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This study focuses on the application of reliability-centered maintenance (RCM) to a textile industry steam boiler. The study aims to demonstrate the development and application of RCM to a steam boiler used in the textile industry.

RCM is a structured process that develops maintenance activities needed on physical resources in their operational environment to realize their inherent reliability by logically incorporating an appropriate mixture of reactive, preventive, condition-based and proactive maintenance methods. A detailed analysis of the RCM approach is presented to develop preventive maintenance (PM) program and improve the reliability and availability of the steam boiler system.

The research reveals that the identification of PM tasks is a good indicator of the PM program's efficiency and can serve as an important maintenance-related downtime source. It is also discovered that the majority of maintenance programs that claim to be proactive are, in fact, reactive. This article also shows how RCM may be successfully implemented to any system, resulting in increased system reliability.

The paper focuses on a pilot study of the development and implementation of the RCM technique to a textile industry steam boiler. It is suggested that the developed RCM model can be applied to the entire plant.

The paper presents a comprehensive RCM model framework as well as an RCM decision framework, providing maintenance managers and engineers with a step-by-step approach to RCM implementation. The proposed framework is significant in that it may be utilized for both qualitative and quantitative analysis at the same time.

In the past 15 years stretchable electronic circuits have emerged as a new technology in the domain of assembly, interconnections and sensor circuits and assembly technologies. In the meantime a wide variety of processes with the use of many different materials have been explored in this new field. The purpose of the current contribution is for the authors to present an approach for stretchable circuits which is inspired by conventional rigid and flexible printed circuit board (PCB) technology. Two variants of this technology are presented: stretchable circuit board (SCB) and stretchable mould interconnect (SMI).

Similarly as in PCB 17 or 35 μm thick sheets of electrodeposited or rolled‐annealed Cu are structured to form the conductive tracks, and off‐the‐shelf, standard packaged, rigid components are assembled on the Cu contact pads using lead‐free solder materials and reflow processes. Stretchability is obtained by shaping the Cu tracks not as straight lines, like in normal PCB design, but as horseshoe shaped meanders. Instead of rigid or flexible board materials, elastic materials, predominantly PDMS (polydimethylsiloxane), are used to embed the conductors and the components, thus serving as circuit carrier. The authors include some mechanical modeling and design considerations, aimed at the optimization of the build‐up and combination of elastic, flexible and rigid materials towards minimal stress and maximum mechanical reliability in the structures. Furthermore, details on the two production processes are given, reliability findings are summarised, and a number of functional demonstrators, realized with the technologies, are described.

Key conclusions of the work are that: supporting the metal meanders with a flexible carrier prior to embedding in an elastic substrate substantially increases the reliability under mechanical stress (cyclic uniaxial stretching) of the stretchable interconnect and the transition areas between rigid components and stretchable interconnects are the zones which are most sensitive to failure under mechanical stress. Careful design and technology implementation is necessary, providing a gradual transition from rigid to flexible to stretchable parts of the circuit.

Technologies for stretchable circuits, with the same level of similarity to standard PCB manufacturing and assembly, and thus with the same high potential for transfer to an industrial environment and for mass production, have not been shown before.

The successful culmination of missions based on Unmanned Aerial Vehicles (UAV) can be measured with two main parameters: (1) successful mission completion: all objectives of the mission (e.g., maneuvering and navigation, reconnaissance and targeting or search and rescue, and return) were accomplished and (2) safety: no damage to the vehicle and no fatalities or injuries to any human were sustained throughout the mission. Automation of the UAV's control and operations increasingly becomes a determining factor in successful mission completion and increased safety. However, in this day and age of automatically launched and retrieved swarms of UAVs, the human operator still has a critical role. Human-controlled UAVs will persist for a long time and human error is a factor that still needs addressing in the age of automation. Even a single person, who has flown radio-controlled model aircraft as a hobby since childhood, can still cause the crash of an expensive UAV in a matter of seconds. Moreover, there are aspects of human error in UAV control that can have important implications to the implementation of automation and to keeping the human operator in the control loop.

This study aims to contribute to the numerical modelling of drop impact on a flip-chip component assembled on printed circuit boards using solder micro-bumps. This contribution is based on the introduction of non-linear fracture mechanics in the numerical approach.

The integration of non-linear fracture mechanics into the numerical approach requires the proposal and validation of several simplifying assumptions. Initially, a dynamic 3D model was simplified to a dynamic 2D model. Subsequently, the dynamic 2D model is replaced with an equivalent static 2D model. The equivalent static 2D model was used to perform calculations considering the non-linear fracture mechanics. A crack was modelled in the critical bump. The J-integral was used as a comparative parameter to study the effects of crack length, crack position and chip thickness on the fracture toughness of the solder bump.

