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The purpose of this study was to comparatively investigate interfacial intermetallic compounds (IMCs) in the Sn3.0Ag0.5Cu3.0Bi0.05Cr/Cu (SACBC/Cu) and Sn3.0Ag0.5Cu/Cu (SAC/Cu) solder joints, and to determine any differences.

The samples were annealed after isothermal ageing at 150°C for 0, 168 and 500 hours, and their cross-sections were observed by scanning electron microscopy and energy dispersive spectroscopy.

The interfacial IMC morphology in two joints had significant differences. For the Cu/SAC/Cu joints, the granular and short rod-like Ag3Sn particles attached on the surface and boundary of interfacial Cu6Sn5 grains were detected, and they coarsened observably with ageing time at 150°C, and lastly embedded at the grain boundaries. However, for the Cu/SACBC/Cu joints, there were tiny filamentous Ag3Sn growing on the surface of interfacial Cu6Sn5 grains, and the Ag3Sn had a tendency to break into nanoparticles, which would be distributed evenly and cover the IMC layer, profiting from the Bi and Cr precipitates from solder matrix during ageing.

The paper implies that the addition of Bi and Cr could affect the IMCs of joints, thereby delaying interfacial reactions between Sn and Cu atoms and improving the service reliability. The SACBC solder is a potential alloy for electronic packaging production.