Search results
1 – 10 of 72Zhenlong Peng, Aowei Han, Chenlin Wang, Hongru Jin and Xiangyu Zhang
Unconventional machining processes, particularly ultrasonic vibration cutting (UVC), can overcome such technical bottlenecks. However, the precise mechanism through which UVC…
Abstract
Purpose
Unconventional machining processes, particularly ultrasonic vibration cutting (UVC), can overcome such technical bottlenecks. However, the precise mechanism through which UVC affects the in-service functional performance of advanced aerospace materials remains obscure. This limits their industrial application and requires a deeper understanding.
Design/methodology/approach
The surface integrity and in-service functional performance of advanced aerospace materials are important guarantees for safety and stability in the aerospace industry. For advanced aerospace materials, which are difficult-to-machine, conventional machining processes cannot meet the requirements of high in-service functional performance owing to rapid tool wear, low processing efficiency and high cutting forces and temperatures in the cutting area during machining.
Findings
To address this literature gap, this study is focused on the quantitative evaluation of the in-service functional performance (fatigue performance, wear resistance and corrosion resistance) of advanced aerospace materials. First, the characteristics and usage background of advanced aerospace materials are elaborated in detail. Second, the improved effect of UVC on in-service functional performance is summarized. We have also explored the unique advantages of UVC during the processing of advanced aerospace materials. Finally, in response to some of the limitations of UVC, future development directions are proposed, including improvements in ultrasound systems, upgrades in ultrasound processing objects and theoretical breakthroughs in in-service functional performance.
Originality/value
This study provides insights into the optimization of machining processes to improve the in-service functional performance of advanced aviation materials, particularly the use of UVC and its unique process advantages.
Details
Keywords
Vicente-Segundo Ruiz-Jacinto, Karina-Silvana Gutiérrez-Valverde, Abrahan-Pablo Aslla-Quispe, José-Manuel Burga-Falla, Aldo Alarcón-Sucasaca and Yersi-Luis Huamán-Romaní
This paper aims to present the novel stacked machine learning approach (SMLA) to estimate low-cycle fatigue (LCF) life of SAC305 solder across structural parts. Using the finite…
Abstract
Purpose
This paper aims to present the novel stacked machine learning approach (SMLA) to estimate low-cycle fatigue (LCF) life of SAC305 solder across structural parts. Using the finite element simulation (FEM) and continuous damage mechanics (CDM) model, a fatigue life database is built. The stacked machine learning (ML) model's iterative optimization during training enables precise fatigue predictions (2.41% root mean square error [RMSE], R2 = 0.975) for diverse structural components. Outliers are found in regression analysis, indicating potential overestimation for thickness transition specimens with extended lifetimes and underestimation for open-hole specimens. Correlations between fatigue life, stress factors, nominal stress and temperature are unveiled, enriching comprehension of LCF, thus enhancing solder behavior predictions.
Design/methodology/approach
This paper introduces stacked ML as a novel approach for estimating LCF life of SAC305 solder in various structural parts. It builds a fatigue life database using FEM and CDM model. The stacked ML model iteratively optimizes its structure, yielding accurate fatigue predictions (2.41% RMSE, R2 = 0.975). Outliers are observed: overestimation for thickness transition specimens and underestimation for open-hole ones. Correlations between fatigue life, stress factors, nominal stress and temperature enhance predictions, deepening understanding of solder behavior.
Findings
The findings of this paper highlight the successful application of the SMLA in accurately estimating the LCF life of SAC305 solder across diverse structural components. The stacked ML model, trained iteratively, demonstrates its effectiveness by producing precise fatigue lifetime predictions with a RMSE of 2.41% and an “R2” value of 0.975. The study also identifies distinct outlier behaviors associated with different structural parts: overestimations for thickness transition specimens with extended fatigue lifetimes and underestimations for open-hole specimens. The research further establishes correlations between fatigue life, stress concentration factors, nominal stress and temperature, enriching the understanding of solder behavior prediction.
Originality/value
The authors confirm the originality of this paper.
