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Thermal cycling tests and failure modelling were conducted on FR‐4 and cyanate ester printed circuit board (PCB) substrate materials to evaluate reliability limits tor solder and repair processes, particularly for high pin count, through‐ hole devices. The boards used were double‐sided, 0.125 in. thick with 0.029 in. diameter plated‐through holes (PTHs). Thermal cycling was accomplished using hot oil immersion at 240°C and 260°C followed by forced room‐temperature air. The average number of thermal cycles‐to‐failure was 10 for FR‐4, 20 for cyanate ester epoxy blend, and 50 for cyanate ester. Weibull statistics were used to predict failure rates for various pin count devices. Failure analysis was used to identify the mechanism of failure, and modelling was used to predict cycles‐to‐failure based on typical material properties. The primary failure mechanism was corner cracking in FR‐4 and a combination of corner cracking and barrel cracking in the cyanate ester materials. The modelling used a modified pad tilt geometry combined with Coffin‐Manson low cycle fatigue theory, which resulted in predictions of the same order as those for the cycling tests. Key material properties and process parameters were identified that controlled the failure response of the plated‐through hole and board substrate combinations.

The purpose of this paper is to prepare novel electroactive shape memory nanocomposites based on graphene and study the thermomechanical property and shape memory behavior of nanocomposites.

Graphene was dispersed in N,N-dimethylformamide, and the mixture was spooned into epoxy-cyanate ester mixtures to form graphene/epoxy-cyanate ester nanocomposites. The nanocomposites were deformed under 150°C, and shape recovery test was conducted under an electric voltage of 20-100 V.

Graphene is used to improve the shape recovery behavior and performance of shape-memory polymers (SMPs) for enhanced electrical actuation effectiveness. With increment of graphene content, the shape recovery speed of nanocomposites increases significantly.

A simple way for fabricating electro-activated SMP nanocomposites has been developed by using graphene.

The outcome of this study will help to fabricate the SMP nanocomposites with high electrical actuation effectiveness and improve the shape recovery speed of the nanocomposites.

The purpose of this paper is to study the influence of calcium sulfate whiskers (CSWs) on the thermodynamic properties and shape memory properties of epoxy/cyanate ester shape memory composites.

To improve the mechanical properties of shape memory cyanate ester (CE)/epoxy polymer (EP) resin, high performance CSWs were used to reinforce the thermo-induced shape memory CE/EP composites and the shape memory CSW/CE/EP composites were prepared by molding. The effect of CSW on the mechanical properties and shape memory behavior of shape memory CE/EP composites was investigated.

After CSW filled the shape memory CE/EP composites, the bending strength of the composites is greatly improved. When the content of CSW is 5 Wt.%, the bending strength of the composite is 107 MPa and the bending strength is increased by 29 per cent compared with bulk CE/EP resin. The glass transition temperature and storage modulus of the composites were improved in CE/EP resin curing system. However, when the content of CSW is more than 10 Wt.%, clusters are easily formed between whiskers and the voids between whiskers and matrix increase, which will lead to the decrease of mechanical properties of composites. The results of shape memory test show that the shape memory recovery time of the composites decreases with the decrease of CSW content at the same temperature. In addition, the shape recovery ratio of the composites decreased slightly with the increase of the number of thermo-induced shape memory cycles.

A simple way for fabricating thermo-activated SMP composites has been developed by using CSW.

The outcome of this study will help to fabricate the SMP composites with high mechanical properties and the shape memory CSW/CE/EP composites are expected to be used in space deployable structures.

With the ever increasing demands for high performance electronic devices there is a need for circuit board laminates that have enhanced properties when compared to conventional materials such as the widely used epoxide‐based FR4 laminates. Equipment manufacturers require boards with better mechanical stability and improved electrical characteristics. At the same time, new environmental legislation is set to drive electronics assembly temperatures much higher as manufacturers start to use lead‐free soldering processes. The legislation is also raising questions about the long‐term viability of brominated resins as the basis for imparting flame retardancy to laminates. Fortunately, laminate manufacturers have responded to these challenges by developing and introducing a wide range of new laminates that address these issues. This paper describes some of these challenges and gives an introduction to the new high performance laminates that are finding increasing use. It also highlights the need for chemical processes used in the manufacture of interconnects with laminates to be specifically optimised for the chosen substrate material.

Continuously increasing requirements drive multilayer manufacturers to search for advanced manufacturing technologies and to evaluate new materials. This paper provides an insight into new multilayer bonding methods, improvements offered by laminators, and why to select high performance materials for special applications.