The different simplifying assumptions were validated by comparing the results obtained by the various models. Numerical results showed a high risk of failure at the critical solder bump in a zone close to the intermetallic layer. The obtained results were in agreement with the post-test observations using the “Dye and Pry” methods.

The originality of this study lies in the introduction of non-linear fracture mechanics to model the mechanical response of solder bumps during drop impact. This study led to some interesting conclusions, highlighting the advantage of introducing non-linear fracture mechanics into the numerical simulations of microelectronic components during a drop impact.

The purpose of this paper to develop a novel strategic approach to handle corrective maintenance procedure in the event of a breakdown/disruption of service. A proposal to minimize the recovery time and the breakdown cost in the system in construction plant is presented.

The past plant breakdown records of a construction organization are considered for the analysis. From the previous breakdown records, a high level metric using Pareto analysis and the cause effect analysis is used to identify the main breakdown main codes (BMC) and the subsequent breakdown sub codes (BSC). Prioritized BMC and BSCs are used to formulate dedicated breakdown maintenance teams, which act swiftly in the event of the breakdown with the modified methods.

The study was conducted, on four different types of heavy lifting/earth moving/material handling system equipment, which are used to load/unload/haul and transport construction materials. Failure due to tyre puncture and allied problems contribute to maximum failure. A strategy plan to minimize this type of failure is proposed. With the identification of the most contributing BMCs and BSCs, it is further proposed to develop an “overall breakdown maintenance management”.

The collected data pertains to the construction plant located in a particular region, namely the Middle East, and hence the proposed solution is dedicated/relatively applicable to similar plant from the same region. A more robust model can be suggested considering the work environment in the other regions.

The proposed methodology is highly adaptable by similar industries operating in the Middle East region.

Construction plant and equipment contribute to the success of construction organizations, by providing enhanced output, reduced manpower requirement, ease of work and timely completion of the project. Delays in completion of projects generally have both social and economical impact on the contractors and the buyers. The proposed model will bring down the lead‐time of the project and enable the contractors to crash down their project completion time.

Numerous studies on preventive maintenance models and procedures are available for a system and in particular to construction plant maintenance in the literature. This model attempts to handle the issues of unpredictable breakdowns in the construction plant to minimise the breakdown time. The proposed model is a novel approach which enables a quick recovery of the construction plant, attributed from the breakdown parameters derived from the previous history of the work records/environment.

The primary objective of this two part study was to show theoretically how pigment cluster voids and pigment distribution can influence the critical pigment volume concentration (CPVC) and consequently the properties of a dry coating. In Part I of this study a pigment clustering model with an analytical solution has been developed that was a modification of an earlier model by Fishman, Kurtze, and Bierwagen that could only be solved numerically.

The original derivation of the clustering concept developed by Fishman et al. resulted in a mathematical analysis which was only able to be solved numerically and was found to be very tedious to utilize directly. In this study, a new successful derivation utilizing some of the original concepts of Fishman et al. was generated and shown to result in a practical and much more useable analytical analysis of the clustering concept. This new model was then applied directly to quantify the influence of flow agents or surfactants in a coating formulation on the CPVC as described by Asbeck.

It was found that the largest deviation from 100 per cent pigment dispersion with no pigment clusters occurred just before and just after the ultimate CPVC (UCPVC). A theoretical relationship was also found between the pigment cluster dispersion coefficient, C_q, and CPVC. This result was consistent with the experimental relationship between CPVC and the per cent flow additive as found by Asbeck. The density ratio of overall coating to the pigment density was found to go through a maximum at a global volume fraction of pigment that was slightly greater than the UCPVC as expected for a mechanical property. It was also identified that mechanical failure of most coating formulations should be apparent at either the “Lower Zero Limit” or the “Upper Zero Limit” global volume fraction pigment as defined in this study.

While the experimental measurement of the parameters to isolate the clustering concepts introduced in this study may be difficult, it is expected that better quantitative measurement of clustering concepts will eventually prove to be very beneficial to providing improved suspension applications including coatings.

The theoretical relationship developed in this study between the pigment cluster dispersion coefficient, C_q, and CPVC and the experimental relationship between CPVC and the per cent flow additive found by Asbeck inferred a direct relationship between C_q and the per cent flow additive. Consequently, it was shown that the theoretical pigment cluster model developed in this study could be directly related to the experimental matrix additive composition in a coating formulation. The implication is that the measurement tool introduced in this study can provide better measurement and control of clustering in coatings and other suspension applications.

In this study, a new successful derivation utilizing some of the original concepts of Fishman et al. was generated and shown to result in a practical and much more useable analytical analysis of the clustering concept. This new model was then applied directly to quantify the influence of flow agents or surfactants in a coating formulation on the CPVC as described by Asbeck.

