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The foundry industry incurs additional costs as a result of defective castings. Shrinkage defects are a frequent problem in ductile iron castings. It is still essential to understand how shrinkage porosity varies in size when the ductile iron composition changes. This information can be used to produce high-quality cast parts and determine the best processing conditions. The objective of this research paper is to examine the effect of carbon equivalent and inoculation on the morphology of the shrinkage defect using thermal analysis.

This study focuses on certain thermal analysis parameters, such as the angle of the first derivative curve at the solidus temperature, recalescence and its relationships to graphite nucleation and shrinkage tendency. The results of thermal analysis in terms of the cooling curve and its derivative parameters, and thorough characterizations of the shrinkage observed in cup castings produced with various melt compositions and inoculation are presented in the current study.

The proportion of caved surfaces and macro shrinkage porosity defects has been reduced as the carbon equivalent of melt increases from hypoeutectic to a hypereutectic composition. The composition that is slightly hypereutectic has the lowest shrinkage propensity. Although inoculation reduces shrinkage, the importance of this parameter differs depending on the carbon equivalent.

The percentage of macro shrinkage porosity and the angle that the cooling rate curve forms are strongly correlated. It is found that the macro shrinkage size decreases as the angle of the first derivative curve at the solidus temperature is reduced. Further, lower macroporosity is produced by a metal that has a higher nodule count in association with a greater cooling rate toward the end of the solidification process.

This paper aims to figure out the conundrum that the corrosion resistance longevity of steel wires for bridge cables was arduous to meet the requirements.

The “two-step” hot-dip coating process for cable steel wires was developed, which involved first hot-dip galvanizing and then hot-dip galvanizing of aluminum magnesium alloy. The corrosion rate, polarization curve and impedance of Zn–6Al–1Mg and Zn–10Al–3Mg alloy-coated steel wires were compared through acetate spray test and electrochemical test, and the corrosion mechanism of Zn–Al–Mg alloy-coated steel wires was revealed.

The corrosion resistance of Zn–10Al–3Mg alloy-coated steel wires had the best corrosion resistance, which was more than seven times that of pure zinc-coated steel wires. The corrosion current of Zn–10Al–3Mg alloy-coated steel wires was lower than that of Zn–6Al–1Mg alloy-coated steel wires, whereas the capacitive arc and impedance value of the former were higher than that of the latter, making it clear that the corrosion resistance of Zn–10Al–3Mg was better than that of Zn–6Al–1Mg alloy coating. Moreover, the Zn–Al–Mg alloy-coated steel wires for bridge cables had the function of coating “self-repairing.”

Controlling the temperature and time of the hot dip galvanizing stage can reduce the thickness of transition layer and solve the problem of easy cracking of the transition layer in the Zn–Al–Mg alloy coating due to the Sandelin effect.

The purpose of this paper is to study the effect of temperature on Zn–Ni alloys in ChCl–Urea.

Based on cyclic voltammetry experiments, the deposition behavior and kinetics of the Zn–Ni alloy are studied. The nucleation process of the Zn–Ni alloy is studied in detail via chronoamperometry experiments. The effects of the deposition temperature on the microstructure, Ni content and phase composition of Zn–Ni alloy coatings are investigated via scanning electron microscopy and X-ray diffraction (XRD) combined with classical thermodynamics.

The results show that with increasing temperature, the reduction peak shifts toward a more positive electric potential, which is beneficial for the co-electric deposition process, and the diffusion coefficient is estimated. With increasing temperature, the nucleation process of the Zn–Ni alloy becomes a three-dimensional instantaneous nucleation, the typical kinetic parameters are determined using the standard 3D growth proliferation control model and the Gibbs free energy is estimated. The Zn–Ni alloy coatings are prepared via normal co-deposition. With increasing temperature, the degree of crystallinity increases, the coating gradually becomes uniform and compact and the XRD peak intensity increases.

The nucleation process of the Zn–Ni alloy at different temperatures is analyzed. The diffusion coefficient D and Gibbs free energy are calculated. The contribution of the three processes at different temperatures is analyzed. The effect of temperature on the morphology of the Zn–Ni alloy coatings is studied.

This paper aims to summarise the effects of ZnO nanoparticles (0.1, 0.3, 0.5, 0.7 and 1.0 Wt.%) on the structure, mechanical, electrical and thermal stability of Sn–3.5Ag–0.5Cu (SAC355) solder alloys for high-performance applications.

The phase identification and morphology of the solders were studied using X-ray diffraction and scanning electron microscopy. Thermal parameters were investigated using differential scanning calorimetry. The elastic parameters such as Young's modulus (E) and internal friction (Q⁻¹) were investigated using the dynamic resonance technique, whereas the Vickers hardness (Hv) and creep indentation (n) were examined using a Vickers microhardness tester.

