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This paper aims to present two Anand’s model parameter sets for the multilayer silver–tin (AgSn) transient liquid phase (TLP) foils.

The AgSn TLP test samples are manufactured using pre-defined optimized TLP bonding process parameters. Consequently, tensile and creep tests are conducted at various loading temperatures to generate stress–strain and creep data to accurately determine the elastic properties and two sets of Anand model creep coefficients. The resultant tensile- and creep-based constitutive models are subsequently used in extensive finite element simulations to precisely survey the mechanical response of the AgSn TLP bonds in power electronics due to different thermal loads.

The response of both models is thoroughly addressed in terms of stress–strain relationships, inelastic strain energy densities and equivalent plastic strains. The simulation results revealed that the testing conditions and parameters can significantly influence the values of the fitted Anand coefficients and consequently affect the resultant FEA-computed mechanical response of the TLP bonds. Therefore, this paper suggests that extreme care has to be taken when planning experiments for the estimation of creep parameters of the AgSn TLP joints.

In literature, there is no constitutive modeling data on the AgSn TLP bonds.

The purpose of this study is to understand the meaning of the term well-being as conceptualised by parents, grandparents, principals and teachers in the Irish primary education system.

A hermeneutic phenomenological approach was adopted to understand the nature and meaning of the phenomenon of well-being. Interviews were carried out with 54 principals, teachers, parents and grandparents from a representative sample of primary schools in Ireland. Each participant was asked the same, open, question: “What does well-being mean to you?” Responses were transcribed verbatim and analysed using a combination of the principles of the hermeneutic circle and Braun and Clarke’s framework for thematic analysis.

Three conceptualisations of well-being were identified (1) well-being is about being happy, (2) well-being is about being healthy and safe and (3) well-being is something you “do”.

To the best of our knowledge this paper is the first of its kind to describe how well-being is conceptualised by adults in Irish primary school contexts. In particular it highlights how neoliberal conceptualisations of well-being as a “thing”, a commodity exchanged on assumptions of individualism, moralism and bio-economism, have crept into the education of our youngest citizens.

The purpose of the present work is to study the impacts of rapid cooling and Tb rare-earth additions on the structural, thermal and mechanical behavior of Bi–0.5Ag lead-free solder for high-temperature applications.

Effect of rapid solidification processing on structural, thermal and mechanical properties of Bi-Ag lead-free solder reinforced Tb rare-earth element.

The obtained results indicated that the microstructure consists of rhombohedral Bi-rich phase and Ag99.5Bi0.5 intermetallic compound (IMC). The addition of Tb could effectively reduce the onset and melting point. The elastic modulus of Tb-containing solders was enhanced to about 90% at 0.5 Tb. The higher elastic modulus may be attributed to solid solution strengthening effect, solubility extension, microstructure refinement and precipitation hardening of uniform distribution Ag99.5Bi0.5 IMC particles which can reasonably modify the microstructure, as well as inhibit the segregation and hinder the motion of dislocations.

It is recommended that the lead-free Bi-0.5Ag-0.5Tb solder be a candidate instead of common solder alloy (Sn-37Pb) for high temperature and high performance applications.

This study aims to investigate the reliability issues of microvoid cracks in solder joint packages exposed to thermal cycling fatigue.

The specimens are subjected to JEDEC preconditioning level 1 (85 °C/85%RH/168 h) with five times reflow at 270°C. This is followed by thermal cycling from 0°C to 100°C, per IPC-7351B standards. The specimens' cross-sections are inspected for crack growth and propagation under backscattered scanning electronic microscopy. The decoupled thermomechanical simulation technique is applied to investigate the thermal fatigue behavior. The impacts of crack length on the stress and fatigue behavior of the package are investigated.

Cracks are initiated from the ball grid array corner of the solder joint, propagating through the transverse section of the solder ball. The crack growth increases continuously up to 0.25-mm crack length, then slows down afterward. The J-integral and stress intensity factor (SIF) values at the crack tip decrease with increased crack length. Before 0.15-mm crack length, J-integral and SIF reduce slightly with crack length and are comparatively higher, resulting in a rapid increase in crack mouth opening displacement (CMOD). Beyond 0.25-mm crack length, the values significantly decline, that there is not much possibility of crack growth, resulting in a negligible change in CMOD value. This explains the crack growth arrest obtained after 0.25-mm crack length.

