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Discusses the demise of the thermeonic valve and the firm establishment of the transistor as the major active component in electronic circuits.

Reports on Productronica ’95 and notes the domination of two main applications: semiconductor wafer processing and printed circuit board production. Focuses on items such as the Spin Etcher for use in wafer etching; improvements in the etch resist removal process; advances in equipment for use in production of printed circuit boards; and methods for dealing with the pollution problem related to printed circuit board production.

Reviews the 28th International Symposium on Automotive Technology and Automation (ISATA), which was in six parts, covering most management and technology relevant areas to the automotive industry. Discusses the various sensor applications for the industry and the betterment of life through them.

Despite many advances during the last decade in both infra‐red sensor and solid state camera technology, until now little headway has been made in the production of cost‐effective semiconductor sensor arrays capable of operating far into the infra‐red. Old ideas, renewed by the capabilities offered by the latest micromachine technology, may change all this. Reviews the problems associated with building such sensor arrays before introducing some interesting new research results.

Discusses the failings of conventional fixturing systems such as jigs and clamps and describes how electrorheological fluids can be used for flexible fixturing and workpiece retention.

Piezoelectric actuators are well established for use in expensive optical equipment. Within the last decade, relatively inexpensive piezoelectric actuators have become established technology in pneumatic switching and the first piezoelectrically driven impactive robot grippers are just starting to emerge. Although this article concentrates largely on the use of piezoelectric actuators for use in robot gripping systems, the potential for applications outside this field is immense.

Describes the benefits of using electroadhesion when handling very delicate, polished and/or coated optical and electro‐optical microcomponents. Electroadhesion is a technique already familiar to those working in the semiconductor industry and is eminently suitable for the handling of microcomponents in air, gas or vacuum.

Looks at the use of infrared sensors, noting that they fall into the two basic groups of quantum and thermal devices. Focuses on quantum devices and their further subdivision into photoconductive and photovoltaic types. Notes that thermal devices also fall into two categories: those relying on the Seebeck effect, and those known as ferroelectrics. Looks at the use of ferroelectric materials in pyrometry. Concludes by noting the advantages of some of the various types of system.