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During the building designing, it is very important to deal with the fire resistance of the structures. The designed materials for escape routes should be selected to ensure the usability of the structures until the time of escape. Planning affects the glass structures similarly, so these can also be partition walls and load bearing structures, although the latter is less applied on escape routes. The heat protection of the glasses can be improved with heat-protective foils, while fire protection is provided by gel intumescent material.

To research the topic of fire resistance, laboratory experiments were carried out on small-scaled glass elements with thermal protection foil at Budapest University of Technology and Economics at the Department of Construction Materials and Technologies.

Fire protection of small model specimens was tested with blowtorch fire and furnace heat load. During the experiments, six foils were tested. Single pane glass, double layered and triple glazed specimens were tested with blowtorch fire.

Fire protection of small model specimens was tested with blowtorch fire and furnace heat load. During the experiments, six foils were tested. Single pane glass, double layered and triple glazed specimens were tested with blowtorch fire. In case of heat-protected glazing, the foils on the “protected” side of the single pane glass do not have a fire protection effect based on blowtorch fire test. For double glassed specimens, the P35 foil has a perceptible effect, even for the requirements of the flame breakthrough (E, integrity), when the foil is placed on the inner side (position 3) of the second glass layer. The stratification of each triple glazed specimens was effective against blowtorch fire load (3 M, S4&P35), so (EI, integrity and isolation) it can meet the requirements of flame breakthrough and thermal insulation.

A new high strength, low profile copper foil (AM) has been developed by the authors' company. This foil is designated AM foil, which refers to its advanced metallurgy. The unique attributes of this foil arise from its unconventional processing approach and the resulting microstructure. An extremely small and uniform grain structure enhances the metallurgy and decreases the foil profile. Random crystal orientation and high nucleation density eliminate porosity for all foils of various thickness. Other benefits related to this high strength and low profile foil include good handleability, outstanding etching performance, better control of dielectric thickness, very high elongation to reduce innerlayer cracks, improved oxide adhesion, as well as other advantages.

The purpose of this paper is to examine the formation of surface damage associated with the ultrasonic consolidation (UC) of single ply 150 μm thick 3003‐H18 foil to a 3003‐18 build plate and the relationship between the development of this damage state with the linear weld density (LWD) achieved during consolidation.

The influence of the consolidation control variables on the area fraction of the sonotrode induced top foil surface damage is established through application of a full factorial three‐level design‐of‐experiment methodology, the control variables limits being fixed by the capability of the UC system.

Detailed analysis of the foil top surface structure after consolidation reveals the presence of two characteristic, damaged and undamaged, regions. The former corresponded to plastically deformed areas, these being formed as a result of interaction of the foil top surface with the sonotrode, while the latter corresponded to the original foil surface. Sonotrode normal load, vibrational amplitude and its rotational velocity are found to have an interdependent affect on the development of the sonotrode‐induced top surface damage. Top surface damage initiates upon impression of the sonotrode into the foil surface followed by the commencement of oscillatory and forward rotational motion of the sonotrode. Finally, evidence is presented that the degree of sonotrode induced top surface damage bears a direct relationship with the linear ultrasonic weld density developed at the foil‐build plate interface, increasing top surface damage being associated with increased LWD.

A linear relationship between the degree of bonding at the foil‐build plate interface and the plastically deformed area on the foil top surface is established, this correlation demonstrating that bond formation between foils during UC depends on effective frictional conditions at the sonotrode‐foil interface.

Peel strength numbers are part of a laminate's specifications and should characterize the specific bond performance (copper adhesion) under test conditions. Unfortunately, from both a theoretical and a practical point of view they are not able to do that. This study seeks to address this issue.

This paper has been written to show the main impacts on the measured peel strength numbers in the IPC‐TM‐650 peeling test. From an extensive database regarding peel numbers for diverse foil types, foil thicknesses and treatment roughnesses it is possible to show the influence of prepreg type, foil thickness and roughness on the measure peel strength.

Copper adhesion to laminating resin is insufficiently described by peel strength data because of the impacts of foil thickness, stiffness on bending (physical bending work, stress distribution underneath the peeling line) and the treatment roughness. The latter works reinforcing regarding the (low) resin strength and this influence is measured on resin strength instead of real bond. Fracture due to peeling is cohesive, mostly with a totally intact copper‐resin interface. This is especially true in high performance laminates that show low peel strengths not because of bad copper bonding but because of brittle resins (filled and unfilled).

Users have to understand the limited benefit of the IPC peel test in characterizing copper‐resin bonds. Peel increase on (low bond) high performance resins by increased foil roughness is not a practical way in the field because of no bond improvement (interface) and heavy disadvantages in dielectric thickness (HiPot tests at thin core laminates), respectively.

The thermal management of printed circuit boards with high component density is increasingly becoming an important factor in the efficiency and reliability of electronic systems. A well‐proven technique, which has been used to produce multilayer circuit boards in quantity for several years, is to incorporate metal foils. The metal foils significantly improve heat removal and impart to the circuit board a thermal expansion behaviour closely matching that of the ceramic chip carrier. Roll‐clad Copper‐Invar‐copper (CIC) and copper‐molybdenum‐copper (CMC) foils have been used for this purpose. This paper reports on the first use of Mo30Cu foils, a material produced by powder metallurgy consisting of 70% molybdenum and 30% copper. Contraves AG manufacture SMT multilayer circuit boards incorporating Mo30Cu foils produced by Metallwerk Plansee GmbH. With regard to machinability and physical characteristics, Mo30Cu foils are superior to roll‐clad foils. First of all, the high elastic modulus of Mo30Cu foils is worth mentioning. It positively influences thermal stability and mechanical stiffness of the circuit board.