Microstructural analysis revealed that ZnO nanoparticles (NPs) were distributed uniformly throughout the Sn matrix. Furthermore, addition of 0.1, 0.3 and 0.7 Wt.% of ZnO NPs to the eutectic (SAC355) prevented crystallite size reduction, which increased the strength of the solder alloy. Mechanical parameters such as Young's modulus improved significantly at 0.1, 0.3 and 0.7 Wt.% ZnO NP contents compared to the ZnO-free alloy. This variation can be understood by considering the plastic deformation. The Vickers hardness value (Hv) increased to its maximum as the ZnO NP content increased to 0.5. A stress exponent value (n) of approximately two in most composite solder alloys suggested that grain boundary sliding was the dominant mechanism in this system. The electrical resistance (ρ) increased its maximum value at 0.5 Wt.% ZnO NPs content. The addition of ZnO NPs to plain (SAC355) solder alloys increased the melting temperature (T_m) by a few degrees.

Development of eutectic (SAC355) lead-free solder doped with ZnO NPs use for electronic packaging.

The purpose of this paper is to reveal the solute segregation behavior in the molten and solidified regions during direct chill (DC) casting of a large-size magnesium alloy slab under no magnetic field (NMF), harmonic magnetic field (HMF), pulsed magnetic field (PMF) and two types of out-of-phase pulsed magnetic field (OPMF).

A 3-D multiphysical coupling mathematical model is used to evaluate the corresponding physical fields. The coupling issue is addressed using the method of separating step and result inheritance.

The results suggest that the solute deficiency tends to occur in the central part, while the solute-enriched area appears near the fillet in the molten and solidified regions. Applying magnetic field could greatly homogenize the solute field in the two-phase region. The variance of relative segregation level in the solidified cross-section under NMF is 38.1%, while it is 21.9%, 18.6%, 16.4% and 12.4% under OPMF2 (the current phase in the upper coil is ahead of the lower coil), HMF, PMF and OPMF1 (the current phase in the upper coil lags behind the lower coil), respectively, indicating that OPMF1 is more effective to reduce the macrosegregation level.

There are few reports on the solute segregation degree in rectangle slab under magnetic field, especially for magnesium alloy slab. This paper can act a reference to make clear the solute transport behavior and help reduce the macrosegregation level during DC casting.

The purpose of this study is to reveal the effect of nano-Al₂O₃ particle addition on the nucleation/growth kinetics, microhardness, wear resistance and corrosion resistance of Co–P–xAl₂O₃ nanocomposite plating.

The kinetics and properties of Co–P–xAl₂O₃ nanocomposite plating prepared by electroplating were investigated by electrochemical measurements, scanning electron microscopy, X-ray diffraction, X-ray photoelectron spectroscopy, Vickers microhardness measurement, SRV5 friction and wear tester and atomic force microscopy.

A 12 g/L nano-Al₂O₃ addition in the plating solution can transform the nucleation/growth kinetics of the plating from the 3D progressive model to the 3D instantaneous model. The microhardness of the plating increased with the increase of nano-Al₂O₃ content in plating. The wear resistance of the plating did not adhere strictly to Archard’s law. An even and denser corrosion product film was generated due to the finer grains, with a high corrosion resistance.

The effect of different nano-Al₂O₃ addition on the nucleation/growth kinetics and properties of Co–P–xAl₂O₃ nanocomposite plating was investigated, and an anticorrosion mechanism of Co–P–xAl₂O₃ nanocomposite plating was proposed.

A new wire arc additive manufacturing (WAAM) process combined with gravity-driven powder feeding was developed to fabricate components of tungsten carbide (WC)-reinforced iron matrix composites. The purpose of this study was to investigate the particle transportation mechanism during deposition and determine the effects of WC particle size on the microstructure and properties of the so-fabricated component.

Thin-walled samples were deposited by the new WAAM using two WC particles of different sizes. A series of in-depth investigations were conducted to reveal the differences in the macro morphology, microstructure, tensile performance and wear properties.

The results showed that inward convection and gravity were the main factors affecting WC transportation in the molten pool. Large WC particles have higher ability than small particles to penetrate into the molten pool and survive severe dissolution. Small WC particles were more likely to be completely dissolved around the top surface, forming a thicker region of reticulate (Fe, W)₆C. Large WC particles can slow down the inward convection more, thereby leading to an increase in width and a decrease in the layer height of the weld bead. The mechanical properties and wear resistance significantly increased owing to reinforcement. Comparatively, samples with large WC particles showed inferior tensile properties owing to their higher susceptibility to cracks.

Fabricating metal matrix composites through the WAAM process is a novel concept that still requires further investigation. Apart from the self-designed gravity-driven powder feeding, the unique aspects of this study also include the revelation of the particle transportation mechanism of WC particles during deposition.

