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The purpose of this paper is to detail the design and first use of a force transducer device to study the development of forces during the laser-powder bed fusion (L-PBF) process from which residual stresses can be inferred.

The proposed novel device consists of an array of load cells for in-situ measurement of forces over time during the L-PBF additive manufacturing process. Measurements of the developed forces layer by layer were recorded in a first build using a 67-degree rotating scan strategy using Inconel 625 build material.

Preliminary experimental results from in-situ measurements using a 67-degree rotating scan strategy showed that the forces induced in the first five layers represented approximately 80% of the maximum on completion of the build and were distributed such as to induce concave deformation of the part, i.e. tension in the centre and compression at the edges of the part.

This paper describes a novel device for in-process measurement of the spatial distribution and time-varying nature of the forces induced during the L-PBF process as well as an evaluation of the residual forces following the completion of the build.

Processes for protecting copper surfaces during storage for solderability purposes were evaluated. The reason for the evaluation was to select the most cost effective method of achieving long‐term shelf life. A solderability test method was selected for the programme after reviewing various qualitative techniques such as Rotary Dip, IPC‐S‐801, MIL‐S‐202 Method 208, and the automatic quantitative Meniscograph instrument. A solderability test selection method was considered critical in the programme. Tests were conducted at 3 month intervals over a period of 1 year. From the data, a relative cost comparison showed air levelling to be more economical than organic sealers or hydrosqueeze. Air levelling has shown that circuit and plated‐through‐hole solderability can be maintained for a minimum of 1 year shelf life and is a practical process for both small and large production runs. When solder thickness was assured, test results also showed that both hand soldering and wave soldering could be performed on hard and flexible circuits without measling and pad lifting. The advantages of the process are presented in the paper so that the programme benefits can be applied to both present and future printed circuit board fabrication methods, including additive techniques. Manual soldering benefits of 300% improvement in wetting time and 90% faster wave soldering speeds were possible on air levelled surfaces. The levelling process covers both copper circuit sides of double and multilayer PCBs independent of circuit complexity and ground planes. This paper was originally presented at the First Printed Circuit World Convention held at the Cafe Royal, London in June, 1978.

There are two commercially accepted methods of force control used in automated surface finishing today. The first method, “through‐the‐arm” force control, applies force using the position of all the robot axes in unison. The second method, “around‐the‐arm” force control, uses the robot for positioning motion only, and applies a controlled force through an auxiliary‐compliant end‐of‐arm tool. Discusses the theory, applicability and features of each of these two technologies.

This paper is aimed at Engineers involved in production wire‐bonding processes and system maintenance. It traces the development of microbonding from its origins to the present day. Principles and techniques are examined and some approaches to fault diagnosis are explored.

The load cell constitutes the most important part of an electronic scale for industrial weighing. It is basically the quality of this that determines the profit gained.

An extensive survey of over 300 reports worldwide shows that the state‐of‐the‐art in tactile sensing — defined as continuously variable touch sensing over an area where there is special resolution — is primitive. Only now is a new level of sophistication beginning to appear. However, for industrial systems the simplest may prove to be the most reliable.

Ultrasound is a well-established technology in medical science, though many of the conventional measurement systems (hydrophones and radiation force balances [RFBs]) often lack accuracy and tend to be expensive. This is a significant problem where sensors must be considered to be “disposable” because they inevitably come into contact with biological fluids and expense increases dramatically in cases where a large number of sensors in array form are required. This is inevitably the case where ultrasound is to be used for the in vitro growth stimulation of a large plurality of biological samples in tissue engineering. Traditionally only a single excitation frequency is used (typically 1.5 MHz), but future research demands a larger choice of wavelengths for which a single broadband measurement transducer is desirable. Furthermore, because of implementation conditions there can also be large discrepancies between measurements. The purpose of this paper deals with a very cost-effective alternative to expensive RFBs and hydrophones.

