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The complexity of microelectronic circuits, their scale of integration and clock speed requirements have been increasing steadily. All these changes have the effect of increasing the power density of the microcircuits. ICs with a power of several watts and an area of over a square centimetre are quite common. Thus, there is more heat generated per device at die, component and substrate‐attach levels of electronic packaging. In order to maintain reliability of finished products, the junction temperature of the constituent devices must be kept low. It has been demonstrated that thermal management can be one key to lowering the cost and increasing the performance life of microelectronic products. The cost‐effectiveness of lowering device temperature has been demonstrated to be dramatic compared with the cost of thermal management materials. Proper thermal management of advanced microelectronic devices has to be addressed at all levels. One should address the problem from the basic level of die‐attach, through component‐attach, and eventually substrate‐attach to thermal drains. Thermal management is almost invariably coupled with a thermally induced stress problem. The increase in temperature at the device level also means a larger fluctuation of temperature from the ambient. Each cycle of on‐off for the device represents one thermal cycle. Stress‐induced failure due to coefficient of thermal expansion (CTE) mismatch is much more acute for higher power devices. In this paper, the authors address the issue of thermally induced stress on the microelectronic product at all levels of packaging, with major emphasis on component and substrate levels. Various ways and examples of reducing or eliminating this stress, which is a major cause of device failures, will be demonstrated. One of the proven methods is through the use of low Tg epoxies with high thermal stability.

As financial markets move toward increased globalization, it becomes worth considering whether inherent differences in financial markets across different countries will diminish. For two countries more similar than different in terms of geography, location, government and culture, Canada and the USA remain strikingly different in terms of housing finance. Public policy objectives toward housing followed quite different paths over the past 70 years and fundamental differences in banking practices have led to considerably different outcomes in terms of mortgage finance instruments in the two countries. Examines some of the differences in policy and in competitive practices between Canada and the USA in an attempt to illuminate why differences in rates and terms across the two countries still exist. While a part of the difference remains due to legal constraints concerning the finance of the domestic housing sector, focuses on the economics and public policy choices that have led to the observed differences rather than on an analysis of the legal structure.

This chapter is concerned with exploring the various ways in which Pokémon Go complements or challenges family life. The chapter begins by explicating the multisided concept of play and the myriad definitions that surround this term. Having established the various way in which this phenomenon can improve the lives of those who engage in it – physically, emotionally and cognitively – we go on to consider how play has gradually shifted from public spaces and into designated playgrounds, and how this trend corresponds with children concurrently moving away from the streets and into their bedrooms. Following this, we explore the impact digital technologies are having on the practice of parenting, paying particular attention to video games as a significant facet of youth culture that is often associated with a range of negative connotations. Yet, video games are not intrinsically bad. As we outline, research on intergenerational play and joint-media engagement (JME) readily demonstrate the many benefits families can experience when these games are played together. What is missing from this developing body of work is the familial playing of locative games and the extent to which this practice adds contours to our understanding of this field. The chapter is, therefore, driven by the following research questions. First, why and how do families play Pokémon Go? This includes the different roles that family members adopt, alongside motivations for families playing this game, how the playing of this game complements the rhythms of family life and the extent to which this hybrid reality game (HRG) is suited to intergenerational play. Second, what impact does locative familial play have on families, collectively speaking, and regarding individual family members? Here, we are not just interested in whether this game allows families to bond and how this bonding process is experienced, but also whether the familial play of Pokémon Go provides families with any learning opportunities that might facilitate personal growth beyond the game. Third, what worries might parents have about the familial playing of Pokémon Go and to what extent does the locative aspect of this game reshape their apprehensions?

ZAKEL, E., SIMON, J. and SCHULER, S., Verbindungstechnik in der Elektronik, Vol. 2, No. 2, pp. 53–57, June (1990) TAB is an attractive microconnecting technology for chips with a high number of I/Os. The principles of TAB technology and some new developments are presented. These are concerned with the problems of reducing pressure during gang bonding and the absence of the possibility of bumping single chips. The solutions presented are bonding with a liquid gold‐tin cushion for stress compensation and the application of selective electroless plating solutions for the bumping process. The possibilities of making TAB technology available for small and medium‐size companies are pointed out.

An important disadvantage of conducting adhesives is their inferior heat conductivity when compared with soft solder such as Sn60Pb40. Thermal simulations, however, show that, by using thinner layers of adhesive than of solder, the module's thermal resistance does not increase greatly. Test modules with four different silver filled epoxy adhesives and tin/lead solder were manufactured. These test modules contained power diodes, 30 A, 1000 V, die bonded onto Ag/Pt thick film conductors on alumina. The die bond adhesive layer thicknesses were typically 30 or 40 μm. For die bond solder layers the thickness was 90 μm. The alumina substrates were connected to 3 mm thick copper plates with filled epoxy or silicone adhesive. The thickness of these layers was 150 μm or 50 μm, respectively. Thermal resistance of the structures was measured. The results showed that good adhesion between joined surfaces is essential for optimised heat flow. The heat conductivity of an adhesive was only a secondary factor affecting the structure's thermal resistance. When the adhesive joint is of good quality, the replacement of solder with conductive adhesives does not increase the module's thermal resistance any more than as shown by the simulations. It should, however, be remembered that the printing of thin (< 20 μm) uniform layers is not always possible.

