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This paper aims to present two Anand’s model parameter sets for the multilayer silver–tin (AgSn) transient liquid phase (TLP) foils.

The AgSn TLP test samples are manufactured using pre-defined optimized TLP bonding process parameters. Consequently, tensile and creep tests are conducted at various loading temperatures to generate stress–strain and creep data to accurately determine the elastic properties and two sets of Anand model creep coefficients. The resultant tensile- and creep-based constitutive models are subsequently used in extensive finite element simulations to precisely survey the mechanical response of the AgSn TLP bonds in power electronics due to different thermal loads.

The response of both models is thoroughly addressed in terms of stress–strain relationships, inelastic strain energy densities and equivalent plastic strains. The simulation results revealed that the testing conditions and parameters can significantly influence the values of the fitted Anand coefficients and consequently affect the resultant FEA-computed mechanical response of the TLP bonds. Therefore, this paper suggests that extreme care has to be taken when planning experiments for the estimation of creep parameters of the AgSn TLP joints.

In literature, there is no constitutive modeling data on the AgSn TLP bonds.

There are several lead-free solder alloys available in the industry. Over the years, the most favorable solder composition of tin-silver-copper (Sn-Ag-Cu [SAC]) has been vastly used and accepted for joining the electronic components. It is strongly believed that the silver (Ag) content has a significant impact on the solder mechanical behavior and thus solder thermal reliability performance. This paper aims to assess the mechanical response, i.e. creep response, of the SAC solder alloys with various Ag contents.

A three-dimensional nonlinear finite element simulation is used to investigate the thermal cyclic behavior of several SAC solder alloys with various silver percentages, including 1%, 2%, 3% and 4%. The mechanical properties of the unleaded interconnects with various Ag amounts are collected from reliable literature resources and used in the analysis accordingly. Furthermore, the solder creep behavior is examined using the two famous creep laws, namely, Garofalo’s and Anand’s models.

The nonlinear computational analysis results showed that the silver content has a great influence on the solder behavior as well as on thermal fatigue life expectancy. Specifically, solders with relatively high Ag content are expected to have lower plastic deformations and strains and thus better fatigue performance due to their higher strengths and failure resistance characteristics. However, such solders would have contrary fatigue performance in drop and shock environments and the low-Ag content solders are presumed to perform significantly better because of their higher ductility.

Generally, this research recommends the use of SAC solder interconnects of high silver contents, e.g. 3% and 4%, for designing electronic assemblies continuously exposed to thermal loadings and solders with relatively low Ag-content, i.e. 1% and 2%, for electronic packages under impact and shock loadings.

The fracture mechanism of S-07 steel was investigated by observing the fracture surface of the specimens with scanning electron microscope (SEM). Furthermore, the overall elastic–plastic behaviors and the stress state evolution during the loading procedure of all specimens were simulated by FE analysis to obtain the local strain at crack nucleated location and the average triaxiality of each type of specimen.

Three types of tests under various stress states were performed to study the ductile fracture characteristics of S-07 high strength steel in quasi-static condition.

Under tensile and torsion loading conditions, S-07 steel exhibits two distinctive rupture mechanisms: the growth and internal necking of voids governs the rupture mechanism in tension dominated loading mode, while the change of void shape and internal shearing in the ligaments between voids dominants for shear conditions.

The failure criterion for S-07 steel considering the influence of the triaxial stress state was established.

This paper presents a review concerning the analytical and inverse methods of small punch creep test (SPCT) in order to evaluate the mechanical property of component material at elevated temperature.

In this work, the effects of temperature, specimen size and shape on material properties are mainly discussed using the finite element (FE) method. The analytical approaches including membrane stretching, empirical or semi-empirical solutions that are currently used for data interpretation have been presented.

The state-of-the-art research progress on the inverse method, such as non-linear optimization program and neutral network, is critically reviewed. The capabilities of the inverse technique, the uniqueness of the solution and future development are discussed.

The state-of-the-art research progress on the inverse method such as non-linear optimization program and neutral network is critically reviewed. The capabilities of the inverse technique, the uniqueness of the solution and future development are discussed.

The purpose of the study is to perform elastic stress and deformation analysis of a functionally graded hollow disk under different conditions (rotation, gravity, internal pressure, temperature with variable heat generation) and their combinations.

The classical method of solution, Navier's equation, is used to solve the governing equation. The analysis considers thermal and mechanical boundary conditions and takes into account the variation of material properties according to a power law function of the radius of the disk and grading parameter.

The findings of the study reveal distinct trends and behaviors based on different grading parameters. The influence of gravity is found to be negligible, resulting in similar patterns to the pure rotation case. Variable heat generation introduces non-linear temperature profiles and higher displacements, with stress values influenced by grading parameters.

The study provides valuable insights into the behavior of displacement and stresses in hollow disks, offering a deeper understanding of their mechanical response under varying conditions. These insights can be useful in the design and analysis of functionally graded hollow disks in various engineering applications.

The originality and value of this study lies in the consideration of various loading combinations of rotation, gravity, internal pressure and temperature with variable heat generation. Furthermore, the study of effect of various angular rotations, temperatures and pressures expands the understanding of the mechanical behavior of such structures, contributing to the existing body of knowledge in the field.