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1 – 10 of 13
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Article
Publication date: 1 December 2004

42

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Microelectronics International, vol. 21 no. 3
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 1 August 2004

27

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Soldering & Surface Mount Technology, vol. 16 no. 2
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 1 December 2001

40

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Soldering & Surface Mount Technology, vol. 13 no. 3
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 1 December 2001

25

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Microelectronics International, vol. 18 no. 3
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 8 May 2009

25

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Microelectronics International, vol. 26 no. 2
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 1 December 2001

20

Abstract

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Soldering & Surface Mount Technology, vol. 13 no. 3
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 1 December 1996

P. Swanson

Light radiation cure adhesives, coatings and encapsulants are being used in the electronics manufacturingindustry with increasing frequency because their properties and…

86

Abstract

Light radiation cure adhesives, coatings and encapsulants are being used in the electronics manufacturing industry with increasing frequency because their properties and process advantages are a good fit for the manufacturing requirements which are demanded by current industry drivers, such as miniaturisation, environmental and health & safety demands, manufacturing yield improvement and total product cost. Light curing adhesive systems in the electronics manufacturing industry have found applications in strain relief, wire and parts tacking, coil terminating, tamper‐proofing, structural bonding, temporary masking, potting, encapsulation, glob topping, conformal coating, and surface mount component attachment. This paper describes three case histories where photo cure adhesives were introduced to an electronics manufacturing environment, and discusses their rationale, implementation and their economics. The case histories encompass printed circuit board assembly (including surface mount), electronics packaging and microelectronic encapsulation. Production managers and process engineers are given confidence that practical adhesive application can be clean, fast and economical.

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Soldering & Surface Mount Technology, vol. 8 no. 3
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 29 June 2010

32

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Soldering & Surface Mount Technology, vol. 22 no. 3
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 1 December 2005

29

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Soldering & Surface Mount Technology, vol. 17 no. 4
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 1 April 2004

228

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Soldering & Surface Mount Technology, vol. 16 no. 1
Type: Research Article
ISSN: 0954-0911

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