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Many engineering applications in this era require new age materials; however, some classic alloys like spring steel are still used in critical applications such as aerospace, defense and automobile. To machine spring steel material, there exist various difficulties such as rapid tool wear rate, the rough surface formation of a workpiece and higher power consumption. The purpose of this paper is to address these issues, various approaches in addition to electrical discharge machines (EDM) are used such as dry EDM (DEDM) and near dry EDM (NDEDM).

This study focuses on these two approaches and their comparative analysis with respect to tool wear during machining of spring steel material. For this study, current, gap voltage, cycle time and dielectric medium pressure are considered input variables. This study shows that the near dry EDM approach yields better results. Hence, the thermo-electrical model for this approach is developed using ANSYS workbench, which is further validated by comparing with experimental results. This thermo-electrical model covers spark radius variation and formation of temperature profile due to electric discharge. Transient thermal analysis is used to simulate the electric discharge machining.

It is observed from this study that discharge environment parameters such as debris concentration and fluid viscosity largely influences the dielectric fluid pressure value. Experimental results revealed that NDEDM yields better results in comparison with DEDM as it shows a 25% lesser tool wear rate in NDEDM.

The range of predicted results and the experimental results are in close agreement, authenticating the model.

This paper aims to present the capacitance characterization of tapered dielectrophoresis (DEP) microelectrodes as micro-electro-mechanical system sensor and actuator device. The application of DEP-on-a-chip (DOC) can be used to evaluate and correlate the capacitive sensing measurement at an actual position and end station of liquid suspended targeted particles by DEP force actuator manipulation.

The capability of both, sensing and manipulation was analysed based on capacitance changes corresponding to the particle positioning and stationing of the targeted particles at regions of interest. The mechanisms of DEP sensor and actuator, designed in DOC applications were energized by electric field of tapered DEP microelectrodes. The actual DEP forces behaviour has been also studied via quantitative analysis of capacitance measurement value and its correlation with qualitative analysis of positioning and stationing of targeted particles.

The significance of the present work is the ability of using tapered DEP microelectrodes in a closed mode system to simultaneously sense and vary the magnitude of manipulation.

The integration of DOC platform for contactless electrical-driven with selective detection and rapid manipulation can provide better efficiency in in situ selective biosensors or bio-detection and rapid bio-manipulation for DOC diagnostic and prognostic devices.

The purpose of this paper is to visualize protein manipulation using dielectrophoresis (DEP) as a substantial perspective on being an effective protein analysis and biosensor method as DEP is able to be used as a means for manipulation, fractionation, pre-concentration and separation. This research aims to quantify DEP using an electrochemical technique known as cyclic voltammetry (CV), as albumin is non-visible without any fluorescent probe or dye.

The principles of DEP were generated by an electric field on tapered DEP microelectrodes. The principle of CV was analysed using different concentrations of albumin on a screen-printed carbon electrode. Using preliminary data from both DEP and CV methods as a future prospect for the integration of both techniques to do electrical quantification of DEP forces.

The size of the albumin is known to be 0.027 µm. Engineered polystyrene particle of size 0.05 µm was selected to mimic the DEP actuation of albumin. Positive DEP of the sample engineered polystyrene particle was able to be visualized clearly at 10 MHz supplied with 20 Vpp. However, negative DEP was not able to be visualized because of the limitation of the apparatus. However, albumin was not able to be visualized under the fluorescent microscope because of its translucent properties. Thus, a method of electrical quantification known as the CV technique is used. The detection of bovine serum albumin (BSA) using the CV method is successful. As the concentration of BSA increases, the peak current obtained from the voltammogram decreases. The peak current can be an indicator of DEP response as it correlates to the adsorption of the protein onto the electrodes. The importance of the results from both CV and DEP shows that the integration of both techniques is possible.

The integration of both methods could give rise to a new technique with precision to be implemented into the dialyzers used in renal haemodialysis treatment for manipulation and sensing of protein albumin.

Process variation has become a major concern in the design of many nanometer circuits, including interconnect pipelines. The purpose of this paper is to provide a comprehensive overview of types and sources of all aspects of interconnect process variations.

The impacts of these interconnect process variations on circuit delay and cross‐talk noises along with the two major sources of delays – parametric delay variations and global interconnect delays – have been discussed.

