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Complex mixed metallurgy multilayers require a very robust dielectric to withstand shorting or blistering effects, together with high density for long‐term reliability in humid environments. The development and performance of a new multilayer dielectric which meets these needs is presented here. A dielectric frit chemistry has been developed with a view to eliminating short circuits and blistering induced by the proximity of dissimilar metallurgies on multiple refiring. Appropriate filler technology has also been developed to optimise dielectric density, toughness and laser‐trim properties. High density has yielded excellent HBT (High Bias Temperature) and HHBT (High Humidity Bias Test) performance. Data on multilayer circuit bowing are presented which take account of the interaction of conductor frit and the dielectric on firing. Silver conductor is employed in inner layers to optimise conductivity and cost. A new 1:3 PdAg conductor for termination of components and resistors also permits heavy Al wire bonding with good aged performance. 25 µm Au and 37 µm Al wire bonding is facilitated by gold conductor on dielectric. The laser trim characteristics of a new resistor series on dielectric are described. The materials system has been tested in a complex multilayer structure which, with the use of a new silver via fill conductor, resulted in defect‐free circuits with zero yield loss.

The purpose of this paper is to share valuable information about low‐cost microwave circuit research with academic and industrial communities that work, or want to work, in this field.

Screen‐printing technology has been chosen as the fabrication method because of simplicity and low costs. Different materials and printing parameters were tested in four generations of microstrip lines. After obtaining a satisfactory fabrication method, passive microwave components were printed, assembled, characterized and modeled.

Results demonstrated that the proposed low‐cost method allows fabricating low loss microstrip lines (15.63×10⁻³ dB/mm at 10 GHz), filters, inductors, and capacitors that work well up to 12 GHz.

Model accuracy of inductors and capacitors can be improved. The use of more precise calibration and de‐embedding techniques is necessary. More components can be fabricated and modeled to increase the flexibility and applicability of the proposed fabrication method.

The presented information can help limited budget companies and small educational institutions in electronics to fabricate microwave circuits at low costs. This is an excellent approach for students who want to learn how to make microwave frequency measurements and circuits without the need of expensive fabrication equipment and clean rooms.

The step‐by‐step fabrication method described in this paper allows fabricating different microwave components at low costs. The presentation of electrical models for each component completes the design‐fabrication cycle. As this information is gathered in a single source, it makes easier the incursion of new actors in the microwave field.