Utilization of cost-effective piezoelectric elements as broadband sensors.

Very effective results with equivalent (if not better) accuracy than expensive alternatives.

This paper concentrates on how very cost-effective piezoelectric ultrasound transducers can be implemented as sensors for ultrasound power measurements with accuracy as good, if not better than those achievable using radiation force balances or hydrophones.

This study aims to understand the influence of megasonic (MS)-assisted agitation on printed circuit boards (PCBs) electroplated using copper (Cu) electrolyte solutions to improve plating efficiencies through enhanced ion transportation.

The impact of MS-assisted agitation on topographical properties of the electroplated surfaces was studied through a design of experiments by measuring surface roughness, which is characterised by values of the parameter Ra as measured by white light phase shifting interferometry and high-resolution scanning electron microscopy.

An increase in Ra from 400 to 760 nm after plating was recorded for an increase in acoustic power from 45 to 450 W. Roughening increased because of micro-bubble cavitation energy and was supported through direct imaging of the cavitation. Current thieving effect by the MS transducer induced low currents, leading to large Cu grain frosting and reduction in the board quality. Current thieving was negated in plating trials through specific placement of transducer. Wavy electroplated surfaces, due to surface acoustic waves, were also observed to reduce the uniformity of the deposit.

The formation of unstable transient cavitation and variation of the topology of the Cu surface are unwanted phenomena. Further plating studies using MS agitation are needed, along with fundamental simulations, to determine how the effects can be reduced or prevented.

This study can help identify manufacturing settings required for high-quality MS-assisted plating and promote areas for further investigation, leading to the development of an MS plating manufacturing technique.

This study quantifies the topographical changes to a PCB surface in response to MS agitation and evidence for deposited Cu artefacts due to acoustic effects.

This paper seeks to present an acceleration‐based force‐impedance controller, applied to a six‐dof parallel mini‐manipulator: the robotic controlled impedance device (RCID).

The proposed control strategy involves three cascade controllers: an inner acceleration controller, built as a set of six single input/single output acceleration controllers (one per manipulator axis), an impedance task‐space controller, and an outer force controller.

The control strategy enables two kinds of manipulator behaviour: force‐limited impedance control and position‐limited force control. The type of behaviour depends only on the chosen manipulator trajectories.

The RCID may be used as a force‐impedance controlled auxiliary device, coupled in series with a position‐controlled commercial industrial robot. The two manipulators combined behave as a single manipulator, having the impedance and force control performance of the RCID, as well as the workspace and trajectory tracking performance of the industrial manipulator. The industrial manipulator should perform free space motion trajectory tracking, the RCID being kept in a “home” position, preserving its small workspace for impedance and force control.

A robust control strategy that enables good performance, while the robot executes tasks that involve interaction with the environment, is being proposed. Experimental results on a force‐impedance controlled six‐dof parallel mini‐manipulator are presented.

EARLY in 1963, a project was initiated in co‐operation with an European airline with a purpose of starting development work for a new transducer for engine vibration monitoring. The low reliability of former pickups motivated this development work. In the course of the development, modern engine design requirements raised the need for the high temperature stability of these transducers. The development work was, therefore, based on the necessity to produce a vibration transducer with extreme high reliability, good interchangeability tolerance and useable up to approximately 600 deg. C. in practical flight operation. With regard to these requirements, a suitable technical approach seemed to be the use of the piezoelectric transducer technique, because seismic acceleration pickups working on the piezoelectric principle do not use moving parts, whereas displacement and velocity pickups, used so far, have at least one moving part, i.e. the inertial mass. Also the requirement for high temperature stability could be met by using modern crystal technology. The following chapters will expound some mechanical and crystallographic considerations in connection with such transducers, and furthermore describe some devices which are now being used in practical flight operation. Today, the concept of a piezoelectric, high temperature accelerometer with 2‐pole signal output has been commonly adopted in industrial production of transducers for airborne vibration monitoring.