The strain‐based flex fatigue of 18 μm thick copper foil is evaluated over a wide range of strain amplitudes. Seven electrodeposited foils, four commercial grades and three experimental foils, and a commercial grade rolled foil are characterized. The fatigue life versus cyclic strain amplitude curve in the high strain amplitude (low cycle) and low strain amplitude (high cycle) regimes is developed for each foil. On the basis of fatigue life (N_f) and fatigue ductility (D_f), the low cycle fatigue performance of eight foils is ranked. Universal correlations of N_f and D_f with the uniaxial tensile strength are established. Two electrodeposited foils, experimental foil DF 8 in the high strain amplitude regime and commercial foil DF 9 in the low strain amplitude regime, have been shown to display fatigue performance comparable to that of the commercial rolled GR 8 foil.

The purpose of this paper is to investigate the effect of different wedge shapes on the performance of air foil thrust bearing (AFTB).

During the study, a bump foil stiffness model considering slip deformation and a two-dimensional sheet top foil model is established, and the Reynolds equation and film thickness equation is solved using the finite difference method and finite element method. The static performance such as load carrying capacity, friction torque and power loss of AFTB under different taper parameters is obtained. The influence of different pitch ratio, film thickness ratio and wedge shapes on the bearing characteristics is studied.

There is an optimal height and a pitch ratio for the taper of AFTB with certain tile number. Compared to the plane and concave wedge shape, the upper convex shape can enhance the convergence effect of the wedge region, increase the effective film pressure distribution area of the bearing and reduce the local concentrated load of the top foil, which is more conductive to the increase of load capacity.

The wedge shape parameters bring a fundamental difference in the static performance of AFTB. The results are expected to be helpful to bearing designers, researchers and academicians concerned.

The purpose of this paper is to investigate the effect of the rounding in bump foil on the static performance of air foil journal bearings.

During the study, the bending moment of the new foil structure with rounding is proposed, and the bump foil stiffness is obtained from the elastic deformation energy theory. The validity of the presented foil model is verified through comparison with previous models. The static characteristics of foil bearings such as film thickness and attitude angle are obtained using a fully coupled elastic-gas algorithm and are compared to models with various rounding radius and friction coefficients.

There is an optimal rounding radius that makes the stiffness of bump foil maximum. As the static load increases, the minimum film thickness is proportional to the rounding radius but the attitude angle is inversely proportional. The effect of rounding with a large friction coefficient becomes negligible.

The rounding brings fundamental difference in the structural stiffness and static performance of foil bearings. The results are expected to be helpful to bearing designers, researchers and academicians concerned.

The purpose of this study is to explore the mechanism of branch pits and tunnels formation and increase the specific surface area and capacitance of anode Al foil for high voltage electrolytic capacitor by D.C. etching in acidic solution and neutral.

Al foil was first D.C. etched in HCl-H₂SO₄ mixed acidic solution to form main tunnels perpendicular to the Al surface, and then D.C. etched in neutral NaCl solution including 0.5 per cent C₆H₈O₇ and Cu(NO₃)₂ with different concentration to form branch tunnels normal to Al surface. Between two etching, Cu nuclei were electroless deposited on the interior surface of main tunnels by natural occluded corrosion cell effect to form micro Cu-Al galvanic local cells. The effects of electroless deposited Cu nuclei on cross-section etching morphologies and electrochemical behavior of Al foil was investigated with SEM, polarization curve and electrochemical impedance spectroscopy (EIS).

The results show that sub branch tunnels can form along the main tunnels owing to the formation of Cu-Al micro-batteries, in which Cu is cathode and Al is anode. With increase in Cu(NO₃)₂ concentration, more Cu nuclei can be electroless deposited and serve as the favorable sites for branch tunnel initiation along the whole length of main tunnels, leading to enhancement in specific capacitance of anode Al foil.

Cu nuclei were electroless deposited on the interior surface of main tunnels by natural occluded corrosion cell effect to form micro Cu-Al galvanic local cells, which can serve as the favorable sites for branch tunnel initiation along the main tunnels to enhance specific capacitance of anode Al foil.

This paper aims to improve the load capacity of gas foil thrust bearing (GFTB) and to introduce and study a novel bearing with stacked bump foils.

For the proposed novel GFTB supported by stacked foils, some bump-type gaskets with several partial arches are inserted below the regular bump foil, and the height of each arch can be made differently. These features make the bump foil thickness and height gradually increase, which can bring enhanced support stiffness and convergent film at the trailing edge. Based on a new nonlinear bump stiffness model considering bump rounding and friction force, the finite element and finite difference method were used to solve the coupling Reynolds equation, energy equation and foil deformation equation. Finally, the structural stiffness and static characteristics of the novel GFTB were gained and compared with the traditional bearing.

The novel GFTB has an additional convergence effect in the parallel section, which improves the static performance of bearing. The bearing capacity, friction moment, power loss and temperature rise of the novel GFTB are all higher than those of the traditional bearing, and the static characteristics are related to the parameters of stacked bump foils.

The stacked bump foils bring a fundamental enhancement on the load capacity of GFTB. The results are expected to be helpful to bearing designers, researchers and academicians concerned.

The peer review history for this article is available at: https://publons.com/publon/10.1108/ILT-10-2019-0449/