Today’s emerging markets in the electronic packaging industry require some unique properties in adhesives, especially in die attach applications. In multichip module (MCM) applications, for example, the low temperature reworkability of die bonds is of primary importance, particularly if known good die (KGD) are not employed. If KGD are used in the MCM, a temporary, reworkable die adhesive is also desirable for a KGD testing programme. Large area die on organic substrates, which are key to the more portable, high power computers, require a very compliant adhesive to absorb the high mismatch in expansions. An overview of the present adhesive technologies reveals some serious limitations in their application and performance. Traditional Ag epoxies, primarily because of their irreversible ‘thermosetting’ during cure, do not fulfill all the material requirements. Thermoplastic chemistries are ideal candidates for MCMs because of their reversible melting and resolidification properties. This paper details the development of a novel silver loaded thermoplastic paste that overcomes most of the deficiencies seen in present day adhesives. One of the main obstacles that has hindered the use of thermoplastic pastes as an adhesive has been the slow solvent extraction during the curing step. With current technology, this inherently slow solvent extraction typically requires a complex process of first depositing a flat profile, then removing the solvent with a pre‐drying step, and finally attaching the die by a heat/pressure step. A blend of components, hereafter referred to as DM4030, has been tested and compared against conventional materials in the industry. Functional properties of adhesion, resistivity, wire bonding and others are summarised for various temperature profiles. Long‐term reliability test results are shown for temperature cycling, temperature/humidity (85° C, 85% RH), and high temperature storage. For reworkability applications, die removal force as a function of temperature is also presented.

The market for PCMCIA or PC cards is the fastest growing market in today's printed wiring board market. It represents a very important opportunity for the North American marketplace because the increased use of these materials denotes significant growth opportunities for an industry which has stagnated with the general economic downturn. This opportunity is not without significant challenges. The printed wiring boards required for these miniaturised circuits are 4,6 and 8 layers, but with overall finished board thicknesses of 15 to 24 mils. This means that individual layers within the multilayer construction will be in the 1.5 to 5 mil range, with significant demand for materials in the 2 mil range. Laminators will face the challenge of producing ultra‐thin materials economically with the appropriate performance characteristics. This paper focuses on the efforts required of laminators to meet this challenge, discussing capabilities to produce materials in large sheet formats necessary for the required economics. It addresses equipment, handling and overall processing issues from the laminator's point of view. Significant discussion focuses on the capability of laminate raw materials to supply acceptable laminates. In areas where these materials fall short, co‐operative development efforts are discussed for designing and evaluating materials specifically for this area of application.

The purpose of this paper is to provide a review of the technology and applications of shape‐memory materials (SMMs).

This paper initially considers various classes of SMMs and their properties. It then discusses applications and concludes with a brief review of recent research and future prospects.

SMMs include shape‐memory alloys (SMAs), ferromagnetic SMAs (FSMAs) and shape‐memory polymers (SMPs), which change shape when influenced by temperature and other stimuli. SMAs comprising nickel‐titanium alloys were discovered and commercialised first and find uses in fittings, seals, valves, actuators and medical devices due to their thermoelastic properties. Their pseudoelastic properties are exploited in spectacle frames and other deformable metal products. FSMAs and SMPs were discovered more recently and are at an early stage of commercialisation and remain the topic of on‐going research. Pilot applications are being investigated in the healthcare, aerospace, automotive and other industries. All classes of SMMs have prospects for more widespread uses in the future.

Provides a detailed review of SMM materials, products and application and an insight into future developments.

For a considerable time moisture level has been a problem for hermetic package assembly, although the materials used were only metallics. Today semiconductor technology is cost driven, therefore organic materials must be taken into account. Obviously there are many different issues involved. This paper focuses on mechanisms involving hermetic packages with silver glass die attach material. Silver glass, as a die attach paste, is mixed with organic solvents, so different chemical reactions are studied. It is then shown how to achieve a low moisture level. the authors' company has performed a design of experiments (DoX) in order to identify the key parameters and their interactions. A mathematical prediction model has been determined, and the result of this theoretical study is confirmed with experimental results.

The purpose of this study was to investigate the microstructural evolution and hydrolytic stability of poly(phenylborosiloxane) (PPhBS) to further use and develop the oligomers as heat-resistant modifiers.

PPhBS was synthesized by direct co-condensation of boric acid (BA) and phenyltriethoxysilane (PTEOS). The structural evolution of PPhBS at high temperature was investigated by Fourier transform infrared (FTIR) spectroscopy, thermogravimetric analysis (TGA), differential thermal analysis (DTA), in situ diffuse reflectance infrared Fourier transform spectroscopy (DRIFTS) and 29Si nuclear magnetic resonance (NMR) spectroscopy. In addition, the change in the morphology of the PPhBS powder was examined to demonstrate the evolution of the chemical bonds, and the hydrolytic stability of PPhBS was investigated by a combination of X-ray diffraction (XRD) analysis, measurement of the mass loss in water and FTIR spectroscopy.

The results revealed that a cross-linking network was gradually formed with increasing temperature through the condensation of the residual hydroxyl groups in PPhBS, and the Si-OH and B-OH bonds remained even at a high temperature of 450°C. Furthermore, heat treatment improved the hydrolytic stability of the oligomer. The hydrolysis of the B-O-B bonds in PPhBS was reversible, whereas the Si-O-Si and Si-O-B bonds were highly resistant to hydrolysis.

The prepared PPhBS can be used as a heat-resistant modifier in adhesives, sealants, coatings and composite matrices.

Investigation of the structural evolution of a polyborosiloxane at high temperature by DRIFTS is a novel approach that avoided interference from moisture in the air. The insoluble mass fraction and the FTIR spectrum of PPhBS washed with water were used to investigate the hydrolytic stability of PPhBS.