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This study aims to comprehensively investigate the mixed-mode fracture behavior and mechanical properties of selective laser sintering (SLS) polyamide 12 (PA12) components, considering different build orientations and layer thicknesses. The primary objectives include the following. Conducting mixed-mode fracture and mechanical analyses on SLS PA12 parts. Investigating the influence of build orientation and layer thickness on the mechanical properties of SLS-printed components. Examining the fracture mechanisms of SLS-produced Arcan fracture and tensile specimens through experimental methods and finite element analyses.

The research used a combination of experimental techniques and numerical analyses. Tensile and Arcan fracture specimens were fabricated using the SLS process with varying build orientations (X, X–Y, Z) and layer thicknesses (0.1 mm, 0.2 mm). Mechanical properties, including tensile strength, modulus of elasticity and critical stress intensity factor, were quantified through experimental testing. Mixed-mode fracture tests were conducted using a specialized fixture, and finite element analyses using the J-integral method were performed to calculate fracture toughness. Scanning electron microscopy (SEM) was used for detailed morphological analysis of fractured surfaces.

The investigation revealed that the highest tensile properties were achieved in samples fabricated horizontally in the X orientation with a layer thickness of 0.1 mm. Additionally, parts manufactured with a layer thickness of 0.2 mm exhibited favorable mixed-mode fracture behavior. The results emphasize the significance of build orientation and layer thickness in influencing mechanical properties and fracture behavior. SEM analysis provided valuable insights into the failure mechanisms of SLS-produced PA12 components.

This study contributes to the field of additive manufacturing by providing a comprehensive analysis of the mixed-mode fracture behavior and mechanical properties of SLS-produced PA12 components. The investigation offers novel insights into the influence of build orientation and layer thickness on the performance of such components. The combination of experimental testing, numerical analyses and SEM morphological observations enhances the understanding of fracture behavior in additive manufacturing processes. The findings contribute to optimizing the design and manufacturing of high-quality PA12 components using SLS technology.

The main purpose of this study was to evaluate the tensile strengths of JIS G3549 super high-strength steel strand wire ropes (1,570 MPa-class high-carbon steels) and wire rope open swaged socket connections at fire and post fire.

Steady-state tests from ambient temperature (20 °C) to 800 °C, transient-state tests under the allowable design tensile force and tensile tests in an ambient temperature environment after heating (heating temperatures of 200–800 °C) were conducted.

The tensile strengths of the wire rope and end-connection specimens at both fire and post fire were obtained. The steel wire rope specimens possessed larger reduction factors than general hot-rolled mild steels (JIS SS400) and high-strength steel bolts (JIS F10T). The end-connection specimens with sufficient socket lengths exhibited ductile fracture of the wire rope part at both fire and post fire; however, those with short socket lengths experienced a pull-out fracture at the socket.

The fundamental and important tensile test results of the super high-strength steel strand wire ropes (1,570 MPa-class high-carbon steels) and wire rope open swaged socket connections were accumulated at fire and post fire, and the fracture modes were clarified. The obtained test results contribute to fire resistance performance-based design of cable steel structures at fire and fire-damage investigations to consider their reusability post fire.

This paper aims to identify the optimal forming angle for the selective laser melting (SLM) process and evaluate the mechanical properties of the SLM-formed GH3536 alloy in the aero-engine field.

Forming the samples with optimized parameters and analyzing the microstructure and properties of the block samples in different forming angles with scanning electron microscope, XRD, etc. so as to analyze and reveal the laws and mechanism of the block samples in different forming angles by SLM.

There are few cracks on the construction surface of SLM formed samples, and the microstructure shows columnar subgrains and cellular subgrains. The segregation of metal elements was not observed in the microstructure. The pattern shows strong texture strength on the (111) crystal plane. In the sample, the tensile strength of 60° sample is the highest, the plasticity of 90° forming sample is the best, the comprehensive property of 45° sample is the best and the fracture mode is plastic fracture. The comprehensive performance of the part is the best under the forming angle of 45°. To ensure the part size, performance and support structure processing, additional dimensions are added to the part structure.

In this paper, how to make samples with different forming angles is described. Combined with the standard of forged GH3536 alloy, the microstructure and properties of the samples are analyzed, and the optimal forming angle is obtained.

The determination of mode-I fracture toughness of brittle structural materials by means of the notched Brazilian disc configuration is studied. Advantage is taken of a recently introduced analytical solution and, also, of data provided by an experimental protocol with notched marble specimens under diametral compression using the loading device suggested by International Society for Rock Mechanics (ISRM) and also the three-dimensional digital image correlation (3D-DIC) technique.

