Search results

The purpose of this paper is to solve the issue of via filling and pattern plating simultaneously by concentration optimization of accelerator and leveler in the electroplating bath.

This paper designs a series of experiments to verify the performance of pattern plating with the via filling plating formula. Then the compositions of electroplating solution are optimized to achieve via filling and pattern plating simultaneously. Finally, the mechanism of co-plating for via and line is discussed in brief.

To achieve excellent performance for via filling and pattern plating simultaneously, proportion of additives are comprehensively considered in optimization of electroplating process. Effects of additives on the via filling and pattern plating should be taken into consideration, especially in achieving flat lines.

This paper discusses the different effects of accelerator and leveler on the via filling and the pattern plating, respectively. The process of co-plating for the via and the line is presented. The superfilling of via and the flat line are simultaneously obtained with the optimized via filling formula.

The adsorption and acceleration behavior of 3-mercaptopropyl sulfonate (MPS) were investigated by electrochemical tests for microvia filling by copper electroplating.

The synergistic effects of one suppressor of propylene oxide ethylene oxide propylene oxide named PEP and MPS as the accelerator during copper electroplating were also investigated by electrochemical methods such as electrochemical impedance spectroscopy cyclic voltammetric stripping (CVS) and Galvanostatic measurements (GMs).

The research results suggest that the adsorption of MPS onto the Cu-RDE metal surface was a spontaneous process and the adsorbing of MPS on cathode was proposed to physical-chemistry adsorption in the plating formula. There was no potential difference (i.e. ?? = 0) of GMs until MPS was injected into the plating solution suggest that copper deposition is not diffusion-controlled in the presence of PEP–Cl–JGB.

A new composition of plating bath was found to be effective to perform bottom-up copper filling of microvias in the fabrication of PCB in electronic industries. The adsorption of MPS into the Cu-RDE metal surface was a spontaneous process and the adsorbing of MPS on cathode was studied by EIS and the results proposed to physical-chemistry adsorption in the plating formula. An optimal plating solution composed of CuSO4, H2SO4, chloride ions, PEP, MPS and JGB was obtained, and the microvia could be fully filled using the plating formula.

Electroplated coatings of zinc have been successful in protecting steel components against corrosion for many years. However, with the introduction of more exacting standards, the performance of the traditional zinc finish has not been considered up to the mark. Alternative protective systems have been offered as replacements but none has been entirely able to compete cost‐effectively with the electroplating process.

The purpose of this paper is to investigate the electrodeposition of copper coatings directly onto AZ31 magnesium alloy, considered as a substrate of electroplating nickel. The additive, pH, complexing agent, current density, time, and temperature of electrolytic bath were studied to understand electrodepositing copper coating on AZ31 magnesium alloy.

Electrodeposition of copper was carried out in an aqueous solution containing copper hydroxide, citrate, and fluorine ion, which avoids the replacement or corrosion of the magnesium alloy. The morphology, structure, and interface of the electrodeposited copper coating were investigated by a scanning electron microscope (SEM).

The copper coating was dense, and there was good adhesion of the copper coating on the AZ31 magnesium alloy. This suggests that successful deposition of copper using an electroplating process could decrease the cost of coating AZ31 magnesium alloy.

This paper will be helpful for the development of coating on magnesium alloy using electroplating processes.

Copper hydroxide and citrate were the main compositions of the electrolyte, combined with sodium poly dipropyl (SP) and polyethylene glycol (PEG) as brightening agents and can be used to electrodeposit copper directly onto AZ31 magnesium alloy.

Insoluble anodes have long been used as an alternative to the preferred soluble types, primarily for their practicality and without great attention to their efficacy. However, since about 1970 so‐called catalytic anodes, typified by platinised titanium, have been increasingly used for electrochemical processes without too much attention to possible side‐effects. The purpose of this paper is, therefore, to review the types of commercially available catalytic anodes and their electrochemical properties, particularly with respect to acid copper electroplating.

Commercially available catalytic anodes were obtained from various anode suppliers and their electrochemical properties and behaviour with respect to acid copper electroplating were studied.

While the oxidising capability of catalytic anodes is undisputed, it can lead to oxidation of organic species in electroplating solutions. This in turn can lead to loss of control and additional costs for additives in electrodeposition. This study has addressed the issue and the paper attempts to set down some data‐based rules for the selection process. It also discusses some ways of optimising the choice of anode for acid copper processing of printed circuit‐related processes.

The paper determines the benefits and problems associated with the utilization of catalytic anodes in acid copper electroplating baths and, in particular, their effect on brightener consumption. It describes the factors affecting this phenomenon and describes a novel method for overcoming it.

The purpose of this paper is to overview the effect of electroplating current wave forms on Cu filling of through‐silicon‐vias (TSV) for three‐dimensional (3D) packaging.

The paper takes the form of a literature review.

Effective TSV technology for 3D packaging involves various processes such as via formation, filling with conductive material, wafer thinning, and chip stacking. Among these processes, high‐speed via filling without defect is very important for applying the TSV process to industry with a lower production cost. In this paper, the effects of various current forms on Cu electroplating of TSV such as direct current (DC), pulse current (PC), pulse reverse current (PRC), and periodic pulse reverse current (PPR) are described in detail including recent studies.

TSV is a core technology for high density 3D packaging. This paper overviews the recent studies of various current forms on Cu‐filling of TSV.

In recent years considerable research has been carried out on the metallising of plastics. It has long been realised that there could be many important industrial applications, especially in the field of corrosion resistance, if the surface hardness and moisture permeability of plastics could be improved by a durable coating of metal. In the purely decorative department, where appearance is more important than length of service, it must be admitted that the demand has been fairly satisfactorily met by such processes as vacuum deposition, with or without electroplating. In the industrial sphere, however, the picture has not been quite so encouraging and the product has fallen short in many ways.

To develop electrode materials for supercapacitor with superior electrochemical performance and simple preparation process, the purpose of this study is to prepare flexible CC/NiS/a-NiS electrodes with self-supporting structure by loading hydrothermally synthesized a-NiS particles along with nano-NiS on carbon cloth by electroplating method.

The effects of current densities, temperatures and pH values on the loading amount and uniformity of the active substances during the plating process were investigated on the basis of optimization of surface morphology, crystalline structure and electrochemical evaluation as the cyclic voltammetry curves, constant current charge–discharge curves and AC impedance.

The a-NiS particles on CC/NiS/a-NiS were mostly covered by the plated nano-NiS, which behaved as a bulge and provided a larger specific surface area. The CC/NiS/a-NiS electrode prepared with the optimized parameter exhibited a specific capacitance of 115.13 F/g at a current density of 1 A/g and a Coulomb efficiency of 84% at 5 A/g, which is superior to that of CC/NiS electrode prepared by electroplating at a current density of 10 mA/cm², a temperature of 55°C and a pH of 4, demonstrating its fast charge response of the electrode and potential application in wearable electronics.

This study provides an integrated solution for the development of specifically structured NiS-based electrode for supercapacitor with simple process, low cost and high electrochemical charge/discharge performance, and the simple and easy-to-use method is also applicable to other electrochemically active composites.