Maintaining a high level of availability of weapon systems during battles becomes important from the point of view of winning the battle. Due to attrition factors (failure due to battle damage and unreliability) and logistic delays in the repair process, maintaining the required level of availability is difficult. In this paper, we develop a simulation model for availability of fighter aircraft considering multiple failures causing system failure and logistic delays in the repair process. The methodology is based on discrete event simulation using Monte Carlo techniques. The failure time distribution (Weibull) and the repair time distribution (exponential) for the considered subsystems of the aircraft and the logistic delay time distribution (log‐normal) for the logistic factors spares, crew and equipment were chosen with suitable parameters. The results indicate the pronounced decrease in availability (as low as less than 10 per cent in some cases) due to multiple failures and logistic delays. The results are, however, highly sensitive to a combination of reliability, maintainability and logistic delay parameters.

Additive manufacturing (AM) or solid freeform fabrication (SFF) technique is extensively used to produce intrinsic 3D structures with high accuracy. Its significant contributions in the field of tissue engineering (TE) have significantly increased in the recent years. TE is used to regenerate or repair impaired tissues which are caused by trauma, disease and injury in human body. There are a number of novel materials such as polymers, ceramics and composites, which possess immense potential for production of scaffolds. However, the major challenge is in developing those bioactive and patient-specific scaffolds, which have a required controlled design like pore architecture with good interconnectivity, optimized porosity and microstructure. Such design not only supports cell proliferation but also promotes good adhesion and differentiation. However, the traditional techniques fail to fulfill all the required specific properties in tissue scaffold. The purpose of this study is to report the review on AM techniques for the fabrication of TE scaffolds.

The present review paper provides a detailed analysis of the widely used AM techniques to construct tissue scaffolds using stereolithography (SLA), selective laser sintering (SLS), fused deposition modeling (FDM), binder jetting (BJ) and advanced or hybrid additive manufacturing methods.

Subsequently, this study also focuses on understanding the concepts of TE scaffolds and their characteristics, working principle of scaffolds fabrication process. Besides this, mechanical properties, characteristics of microstructure, in vitro and in vivo analysis of the fabricated scaffolds have also been discussed in detail.

The review paper highlights the way forward in the area of additive manufacturing applications in TE field by following a systematic review methodology.

The mechanical and tribological properties of polymers and polymer composites vary with different environmental conditions. This paper aims to review the influence of humidity/water conditions on various polymers and polymer composites' mechanical properties and tribological behaviors.

The influence of humidity and water absorption on mechanical and tribological properties of various polymers, fillers and composites has been discussed in this paper. Tensile strength, modulus, yield strength, impact strength, COF and wear rates of polymer composites are compared for different environmental conditions. The interaction between the water molecules and hydrophobic polymers is also represented.

Pure polymer matrices show somewhat mixed behavior in humid environments. Absorbed moisture generally plasticizes the epoxies and polyamides and lowers the tensile strength, yield strength and modulus. Wear rates of PVC generally decrease in humid environments, while for polyamides, it increases. Fillers like graphite and boron-based compounds exhibit low COF, while MoS2 particulate fillers exhibit higher COF at high humidity and water conditions. The mechanical properties of fiber-reinforced polymer composites tend to decrease as the rate of humidity increases while the wear rates of fiber-reinforced polymer composites show somewhat mixed behavior. Particulate fillers like metals and advanced ceramics reinforced polymer composites exhibit low COF and wear rates as the rate of humidity increases.

The mechanical and tribological properties of polymers and polymer composites vary with the humidity value present in the environment. In dry conditions, wear loss is determined by the hardness of the contacting surfaces, which may not effectively work for high humid environments. The tribological performance of composite constituents, i.e. matrix and fillers in humid environments, defines the overall performance of polymer composite in said environments.

The purpose of this study is to extend a sensitivity-based reliability technique for the processors deployed in industrial drive (ID).

The processor provides flexible operation, re-configurability, and adaptable compatibility in industrial motor drive system. A sensitivity-based model allows a robust tool for validating the system design. Sensitivity is the probability of a partial failure rate for a distributed variable; sensitivity and failure rates are also complementary. Conversely, traditional power electronic components reliability estimating standards have overlooked it, and it is essential to update them to account for the sensitivity parameter. A new sensitivity-based reliability prediction methodology for a typical 32-bit microprocessor operating at 30ºC deployed in ID is presented to fill this gap. The proposed techniques are compared with the estimated processor reliability values obtained from various reliability standards using the validated advanced logistics development tool. The main contribution of this work is to provide a sensitivity extended reliability method over the conventional method directing toward improving reliability, availability, and maintainability in the design of ID.

The analysis shows that the sensitivity of the processor’s circuit increases due to increases in complexity of the system by reducing the overall mean time between failure upon comparing among conventional reliability standards.

The significance of this paper lies in the overall, sensitivity-based reliability technique for processors in comparison to the traditional reliability complexity in IDs.