The analytical solution highlighted the role of geometrical factors, like, for example, the width of the notch, which are usually disregarded. The data of the experimental protocol were comparatively considered with those concerning the response of the specific material under uniaxial tensile load.

This combined study provided interesting data concerning some open issues, as it is the exact crack initiation point and the level of the critical load causing crack initiation. It was definitely indicated that the crack initiation point is not a priori known (even for notched specimens) and, also, that the maximum recorded load does not correspond by default to the critical load responsible for the onset of catastrophic macroscopic fracture.

It was suggested that the load considered critical one for the determination of mode-I fracture toughness K_IC is erroneous. At a load equal to about 70% of the maximum one, a process zone is formed (zone of non-reversible phenomena) around the notch's crown, designating termination of the validity of any linear elastic solution used to determine the normalized stress intensity factors (SIFs). Moreover, at a load level equal to about 95% of the macroscopically observed fracture load, crack propagation has already begun. Therefore, the experimental procedure must be monitored with additional equipment, providing an overview of the displacement field developed during loading.

This study provides an analysis of patch repair for cracked aircraft structures. Delamination is a type of damage that affects the patch's behavior. The purpose of this study is to assess the influence of delamination on repair performance.

An analytical and numerical study using the finite element method was conducted for a cracked plate repaired with a patch containing a pre-existing delamination defect. The method for defining the contact pair surfaces and modeling the delamination interaction within the patch interface is specified using the virtual crack closure technique (VCCT) approach.

The efficiency of the repair is measured in terms of the J-integral. The effects of delamination initiation, mechanical loading, crack length and patch stacking sequences are presented. It is noted that in mode I, delamination propagation is only significant at node A. The numerical results are in good agreement with those of the analytical solution found in the literature. It is observed that the patch's behavior is strongly dependent on loading, crack size and stacking sequences in terms of reducing the structure's lifespan, especially in the presence of delamination.

The numerical modeling presented by the VCCT approach is highly valuable for studying delamination evolution. The influence of loading, crack size and stacking sequences on repair performance is discussed in this work.

The “chiralisation” of Euclidean polygonal tessellations is a novel, recent method which has been used to design new auxetic metamaterials with complex topologies and improved geometric versatility over traditional chiral honeycombs. This paper aims to design and manufacture chiral honeycombs representative of four distinct classes of 2D Euclidean tessellations with hexagonal rotational symmetry using fused-deposition additive manufacturing and experimentally analysed the mechanical properties and failure modes of these metamaterials.

Finite Element simulations were also used to study the high-strain compressive performance of these systems under both periodic boundary conditions and realistic, finite conditions. Experimental uniaxial compressive loading tests were applied to additively manufactured prototypes and digital image correlation was used to measure the Poisson’s ratio and analyse the deformation behaviour of these systems.

The results obtained demonstrate that these systems have the ability to exhibit a wide range of Poisson’s ratios (positive, quasi-zero and negative values) and stiffnesses as well as unusual failure modes characterised by a sequential layer-by-layer collapse of specific, non-adjacent ligaments. These findings provide useful insights on the mechanical properties and deformation behaviours of this new class of metamaterials and indicate that these chiral honeycombs could potentially possess anomalous characteristics which are not commonly found in traditional chiral metamaterials based on regular monohedral tilings.

To the best of the authors’ knowledge, the authors have analysed for the first time the high strain behaviour and failure modes of chiral metamaterials based on Euclidean multi-polygonal tessellations.

The purpose of this study is to delve into the mechanism of Si3N4 nanowires (NWs) in Sn-based solder, thereby furnishing a theoretical foundation for the expeditious design and practical implementation of innovative lead-free solder materials in the electronic packaging industry.

This study investigates the effect of adding Si₃N₄ NWs to Sn58Bi solder in various mass fractions (0, 0.1, 0.2, 0.4, 0.6 and 0.8 Wt.%) for modifying the solder and joining the Cu substrate. Meanwhile, the melting characteristics and wettability of solder, as well as the microstructure, interfacial intermetallic compound (IMC) and mechanical properties of joint were evaluated.

The crystal plane spacing and lattice constant of Sn and Bi phase increase slightly. A minor variation in the Sn58Bi solder melting point was caused, while it does not impact its functionality. An appropriate Si₃N₄ NWs content (0.2∼0.4 Wt.%) significantly improves its wettability, and modifies the microstructure and interfacial IMC layer. The shear strength increases by up to 10.74% when adding 0.4 Wt.% Si₃N₄ NWs, and the failure mode observed is brittle fracture mainly. However, excessive Si₃N₄ will cause aggregation at the junction between the solder matrix and IMC layer, this will be detrimental to the joint.

