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This paper aims to report the investigations of capacitors and inductors embedded into printed circuit boards (PCBs) designed in various layouts.

The research were focused on the components embedded into four-layer PCBs with different structures of the inner layers. Three special capacitive laminates for manufacturing of thin-film embedded capacitors and several types of coils in the form of a spiral, meander and solenoid are described. In addition, a part of the spiral-type coils was formed with an aperture in the center in which the magnetic core, made of soft magnetic composites’ material was placed to increase the coil inductance.

Various constructions of embedded capacitors and coils were designed and manufactured. Capacitance and loss tangent of capacitors to determine the repeatability of the production process were determined. Capacitor’s long-term stability analysis was performed by exposing test samples to elevated temperatures (70, 100 or 130°C), realized with the aid of heating plate, for at least 160 h. The temperature characteristics for the capacitance and loss tangent from 15 to 100°C were determined. Also the induction of different designs and layouts coils was determined.

The wide parameters’ characterization of capacitors and coils embedded into PCBs allow the analysis of their properties with regard to their practical application. The promising results of the realized measurements show that the capacitors and induction coils with studied structures can be widely used in the construction of embedded circuits into PCBs (e.g. filters, radio frequency identification systems and generators).

The purpose of this paper is to investigate the basic functional parameters of passive embedded components in printed circuit boards (PCBs) under environmental exposures such as thermal-humidity and thermal exposure.

The investigations were based on the thin-film resistors made of NiP alloy, thick-film resistors made of carbon or carbon–silver inks, embedded capacitors made of FaradFlex materials and embedded inductor made in various configurations. The capacitors and thin- and thick-film resistors were tested in the climatic chamber in conditions of thermal-humidity exposure at 85°C and 85 per cent RH for 500 h. The embedded inductors were tested in two different environmental conditions: thermal-humidity exposure at 60°C and 95 per cent RH, and thermal exposure at 150°C and additionally at the temperature in the range of +25°C to +150°C.

Studies show that in the case of embedded capacitors, the changes caused by exposure to thermal-humidity are durable and lead to the capacity increase. The embedded thin-film resistors behave in the same manner, whereas the thick-film resistors were the least resistant to the conditions of exposure. Most of the polymer thick-film resistors have been damaged. The changes of coils' properties during aging are small, and what is most important is that, after some time of exposure, their parameters stabilize at a particular level. The changes resulting from the increase in temperature are typically related to the change of material resistance (Cu) of which coils are made, and as such, they cannot be avoided but they can be predicted.

The realized studies allowed determination of the properties of the embedded passive elements with respect to specific environmental exposures. The studies show that embedded resistors can be used interchangeably with chip passive elements. It allows saving the area on the surface of PCB, occupied by these passive elements, for assembly of active elements integrated circuits (ICs) and thus enabling the miniaturization of electronic devices.

The knowledge about the behavior of the operating parameters of embedded components, considering the environmental conditions, allows for development of more complex systems with integrated PCBs.

The purpose of this paper is to investigate the behavior of embedded passives under changing temperature conditions. Influence of different temperature changes on the basic properties of embedded passives was analyzed. The main reason for these investigations was to determine functionality of passives for space application.

The investigations were based on the thin-film resistors made of Ni-P alloy, thick-film resistors made of carbon or carbon-silver inks, embedded capacitors made of FaradFlex materials and embedded inductor made in various configurations. Prepared samples were examined under the influence of a constant elevated temperature (100, 130 or 160°C) in a long period of time (minimum of 30 h), thermal cycles (from −40 to +85°C) or thermal shocks (from −40 to +105°C or from −40 to +125°C).

The achieved results revealed that resistance drift became bigger when the samples were treated at a higher constant temperature. At the same time, no significant difference in change in electrical properties for 50 and 100 Ω resistors was noticed. For all the tests, resistance change was below 2 per cent regardless of a value of the tested resistors. Conducted thermal shock studies indicate that thin-film resistors, coils and some thick-film resistors are characterized by minor variations in basic parameters. Some of the inks may show considerable resistance variations with temperature changes. Significant changes were also exhibited by embedded capacitors.

The knowledge about the behavior of the operating parameters of embedded components considering environmental conditions allow for development of more complex systems with integrated printed circuit boards.