Details
Keywords
Rilwan Kayode Apalowo, Mohamad Aizat Abas, Muhamed Abdul Fatah Muhamed Mukhtar, Fakhrozi Che Ani and Mohamad Riduwan Ramli
This study aims to investigate the reliability issues of microvoid cracks in solder joint packages exposed to thermal cycling fatigue.
Abstract
Purpose
This study aims to investigate the reliability issues of microvoid cracks in solder joint packages exposed to thermal cycling fatigue.
Design/methodology/approach
The specimens are subjected to JEDEC preconditioning level 1 (85 °C/85%RH/168 h) with five times reflow at 270°C. This is followed by thermal cycling from 0°C to 100°C, per IPC-7351B standards. The specimens' cross-sections are inspected for crack growth and propagation under backscattered scanning electronic microscopy. The decoupled thermomechanical simulation technique is applied to investigate the thermal fatigue behavior. The impacts of crack length on the stress and fatigue behavior of the package are investigated.
Findings
Cracks are initiated from the ball grid array corner of the solder joint, propagating through the transverse section of the solder ball. The crack growth increases continuously up to 0.25-mm crack length, then slows down afterward. The J-integral and stress intensity factor (SIF) values at the crack tip decrease with increased crack length. Before 0.15-mm crack length, J-integral and SIF reduce slightly with crack length and are comparatively higher, resulting in a rapid increase in crack mouth opening displacement (CMOD). Beyond 0.25-mm crack length, the values significantly decline, that there is not much possibility of crack growth, resulting in a negligible change in CMOD value. This explains the crack growth arrest obtained after 0.25-mm crack length.
Practical implications
This work's contribution is expected to reduce the additional manufacturing cost and lead time incurred in investigating reliability issues in solder joints.
Originality/value
The work investigates crack propagation mechanisms of microvoid cracks in solder joints exposed to moisture and thermal fatigue, which is still limited in the literature. The parametric variation of the crack length on stress and fatigue characteristics of solder joints, which has never been conducted, is also studied.
Details
Keywords
Taotao Jin, Xiuhui Cui, Chuanyue Qi and Xinyu Yang
This paper aims to develop a specific type of mobile nonrigid support friction stir welding (FSW) robot, which can adapt to aluminum alloy trucks for rapid online repair.
Abstract
Purpose
This paper aims to develop a specific type of mobile nonrigid support friction stir welding (FSW) robot, which can adapt to aluminum alloy trucks for rapid online repair.
Design/methodology/approach
The friction stir welding robot is designed to complete online repair according to the surface damage of large aluminum alloy trucks. A rotatable telescopic arm unit and a structure for a cutting board in the shape of a petal that was optimized by finite element analysis are designed to give enough top forging force for welding to address the issues of inadequate support and significant deformation in the repair process.
Findings
The experimental results indicate that the welding robot is capable of performing online surface repairs for large aluminum alloy trucks without rigid support on the backside, and the welding joint exhibits satisfactory performance.
Practical implications
Compared with other heavy-duty robotic arms and gantry-type friction stir welding robots, this robot can achieve online welding without disassembling the vehicle body, and it requires less axial force. This lays the foundation for the future promotion of lightweight equipment.
Originality/value
The designed friction stir welding robot is capable of performing online repairs without dismantling the aluminum alloy truck body, even in situations where sufficient upset force is unavailable. It ensures welding quality and exhibits high efficiency. This approach is considered novel in the field of lightweight online welding repairs, both domestically and internationally.
Details
Keywords
This paper aims to improve the life of the printed circuit boards (PCB) used in computers based on modal analysis by increasing the natural frequency of the PCB assembly.
Abstract
Purpose
This paper aims to improve the life of the printed circuit boards (PCB) used in computers based on modal analysis by increasing the natural frequency of the PCB assembly.
Design/methodology/approach
In this work, through experiments and numerical simulations, an attempt has been made to increase the fundamental natural frequency of the PCB assembly as high as practically achievable so as to minimize the impacts of dynamic loads acting on it. An optimization tool in the finite element software (ANSYS) was used to search the specified design space for the optimal support location of the six fastening screws.
Findings
It is observed that by changing the support locations based on the optimization results the fundamental natural frequency can be raised up to 51.1% and the same is validated experimentally.