Wire and arc additive manufacturing (WAAM) technology-based cold metal transfer (CMT) to produce large aluminum alloy parts has become more and more popular. In WAAM, wire is the only raw material. The purpose of this paper is to study the effect of wire composition on the microstructure and properties of the ZAlCu5MnCdVA alloy deposited by WAAM.

Two thin-walled ZAlCu5MnCdVA alloys with different wire compositions were prepared by WAAM. The copper contents were 4.7% (Al-4.7Cu) and 5.0% (Al-5.0Cu), respectively. The microstructure, element distribution and evolution of precipitated phases of the two samples were characterized and analyzed by optical microscopy, scanning electron microscopy and transmission electron microscopy. Hardness and tensile properties of samples were tested, and strengthening mechanism was analyzed in detail.

The results show that grain sizes of Al-4.7Cu and Al-5.0Cu are less than 40 μm. The average mass fraction of Cu in Al matrix and the number of nanometer scale θ'' and θ' phases are the main factors affecting the tensile properties of Al-Cu alloy. Tensile properties of two materials show different characteristics at room temperature and high temperature. Al-5.0Cu is better at room temperature and Al-4.7Cu is better at high temperature. The yield strength (YS), ultimate tensile strength (UTS) and elongation in the x direction of Al-5.0Cu at room temperature are 451 ± 10.2 MPa, 486 ± 10.2 MPa and 9 ± 0.5%, respectively. The YS, UTS and elongation in the x direction of Al-4.7Cu at high temperature are 290 ± 4.5 MPa, 356 ± 7.0 MPa and 13% ± 0.2%, respectively.

Experiments show that the increase of Cu element can improve the properties at room temperature of the ZAlCu5MnCdVA alloy by WAAM, but its properties at high temperature decrease.

Pb-free solders have been developed to replace the standard Sn–Pb eutectic solder since the prohibition on Pb used in solders. The Sn–Ag–Cu series of lead-free solders is the most extensively used in the electronics industry. The Ag₃Sn, which forms during isothermal ageing, can significantly degrade solder joint reliability. Sn–Ag–Cu solder’s high price further hindered its use in the electronics industry. This paper aims to investigate different copper percentages into Sn–xCu solder alloy to improve its microstructure and strength performance.

The solder alloys used in this work were Sn–xCu, where x = 0.0, 0.3, 0.5, 0.7, 1.0 Wt.%, which was soldered onto electroless nickel immersion gold (ENIG) substrate using carbon dioxide (CO₂) gas laser. Then these samples were subjected to isothermal aging for 0, 200, 500, 1,000 and 2,000 h. The Sn–xCu solder alloy was fabricated through a powder metallurgy process.

Microstructure characterization showed that Cu addition resulted in fine and rounded shape of Cu–Sn–Ni particles. Shear strength of Sn–xCu solder joints was increased with increasing Cu content, but at aging duration of 1,000 h, it dropped slightly. It is believed that the strength improved due to the increment of diffusion rate during isothermal aging.

In a Cu–Sn solder, the recommended amount is 1.0 Wt.% of Cu. In extensive aging procedures, it was discovered that Sn1.0Cu solder improved the reliability of solder joints. The findings indicated that the innovative solder alloys might satisfy the needs of high-reliability applications.

The study shows that the right amount of Cu enhances the solidification of Sn–Cu solder, increasing the shear force of the Cu–Sn solder joint. The Sn1.0Cu exhibits a ductile fracture on the top microstructure, improving the joint’s average shear strength.

The purpose of this study is to delve into the mechanism of Si3N4 nanowires (NWs) in Sn-based solder, thereby furnishing a theoretical foundation for the expeditious design and practical implementation of innovative lead-free solder materials in the electronic packaging industry.

This study investigates the effect of adding Si₃N₄ NWs to Sn58Bi solder in various mass fractions (0, 0.1, 0.2, 0.4, 0.6 and 0.8 Wt.%) for modifying the solder and joining the Cu substrate. Meanwhile, the melting characteristics and wettability of solder, as well as the microstructure, interfacial intermetallic compound (IMC) and mechanical properties of joint were evaluated.

The crystal plane spacing and lattice constant of Sn and Bi phase increase slightly. A minor variation in the Sn58Bi solder melting point was caused, while it does not impact its functionality. An appropriate Si₃N₄ NWs content (0.2∼0.4 Wt.%) significantly improves its wettability, and modifies the microstructure and interfacial IMC layer. The shear strength increases by up to 10.74% when adding 0.4 Wt.% Si₃N₄ NWs, and the failure mode observed is brittle fracture mainly. However, excessive Si₃N₄ will cause aggregation at the junction between the solder matrix and IMC layer, this will be detrimental to the joint.

The Si₃N₄ NWs were first used for the modification of lead-free solder materials. The relative properties of composite solder and joints were evaluated from different aspects, and the optimal ratio was obtained.