Parametric delay evaluation under process variation method avoids multiple parasitic extractions and multiple delay evaluations as is done in the traditional response surface method. This results in significant speedup. Furthermore, both systematic and random process variations have been contemplated. The systematic variations need to be experimentally modeled and calibrated while the random variations are inherent fluctuations in process parameters due to any reason in manufacturing and hence are non‐deterministic.

This paper usefully reviews process variation effects on very large‐scale integration (VLSI) interconnect.

Drilling is the first process step in creating a plated‐through hole (PTH). The purpose of the PTH is for electrically interconnecting two or more circuit locations and/or providing a means for electrical and mechanical connection of components to the MLCB.

Investigations of material parameters within the system Al, Al₂O₃, Ta, Ta₂O₅ and TaO_xN_1‐x are presented. This combination is characteristic when using Al sheet for production of substrates including electronic interconnections, vias and resistive groups. They can serve for MCMs due to the specific features of Al. The technological process includes first electrochemical oxidation of Al‐sheet as base isolation layer Al₂O₃ (50‐70μm). This process is followed by vacuum deposition of relatively thick layers of Al (2‐5μm). Each layer is then processed by lithographic methods followed by selective electro‐chemical oxidation as a help process for structuring. The development of this combined structuring method allows the simultaneous achievement of interconnections (Al) and isolation (Al₂O₃) levels with least size up to 50μm. The importance of the method consists of a vertical combination of several conductive layers of Al structured as described above, “burying” the interconnections in the insulating Al₂O₃ films. All necessary combinations and configurations of different kinds of microstrip lines are possible. The dielectric characteristics of Al₂O₃, achieved through the above mentioned method, can be changed in accordance with the parameters of the technological steps and filling of the porous structure. Thus some interesting high frequency features of microstrips are obtained. Extra advantage is the ability of combination of conductive Al layers with other types of such layers as tantalum (Ta). With Ta can be achieved other permittivity constants of the insulation layers and in combination with TaO_xN_1‐x intermediate planes of resistive groups are developed. The measurement of the stripline parameters is done by microwave technics, because the desired application of the substrates is for high‐speed digital signals in the GHz range.

An investigation to evaluate the suitability of anodised aluminium as a substrate material has shown that the relatively high coefficient of thermal expansion of the aluminium caused the brittle cermet resistors to craze giving rise to unstable resistance values whereas PTF resistors appeared to suffer no ill effects. The work was implemented in conjunction with selection of low temperature thick film conductor and resistor inks to achieve the optimum combination of anodised aluminium substrate and ink system. These inks were then printed and fired on anodised aluminium, aluminium nitride and alumina substrates, and the physical and electrical properties of the inks and substrates compared. A combination of modest success, employing polymer resistors and cermet conductors, produced viable circuits with resistors of reasonable stability. A low power hybrid device, with surface mounted components, was employed to further validate the substrate/ink combinations in ongoing tests.

Ceramic materials and glasses have become important in modern industry as well as in the consumer environment. Heat resistant ceramics are used in the metal forming processes or as welding and brazing fixtures, etc. Ceramic materials are frequently used in industries where a wear and chemical resistance are required criteria (seals, liners, grinding wheels, machining tools, etc.). Electrical, magnetic and optical properties of ceramic materials are important in electrical and electronic industries where these materials are used as sensors and actuators, integrated circuits, piezoelectric transducers, ultrasonic devices, microwave devices, magnetic tapes, and in other applications. A significant amount of literature is available on the finite element modelling (FEM) of ceramics and glass. This paper gives a listing of these published papers and is a continuation of the author's bibliography entitled “Finite element modelling of ceramics and glass” and published in Engineering Computations, Vol. 16, 1999, pp. 510‐71 for the period 1977‐1998.

The form of the paper is a bibliography. Listed references have been retrieved from the author's database, MAKEBASE. Also Compendex has been checked. The period is 1998‐2004.

Provides a listing of 1,432 references. The following topics are included: ceramics – material and mechanical properties in general, ceramic coatings and joining problems, ceramic composites, piezoceramics, ceramic tools and machining, material processing simulations, fracture mechanics and damage, applications of ceramic/composites in engineering; glass – material and mechanical properties in general, glass fiber composites, material processing simulations, fracture mechanics and damage, and applications of glasses in engineering.

This paper makes it easy for professionals working with the numerical methods with applications to ceramics and glasses to be up‐to‐date in an effective way.