Biennial budgeting and appropriations cycles have been a popular idea among many members of Congress for the past twenty years. Despite widespread bipartisan support for biennial budgeting in the 1980s, the first House vote on the subject, in 2000, resulted in a narrow defeat for biennial budgeting. This article analyzes the merits of biennial budgeting and the reasons for its defeat, arguing that during the 1990s biennial budgeting lost its sense of urgency because of the erasure of the federal deficit and became a more partisan issue than it previously had been.

Tape automated bonding (TAB) circuits were joined by hot compression bonding to copper or nickel conductors on glass with two anisotropic electrically conductive adhesives. One of the adhesives had a thermoplastic polystyrene‐polyester matrix which contained easily deforming metal‐coated polymer particles, while the other was a thermosetting bisphenol (A) based epoxy resin filled with nickel particles. The resistance values and the mechanical strengths of the joints were measured before and after the ageing treatments. The thermoplastic adhesive had the lowest resistance values with copper conductors and the joints produced with this adhesive showed increasing strength values during the ageing tests. The joints between the Ni conductors had smaller values of electrical conductivity irrespective of the adhesive used. The SEM/EPMA technique revealed that particles of the thermoplastic adhesive tended to agglomerate. This may cause problems when components with very fine lead pitch are joined, either by short circuiting or leaving some contacts without particles.

The loss of an amount in excess of $100m cash deposit can be disruptive to the operations, definitely the liquidity of the hedge fund. Should a hedge fund liquidity position deteriorate, its compromised solvency could impact its vendors, most notably creditors and prime brokers. Large successful hedge funds do make basic mistakes. Lawyer Marc Dreier committed the criminal act of selling fraudulent promissory notes to hedge funds and others. Mr Drier’s success in selling fraudulent promissory notes was facilitated by his accomplices who posed as fake representatives of legitimate institutions. Drier and team presented bogus “audited financial statements” and forged developer’s signatures, and even went as far as using the unsuspecting institutions’ premises for meetings to meet potential notes buyers to further falsely legitimize the scheme. He had the notes buyers send their payments to his law firm account, to secure the money. His actions cost his victims, who include 13 hedge fund managers, other investors and entities, $400m in addition to his law firm’s employees who also suffered when his law firm was dissolved. For his actions, he was sentenced 20 years in federal prison for investment fraud. This study aims to direct hedge fund investors and other stakeholders to thoroughly vet the compliance function, especially controls on cash disbursements, even if the hedge fund is sizable (in excess of $1bn). Investors and even other stakeholders also should place a greater focus on what is usually overlooked issue; most notably the credit quality and authenticity of short-term investments bought by their hedge funds.

A thorough investigation of a fraud committed by a lawyer against a number of hedge funds. Several important lessons are identified to professionals who conduct due diligence on hedge funds.

The details of the case are very remarkable. This case directs investors’ attention to place greater efforts on certain aspects of operational risk and due diligence on not only hedge funds but also other investment managers. Normally investors conduct operational due diligence on the fund and its operations. Investors also vet fund external parties such as prime brokers, custodians, accountants and fund administrators. Yet, investors normally do not suspect the quality of short-term fund investments. In this case, the short-terms investments were the source of unforeseen yet substantial risk.

Stakeholders in hedge funds need to carefully investigate the issuer of and the quality of short-term investments that a hedge fund invests in. Future research can investigate the association of hedge fund manager failure with a liquidity position of the fund.

Investors must thoroughly the entirety of the fund including short-term securities.

Normally, it is the hedge funds that commit the fraud against investors. In this case, it is the multi-billion hedge funds run by sophisticated fund managers, who are the victims.

The efficient and economical use of natural resources is a big issue. Machine elements with a rolling contact are highly relevant because of their wide application in technical systems and a large production quantity. Innovative hard machining can reduce the friction and increase the fatigue strength of rolling element bearings. The purpose of this study is to focus on the surface properties of such parts.

A new model to predict bearing fatigue life is presented which takes compressive residual stresses in the bearing subsurface area into consideration. The investigated bearings were machined by the processes of hard turning, hard turning with subsequent deep rolling and a combination of hard turning and deep rolling (turn-rolling) in one process step. Changes in the residual stress state during bearing fatigue tests were investigated and the influence of residual stresses on the bearings fatigue life was researched.

Both combinations including the deep rolling process decrease the surface roughness and induce compressive residual stresses. As a result, the L₁₀ fatigue life of roller bearings was increased by the factor of 2.5. Owing to the developed models, this effect can be considered within the design process.

In the context of the research program “Resource efficient Machine Elements (SPP1551),” machining processes of bearings were investigated regarding the bearing fatigue life. By inducing beneficial residual stresses on the bearings’ subsurface area, the fatigue life could be increased. Thus higher resource efficiency was achieved. To increase the productivity, a combination of hard turning and deep rolling was evaluated.