Research limitations/implications
Manufacturers of PCBs used in computers fix the support locations based on symmetric feature of the board not on the dynamic behavior of the assembly. This work might lead manufacturers to redesign the location of other surface mount components.
Practical implications
This work provides guidelines for PCB manufacturers to finalize their support locating points which will improve the dynamic characteristics of the PCB assembly during its functioning.
Originality/value
This study provides a novel method to improve the life of PCB based on support locations optimization which includes majority of the surface mount components that contributes to the total mass the PCB assembly.
Details
Keywords
Flaviana Calignano, Alessandro Bove, Vincenza Mercurio and Giovanni Marchiandi
Polymer laser powder bed fusion (PBF-LB/P) is an additive manufacturing technology that is sustainable due to the possibility of recycling the powder multiple times and allowing…
Abstract
Purpose
Polymer laser powder bed fusion (PBF-LB/P) is an additive manufacturing technology that is sustainable due to the possibility of recycling the powder multiple times and allowing the fabrication of gears without the aid of support structures and subsequent assembly. However, there are constraints in the process that negatively affect its adoption compared to other additive technologies such as material extrusion to produce gears. This study aims to demonstrate that it is possible to overcome the problems due to the physics of the process to produce accurate mechanism.
Design/methodology/approach
Technological aspects such as orientation, wheel-shaft thicknesses and degree of powder recycling were examined. Furthermore, the evolving tooth profile was considered as a design parameter to provide a manufacturability map of gear-based mechanisms.
Findings
Results show that there are some differences in the functioning of the gear depending on the type of powder used, 100% virgin or 50% virgin and 50% recycled for five cycles. The application of a groove on a gear produced with 100% virgin powder allows the mechanism to be easily unlocked regardless of the orientation and wheel-shaft thicknesses. The application of a specific evolutionary profile independent of the diameter of the reference circle on vertically oriented gears guarantees rotation continuity while preserving the functionality of the assembled mechanism.
Originality/value
In the literature, there are various studies on material aging and reuse in the PBF-LB/P process, mainly focused on the powder deterioration mechanism, powder fluidity, microstructure and mechanical properties of the parts and process parameters. This study, instead, was focused on the functioning of gears, which represent one of the applications in which this technology can have great success, by analyzing the two main effects that can compromise it: recycled powder and vertical orientation during construction.
Details
Keywords
Yang Liu, Xin Xu, Shiqing Lv, Xuewei Zhao, Yuxiong Xue, Shuye Zhang, Xingji Li and Chaoyang Xing
Due to the miniaturization of electronic devices, the increased current density through solder joints leads to the occurrence of electromigration failure, thereby reducing the…
Abstract
Purpose
Due to the miniaturization of electronic devices, the increased current density through solder joints leads to the occurrence of electromigration failure, thereby reducing the reliability of electronic devices. The purpose of this study is to propose a finite element-artificial neural network method for the prediction of temperature and current density of solder joints, and thus provide reference information for the reliability evaluation of solder joints.
Design/methodology/approach
The temperature distribution and current density distribution of the interconnect structure of electronic devices were investigated through finite element simulations. During the experimental process, the actual temperature of the solder joints was measured and was used to optimize the finite element model. A large amount of simulation data was obtained to analyze the neural network by varying the height of solder joints, the diameter of solder pads and the magnitude of current loads. The constructed neural network was trained, tested and optimized using this data.
Findings
Based on the finite element simulation results, the current is more concentrated in the corners of the solder joints, generating a significant amount of Joule heating, which leads to localized temperature rise. The constructed neural network is trained, tested and optimized using the simulation results. The ANN 1, used for predicting solder joint temperature, achieves a prediction accuracy of 96.9%, while the ANN 2, used for predicting solder joint current density, achieves a prediction accuracy of 93.4%.
Originality/value
The proposed method can effectively improve the estimation efficiency of temperature and current density in the packaging structure. This method prevails in the field of packaging, and other factors that affect the thermal, mechanical and electrical properties of the packaging structure can be introduced into the model.