The purpose of this study was the use of embedded components technology and innovative concepts of the printed circuit board (PCB) for electronic modules containing field-programmable gate array (FPGA) devices with a large number of pins (e.g. Virtex 6, FF1156/RF1156 package, 1,156 pins).

In the multi-layered boards, embedded passive components that support FPGA device input/output (I/O), such as blocking capacitors and pull-up resistors, were used. These modules can be used in rapid design of electronic devices. In the study, the MC16T FaradFlex material was used for the inner capacitive layer. The Ohmega-Ply RCM 25 Ω/sq material was used to manufacture pull-up resistors for high-frequency pins. The embedded components have been connected to pins of the FPGA component by using plated-through holes for capacitors and blind vias for resistors. Also, a technique for a board-to-board joining, by using castellated terminations, is described.

The fully functional modules for assembly of the FPGA were manufactured. Achieved resistance of embedded micro resistors, as small as the smallest currently used surface-mount device components (01005), was below required tolerance of 10 per cent. Obtained tolerance of capacitors was less than 3 per cent. Use of embedded components allowed to replace the pull-up resistors and blocking capacitors and shortens the signal path from the I/O of the FPGA. Correct connection to the castellated terminations with a very small pitch was also obtained. This allows in further planned studies to create a full signal distribution system from the FPGA without the use of unreliable plug connectors in aviation and space technology.

This study developed and manufactured several innovative concepts of signal distribution from printed circuit boards. The signal distribution solutions were integrated with embedded components, which allowed for significant reduction in the signal path. This study allows us to build the target object that is the module for rapid design of the FPGA device. Usage of a pre-designed module would lessen the time needed to develop a FPGA-based device, as a significant part of the necessary work (mainly designing the signal and power fan-out) will already be done during the module development.

This paper aims to investigate the usability of the nickel copper zinc ferrite with the composition Ni_0.4Cu_0.2Zn_0.4Fe_1.98O_3.99 for the realization of high-temperature multilayer coils as discrete components and integrated, buried function units in low temperature cofired ceramics (LTCC).

LTCC tapes were cast and test components were produced as multilayer coils and as embedded coils in a dielectric tape. Different metallization pastes are compared. The properties of the components were measured at room temperature and higher temperature up to 250°C. The results are compared with simulation data.

The silver palladium paste revealed the highest inductance values within the study. The measured characteristics over a frequency range from 1 MHz to 100 MHz agree qualitatively with the measurements obtained from toroidal test samples. The inductance increases with increasing temperature and this influence is lower than 10%. The characteristic of embedded coils is comparable with this of multilayer components. The effective permeability of the ferrite material reaches values around 130.

The research results based on a limited number of experiments; therefore, the results should be verified considering higher sample sizes.

The results encourage the further investigation of the material Ni_0.4Cu_0.2Zn_0.4Fe_1.98O_3.99 for the use as high-temperature ferrite for the design of multilayer coils with an operation frequency in the range of 5-10 MHz and operation temperatures up to 250°C.

It is demonstrated for the first time, that the material Ni_0.4Cu_0.2Zn_0.4Fe_1.98O_3.99 is suitable for the realization of high-temperature multilayer coils and embedded coils in LTCC circuit carriers with high performance.

Low temperature cofired ceramics (LTCCs) combine the advantages of both multilayer substrates with excellent high‐frequency properties and a high‐conductivity metallisation. The possibility to realise passive components embedded in the glass ceramics increases the scale of integration. Inductors are designed as single‐layer (planar spiral) or multilayer (3D) arrangements of narrow conductive traces with useful values up to a few hundred nanohenry. This range makes them useful for high‐frequency applications. Although the conductor pastes used have a low resistance, the maximum quality factor of these coils seldom exceeds 60. The decisive parameter in this regard is the line thickness which is normally 10–15 μm. A novel technique based on laser scribed canals permits conductor patterns with an almost square cross‐section, thus reducing the line resistance by a factor up to 10. Coils manufactured by this method have a considerably improved quality and are able to withstand high currents. This property widens the range of applications for LTCCs into the field of high‐power electronics.

