and the adhesiveness of the metallization.

Findings

The use of thermoplastics as substrate materials for electronic devices offers high potential but new challenges, e.g. the higher coefficient of thermal expansion of thermoplastics, have to be taken into consideration as well. In most cases, standard machines for surface mount technology can be used with few modifications. Research has shown that even components with very fine pitches can be used successfully on alternative substrate materials.

Research limitations/implications

The paper covers a selection of possible thermoplastic materials that can be used in electronics production. Depending on the requirements of the application and the operating environment other substrate materials open up a large variety of possible solutions.

Originality/value

The paper details the most promising thermoplastic materials for use in electronics production as rigid and FPC. Furthermore, it gives information about manufacturing guidelines for the production of three‐dimensional circuit carriers.

Details

Circuit World, vol. 33 no. 2
Type: Research Article
ISSN: 0305-6120

Keywords

Content available
Article
Publication date: 1 August 1999

90

Abstract

Details

Industrial Robot: An International Journal, vol. 26 no. 6
Type: Research Article
ISSN: 0143-991X

Keywords

Article
Publication date: 1 January 1988

During the last two years the many conferences and congresses involving cybernetics have focused on particular research and development themes. Whether the venue was at Vienna …

Abstract

During the last two years the many conferences and congresses involving cybernetics have focused on particular research and development themes. Whether the venue was at Vienna (The Austrian Society for Cybernetic Studies), at Namur (The Association Internationale de Cybernétique), at Barcelona (The World Association of Cybernetics, Computer Science and System Theory, TAKIS) or in London, where the World Organisation of General Systems and Cybernetics held its Seventh International Congress of Cybernetics and Systems, the profile of the research and development contributions follows a common set of themes. The London Seventh Congress will be reviewed in some detail in Kybernetes and it will be seen that its aims were similar to those voiced at the six previous events in London, Oxford, Bucharest, Amsterdam, Mexico and Paris. The organisers identified these as being the development of the interdisciplinary sciences of cybernetics and systems without spurious accretions and exotic notions. Whatever the aims of the other cybernetics meetings they too form an international forum for the exchange of up‐to‐date information and the enhancement of contacts between scientists. At London the two hundred or so papers accepted for presentation reflected current work in fields ranging from artificial intelligence and automation to medical cybernetics and sociocybernetics.

Details

Kybernetes, vol. 17 no. 1
Type: Research Article
ISSN: 0368-492X

Article
Publication date: 1 April 2005

Jaroslav Mackerle

Ceramic materials and glasses have become important in modern industry as well as in the consumer environment. Heat resistant ceramics are used in the metal forming processes or…

5128

Abstract

Purpose

Ceramic materials and glasses have become important in modern industry as well as in the consumer environment. Heat resistant ceramics are used in the metal forming processes or as welding and brazing fixtures, etc. Ceramic materials are frequently used in industries where a wear and chemical resistance are required criteria (seals, liners, grinding wheels, machining tools, etc.). Electrical, magnetic and optical properties of ceramic materials are important in electrical and electronic industries where these materials are used as sensors and actuators, integrated circuits, piezoelectric transducers, ultrasonic devices, microwave devices, magnetic tapes, and in other applications. A significant amount of literature is available on the finite element modelling (FEM) of ceramics and glass. This paper gives a listing of these published papers and is a continuation of the author's bibliography entitled “Finite element modelling of ceramics and glass” and published in Engineering Computations, Vol. 16, 1999, pp. 510‐71 for the period 1977‐1998.

Design/methodology/approach

The form of the paper is a bibliography. Listed references have been retrieved from the author's database, MAKEBASE. Also Compendex has been checked. The period is 1998‐2004.

Findings

Provides a listing of 1,432 references. The following topics are included: ceramics – material and mechanical properties in general, ceramic coatings and joining problems, ceramic composites, piezoceramics, ceramic tools and machining, material processing simulations, fracture mechanics and damage, applications of ceramic/composites in engineering; glass – material and mechanical properties in general, glass fiber composites, material processing simulations, fracture mechanics and damage, and applications of glasses in engineering.

Originality/value

This paper makes it easy for professionals working with the numerical methods with applications to ceramics and glasses to be up‐to‐date in an effective way.

Details

Engineering Computations, vol. 22 no. 3
Type: Research Article
ISSN: 0264-4401

Keywords

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