This work's contribution is expected to reduce the additional manufacturing cost and lead time incurred in investigating reliability issues in solder joints.

The work investigates crack propagation mechanisms of microvoid cracks in solder joints exposed to moisture and thermal fatigue, which is still limited in the literature. The parametric variation of the crack length on stress and fatigue characteristics of solder joints, which has never been conducted, is also studied.

This study aims to characterize the mechanical properties of sintered nano-silver under various sintering processes by nano-indentation tests.

Through microstructure observations and characterization, the influences of sintering process on the microstructure evolutions of sintered nano-silver were presented. And, the indentation load, indentation displacement curves of sintered silver under various sintering processes were measured by using nano-indentation test. Based on the nano-indentation test, a reverse analysis of the finite element calculation was used to determine the yielding stress and hardening exponent.

The porosity decreases with the increase of the sintering temperature, while the average particle size of sintered nano-silver increases with the increase of sintering temperature and sintering time. In addition, the porosity reduced from 34.88%, 30.52%, to 25.04% if the ramp rate was decreased from 25°C/min, 15°C/min, to 5°C/min, respectively. The particle size appears more frequently within 1 µm and 2 µm under the lower ramp rate. With reverse analysis, the strain hardening exponent gradually heightened with the increase of temperature, while the yielding stress value decreased significantly with the increase of temperature. When the sintering time increased, the strain hardening exponent increased slightly.

The mechanical properties of sintered nano-silver under different sintering processes are clearly understood.

This paper could provide a novel perspective on understanding the sintering process effects on the mechanical properties of sintered nano-silver.

This paper aims to present the novel stacked machine learning approach (SMLA) to estimate low-cycle fatigue (LCF) life of SAC305 solder across structural parts. Using the finite element simulation (FEM) and continuous damage mechanics (CDM) model, a fatigue life database is built. The stacked machine learning (ML) model's iterative optimization during training enables precise fatigue predictions (2.41% root mean square error [RMSE], R² = 0.975) for diverse structural components. Outliers are found in regression analysis, indicating potential overestimation for thickness transition specimens with extended lifetimes and underestimation for open-hole specimens. Correlations between fatigue life, stress factors, nominal stress and temperature are unveiled, enriching comprehension of LCF, thus enhancing solder behavior predictions.

This paper introduces stacked ML as a novel approach for estimating LCF life of SAC305 solder in various structural parts. It builds a fatigue life database using FEM and CDM model. The stacked ML model iteratively optimizes its structure, yielding accurate fatigue predictions (2.41% RMSE, R² = 0.975). Outliers are observed: overestimation for thickness transition specimens and underestimation for open-hole ones. Correlations between fatigue life, stress factors, nominal stress and temperature enhance predictions, deepening understanding of solder behavior.

The findings of this paper highlight the successful application of the SMLA in accurately estimating the LCF life of SAC305 solder across diverse structural components. The stacked ML model, trained iteratively, demonstrates its effectiveness by producing precise fatigue lifetime predictions with a RMSE of 2.41% and an “R²” value of 0.975. The study also identifies distinct outlier behaviors associated with different structural parts: overestimations for thickness transition specimens with extended fatigue lifetimes and underestimations for open-hole specimens. The research further establishes correlations between fatigue life, stress concentration factors, nominal stress and temperature, enriching the understanding of solder behavior prediction.

The authors confirm the originality of this paper.

The purpose of this chapter is to highlight how universities got into the predicament in which they currently find themselves in, or somewhat planned to be in, in the 2020s. The historical account outlines the purpose of higher education and who it was for throughout the last few centuries, before a more in-depth analysis of the last few decades will highlight how, and why, neoliberal and subsequently managerial aspects of leadership and performance metrics crept into universities before an analysis of the last 5–10 years, including the onset and consequences of COVID, will demonstrate that many ‘COVID recovery plans’ around staff cuts and course reforms were already in place before COVID, but it was COVID that allowed these plans in most cases to be escalated.