The Si₃N₄ NWs were first used for the modification of lead-free solder materials. The relative properties of composite solder and joints were evaluated from different aspects, and the optimal ratio was obtained.

Au stud bump bonding technology is an effective means to realize heterogeneous integration of commercial chips in the 2.5D electronic packaging. The purpose of this paper is to study the long-term reliability of the Au stud bump treated by four different high temperature storage times (200°C for 0, 100, 200 and 300 h).

The bonding strength and the fracture behavior are investigated by chip shear test. The experiment is further studied by microstructural characterization approaches such as scanning electron microscope, energy dispersive spectrometer and so on.

It is recognized that there were mainly three typical fracture models during the chip shear test among all the Au stud bump samples treated by high temperature storage. For solder bump before aging, the fracture occurred at the interface between the Cu pad and the Au stud bump. As the aging time increased, the fracture mainly occurred inside the Au stud bump at 200°C for 100 and 200 h. When aging time increased to 300 h, it is found that the fracture transferred to the interface between the Au stud bump and the Al Pad.

In addition, the bonding strength also changed with the high temperature storage time increasing. The bonding strength does not change linearly with the high temperature storage time increasing but decreases first and then increases. The investigation shows that the formation of the intermetallic compounds because of the reaction between the Au and Al atoms plays a key role on the bonding strength and fracture behavior variation.

An experimental investigation for developing structure-property correlations of hot-rolled E410 steels with different carbon contents, i.e. 0.04wt.%C and 0.17wt.%C metal active gas (MAG) and cold metal transfer (CMT)-MAG weldments was undertaken.

Mechanical properties and microstructure of MAG and CMT-MAG weldments of two E410 steels with varying content of carbon were compared using standardized mechanical testing procedures, and conventional microscopy.

0.04wt.%C steel had strained ferritic and cementite sub-structures in blocky shape and large dislocation density, while 0.17wt.%C steel consisted of pearlite and polygonal ductile ferrite. This effected yield strength (YS), and microhardness being larger in 0.04wt.%C steel, %elongation being larger in 0.17wt.%C steel. Weldments of both E410 steels obtained with CMT-MAG performed better than MAG in terms of YS, ultimate tensile strength (UTS), %elongation, and toughness. It was due to low heat input of CMT-MAG that resulted in refinement of weld metal, and subzones of heat affected zone (HAZ).

A substantial improvement in YS (∼9%), %elongation (∼38%), and room temperature impact toughness (∼29%) of 0.04wt.%C E410 steel is achieved with CMT-MAG over MAG welding. Almost ∼10, ∼12.5, and ∼16% increment in YS, %elongation, and toughness of 0.17wt.%C E410 steel is observed with CMT-MAG. Relatively low heat input of CMT-MAG leads to development of fine Widmanstätten and acicular ferrite in weld metal and microstructural refinement in HAZ subzones with nearly similar characteristics of base metal.

This study aims to investigate the thermal fracture mechanism of moisture-preconditioned SAC305 ball grid array (BGA) solder joints subjected to multiple reflow and thermal cycling.

The BGA package samples are subjected to JEDEC Level 1 accelerated moisture treatment (85 °C/85%RH/168 h) with five times reflow at 270 °C. This is followed by multiple thermal cycling from 0 °C to 100 °C for 40 min per cycle, per IPC-7351B standards. For fracture investigation, the cross-sections of the samples are examined and analysed using the dye-and-pry technique and backscattered scanning electron microscopy. The packages' microstructures are characterized using an energy-dispersive X-ray spectroscopy approach. Also, the package assembly is investigated using the Darveaux numerical simulation method.

The study found that critical strain density is exhibited at the component pad/solder interface of the solder joint located at the most distant point from the axes of symmetry of the package assembly. The fracture mechanism is a crack fracture formed at the solder's exterior edges and grows across the joint's transverse section. It was established that Au content in the formed intermetallic compound greatly impacts fracture growth in the solder joint interface, with a composition above 5 Wt.% Au regarded as an unsafe level for reliability. The elongation of the crack is aided by the brittle nature of the Au-Sn interface through which the crack propagates. It is inferred that refining the solder matrix elemental compound can strengthen and improve the reliability of solder joints.

Inspection lead time and additional manufacturing expenses spent on investigating reliability issues in BGA solder joints can be reduced using the study's findings on understanding the solder joint fracture mechanism.

Limited studies exist on the thermal fracture mechanism of moisture-preconditioned BGA solder joints exposed to both multiple reflow and thermal cycling. This study applied both numerical and experimental techniques to examine the reliability issue.