Details
Keywords
Xiangou Zhang, Yuexing Wang, Xiangyu Sun, Zejia Deng, Yingdong Pu, Ping Zhang, Zhiyong Huang and Quanfeng Zhou
Au stud bump bonding technology is an effective means to realize heterogeneous integration of commercial chips in the 2.5D electronic packaging. The purpose of this paper is to…
Abstract
Purpose
Au stud bump bonding technology is an effective means to realize heterogeneous integration of commercial chips in the 2.5D electronic packaging. The purpose of this paper is to study the long-term reliability of the Au stud bump treated by four different high temperature storage times (200°C for 0, 100, 200 and 300 h).
Design/methodology/approach
The bonding strength and the fracture behavior are investigated by chip shear test. The experiment is further studied by microstructural characterization approaches such as scanning electron microscope, energy dispersive spectrometer and so on.
Findings
It is recognized that there were mainly three typical fracture models during the chip shear test among all the Au stud bump samples treated by high temperature storage. For solder bump before aging, the fracture occurred at the interface between the Cu pad and the Au stud bump. As the aging time increased, the fracture mainly occurred inside the Au stud bump at 200°C for 100 and 200 h. When aging time increased to 300 h, it is found that the fracture transferred to the interface between the Au stud bump and the Al Pad.
Originality/value
In addition, the bonding strength also changed with the high temperature storage time increasing. The bonding strength does not change linearly with the high temperature storage time increasing but decreases first and then increases. The investigation shows that the formation of the intermetallic compounds because of the reaction between the Au and Al atoms plays a key role on the bonding strength and fracture behavior variation.
Details
Keywords
Mohammad A Gharaibeh, Markus Feisst and Jürgen Wilde
This paper aims to present two Anand’s model parameter sets for the multilayer silver–tin (AgSn) transient liquid phase (TLP) foils.
Abstract
Purpose
This paper aims to present two Anand’s model parameter sets for the multilayer silver–tin (AgSn) transient liquid phase (TLP) foils.
Design/methodology/approach
The AgSn TLP test samples are manufactured using pre-defined optimized TLP bonding process parameters. Consequently, tensile and creep tests are conducted at various loading temperatures to generate stress–strain and creep data to accurately determine the elastic properties and two sets of Anand model creep coefficients. The resultant tensile- and creep-based constitutive models are subsequently used in extensive finite element simulations to precisely survey the mechanical response of the AgSn TLP bonds in power electronics due to different thermal loads.
Findings
The response of both models is thoroughly addressed in terms of stress–strain relationships, inelastic strain energy densities and equivalent plastic strains. The simulation results revealed that the testing conditions and parameters can significantly influence the values of the fitted Anand coefficients and consequently affect the resultant FEA-computed mechanical response of the TLP bonds. Therefore, this paper suggests that extreme care has to be taken when planning experiments for the estimation of creep parameters of the AgSn TLP joints.
Originality/value
In literature, there is no constitutive modeling data on the AgSn TLP bonds.
Details
Keywords
Value-based healthcare suggested using patient-reported information to complement the information available in the medical records and administrative healthcare data to provide…
Abstract
Purpose
Value-based healthcare suggested using patient-reported information to complement the information available in the medical records and administrative healthcare data to provide insights into patients' perceptions of satisfaction, experience and self-reported outcomes. However, little attention has been devoted to questions about factors fostering the use of patient-reported information to create value at the system level.
Design/methodology/approach
Action research design is carried out to elicit possible triggers using the case of patient-reported experience and outcome data for breast cancer women along their clinical pathway in the clinical breast network of Tuscany (Italy).
Findings
The case shows that communication and engagement of multi-stakeholder representation are needed for making information actionable in a multi-level, multispecialty care pathway organized in a clinical network; moreover, political and managerial support from higher level governance is a stimulus for legitimizing the use for quality improvement. At the organizational level, an external facilitator disclosing and discussing real-world uses of collected data is a trigger to link measures to action. Also, clinical champion(s) and clear goals are key success factors. Nonetheless, resource munificent and dedicated information support tools together with education and learning routines are enabling factors.
Originality/value
Current literature focuses on key factors that impact performance information use often considering unidimensional performance and internal sources of information. The use of patient/user-reported information is not yet well-studied especially in supporting quality improvement in multi-stakeholder governance. The work appears relevant for the implications it carries, especially for policymakers and public sector managers when confronting the gap in patient-reported measures for quality improvement.
Details