The safety and reliability of high-speed trains rely on the structural integrity of their components and the dynamic performance of the entire vehicle system. This paper aims to define and substantiate the assessment of the structural integrity and dynamical integrity of high-speed trains in both theory and practice. The key principles and approaches will be proposed, and their applications to high-speed trains in China will be presented.

First, the structural integrity and dynamical integrity of high-speed trains are defined, and their relationship is introduced. Then, the principles for assessing the structural integrity of structural and dynamical components are presented and practical examples of gearboxes and dampers are provided. Finally, the principles and approaches for assessing the dynamical integrity of high-speed trains are presented and a novel operational assessment method is further presented.

Vehicle system dynamics is the core of the proposed framework that provides the loads and vibrations on train components and the dynamic performance of the entire vehicle system. For assessing the structural integrity of structural components, an open-loop analysis considering both normal and abnormal vehicle conditions is needed. For assessing the structural integrity of dynamical components, a closed-loop analysis involving the influence of wear and degradation on vehicle system dynamics is needed. The analysis of vehicle system dynamics should follow the principles of complete objects, conditions and indices. Numerical, experimental and operational approaches should be combined to achieve effective assessments.

The practical applications demonstrate that assessing the structural integrity and dynamical integrity of high-speed trains can support better control of critical defects, better lifespan management of train components and better maintenance decision-making for high-speed trains.

Among the various applications involving the use of microwave energy, its growing utility within the mining industry is particularly noteworthy. Conventional grinding processes are often overburdened by energy inefficiencies that are directly related to machine wear, pollution and rising project costs. In this work, we numerically investigate the effects of microwave pretreatment through a series of compression tests as a means to help mitigate these energy inefficiencies.

We investigate the effects of microwave pretreatment on various rock samples, as quantified by uniaxial compression tests. In particular, we assign sample heterogeneity based on a Gaussian statistical distribution and invoke a damage model for elemental tensile and compressive stresses based on the maximum tensile stress and the Mohr–Coulomb theories, respectively. We further couple the electromagnetic, thermal and solid displacement relations using finite element modeling.

(1) Increased power intensity during microwave pretreatment results in decreased axial compressive stress. (2) Leveraging statistics to induce variable compressive and tensile strength can greatly facilitate sample heterogeneity and prove necessary for damage modeling. (3) There exists a nonlinear trend to the reduction in smax with increasing power levels, implying an optimum energy output efficiency to create the maximum degradation-power cost relationship.

Previous research in this area has been largely limited to two-dimensional thermo-electric models. The onset of high-performance computing has allowed for the development of high-fidelity, three-dimensional models with coupled equations for electromagnetics, heat transfer and solid mechanics.

The purpose of this paper is to present current state of understanding on jet electrodeposition manufacturing; to compare various experimental parameters and their implication on as deposited features; and to understand the characteristics of jet electrodeposition deposition defects and its preventive procedures through available research articles.

A systematic review has been done based on available research articles focused on jet electrodeposition and its characteristics. The review begins with a brief introduction to micro-electrodeposition and high-speed selective jet electrodeposition (HSSJED). The research and developments on how jet electrochemical manufacturing are clustered with conventional micro-electrodeposition and their developments. Furthermore, this study converges on comparative analysis on HSSJED and recent research trends in high-speed jet electrodeposition of metals, their alloys and composites and presents potential perspectives for the future research direction in the final section.

Edge defect, optimum nozzle height and controlled deposition remain major challenges in electrochemical manufacturing. On-situ deposition can be used as initial structural material for micro and nanoelectronic devices. Integration of ultrasonic, laser and acoustic source to jet electrochemical manufacturing are current trends that are promising enhanced homogeneity, controlled density and porosity with high precision manufacturing.

This paper discusses the key issue associated to high-speed jet electrodeposition process. Emphasis has been given to various electrochemical parameters and their effect on deposition. Pros and cons of variations in electrochemical parameters have been studied by comparing the available reports on experimental investigations. Defects and their preventive measures have also been discussed. This review presented a summary of past achievements and recent advancements in the field of jet electrochemical manufacturing.