Ni‐ferrite powder average grain size less than 0.9µm was used for the ferrite paste preparation. Ferrite paste was printed on Al2O3 substrate and fired 850°C/10min. After Ni‐ferrite thick film characterization had been done, simple planar inductor geometry, such as square spirals, were printed on it. Measurements were done, using an HP 4194A impedance analyser. The experimental results were summarized and compared with theoretical predictions given by the electromagnetic analysis using the method of current images for the reason of accounting the effect of magnetic substrate. The computer program, developed here, allows determination of the required thickness of the substrate which will produce inductance enhancement of the given permeability of the substrate material. The same results can also be used to determine the permeability of magnetic film or substrate quickly and are directly applicable to the design of the planar inductors.

The aim of this paper is to propose a design procedure based on the impedance boundary condition in order to simplify the design of inductors for domestic induction heating systems.

An electromagnetic description of the inductor system is performed to substitute the effects of a component, named system load, for a mathematical condition, the so‐called impedance boundary condition. This is suitable to be used in electromagnetic systems involving high conductive materials at medium frequencies, as it occurs in an induction heating system. Applying this approach, a simplified electrical model arises from the general system.

A considerable reduction in the efforts devoted to design a coil for induction heating purposes is achieved, because the solution considering the variation of three physical parameters are projected to a one‐dimensional space only depending on a single parameter named corrected penetration depth. This proposal assesses the working conditions of standard induction systems.

This work is performed to achieve a better understanding of the fundamentals involved in the electromagnetic modeling of an induction heating system. The main goal is the definition of a better coil design process because it is probably the most time‐consuming task in the construction of a complete induction system.

In this paper, the so‐called corrected penetration depth is defined. This single parameter allows explaining the influence of the physical parameter of the inductor load and the excitation frequency in the equivalent of the complete inductor system. The numerical results carried out considering the corrected penetration depth instead of the physical load properties have been validated experimentally.

High Q on‐chip inductors and low loss on‐chip interconnects and transmission lines are an important roadblock for the further development of Si‐based technologies at RF and microwave frequencies. In this paper, inductors are realized on standard Si wafers (20 Ω.cm) using MCM‐D processing. This consists of realizing two low K dielectric layers (BCB) and a thick Cu interconnect layer. Inductors with 5 μm lines and spaces are demonstrated for a 5 μm thick Cu layer, hereby leading to a very compact and high performance inductors: Q‐factors in the range of 25 to 30 have been obtained for inductances in the range of 1 to 5 nH. It is also shown how the Q‐factor and resonance frequency vary as a function of the inductor layout parameters and the thickness of the BCB and Cu layers. The realized 50 Ω CPW lines (lateral dimension of 40 μm) have a measured loss of only 0.2 dB/mm at 25 GHz.

The purpose of this paper is to analyze a presentation of eddy current sensing coils for the turbo charger speed measurement, which were manufactured with the low temperature co-fired ceramic (LTCC) technology. The goal is to be able to manufacture small robust coils with complex geometries and improved signal output.

A crucial element for its performance is the quality factor of the embedded coil. Thanks to the use of the developed LTCC manufacturing processes, the lateral wounding distance of the printed coils can be reduced to 30 µm, and simultaneously, the aspect ratio should be enlarged compared to standard LTCC technologies. By the use of a novel printed double-D coil design, the overall sensor characteristics will be improved.

The metallization thickness can be simultaneously enhanced that results in the internal resistance being reduced. Thus, the inductivity and the ohmic resistance achieve an obvious optimization that results in significant improvement of the quality factor of the novel coils when compared to standard technologies. Embedded micro coils have a sintered metallization aspect ratio of more than one and thus an optimal performance differing clearly from prior art. Their reliability was proven through temperature cycle tests of over more than 1,300 h.

The developed LTCC coil technology will be introduced in the JAQUET sensor portfolio of TE Connectivity for the measurement of turbocharger speed on both passenger cars and trucks. The measurement and control of turbochargers speed enables the optimal regulation of airflow into the engine thereby improving the fuel economy and leading to a reduction of engine emissions.

This paper shows fabrication and performance of the original manufactured LTCC coil for turbocharger speed sensors and its optimized signal output by the novel design.