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Article
Publication date: 2 January 2024

Chongbin Hou, Yang Qiu, Xingyan Zhao, Shaonan Zheng, Yuan Dong, Qize Zhong and Ting Hu

By investigating the thermal-mechanical interaction between the through silicon via (TSV) and the Cu pad, this study aimed to determine the effect of electroplating defects on the…

Abstract

Purpose

By investigating the thermal-mechanical interaction between the through silicon via (TSV) and the Cu pad, this study aimed to determine the effect of electroplating defects on the upper surface protrusion and internal stress distribution of the TSV at various temperatures and to provide guidelines for the positioning of TSVs and the optimization of the electroplating process.

Design/methodology/approach

A simplified model that consisted of a TSV (100 µm in diameter and 300 µm in height), a covering Cu pad (2 µm thick) and an internal drop-like electroplating defect (which had various dimensions and locations) was developed. The surface overall deformation and stress distribution of these models under various thermal conditions were analyzed and compared.

Findings

The Cu pad could barely suppress the upper surface protrusion of the TSV if the temperature was below 250 ?. Interfacial delamination started at the collar of the TSV at about 250 ? and became increasingly pronounced at higher temperatures. The electroplating defect constantly experienced the highest level of strain and stress during the temperature increase, despite its geometry or location. But as its radius expanded or its distance to the upper surface increased, the overall deformation of the upper surface and the stress concentration at the collar of the TSV showed a downward trend.

Originality/value

Previous studies have not examined the influence of the electroplating void on the thermal behavior of the TSV. However, with the proposed methodology, the strain and stress distribution of the TSV under different conditions in terms of temperature, dimension and location of the electroplating void were thoroughly investigated, which might be beneficial to the positioning of TSVs and the optimization of the electroplating process.

Details

Multidiscipline Modeling in Materials and Structures, vol. 20 no. 1
Type: Research Article
ISSN: 1573-6105

Keywords

Article
Publication date: 12 August 2021

Zhihong Sun and Jing Wang

The purpose of this paper is to solve the issue of via filling and pattern plating simultaneously by concentration optimization of accelerator and leveler in the electroplating…

Abstract

Purpose

The purpose of this paper is to solve the issue of via filling and pattern plating simultaneously by concentration optimization of accelerator and leveler in the electroplating bath.

Design/methodology/approach

This paper designs a series of experiments to verify the performance of pattern plating with the via filling plating formula. Then the compositions of electroplating solution are optimized to achieve via filling and pattern plating simultaneously. Finally, the mechanism of co-plating for via and line is discussed in brief.

Findings

To achieve excellent performance for via filling and pattern plating simultaneously, proportion of additives are comprehensively considered in optimization of electroplating process. Effects of additives on the via filling and pattern plating should be taken into consideration, especially in achieving flat lines.

Originality/value

This paper discusses the different effects of accelerator and leveler on the via filling and the pattern plating, respectively. The process of co-plating for the via and the line is presented. The superfilling of via and the flat line are simultaneously obtained with the optimized via filling formula.

Details

Circuit World, vol. 49 no. 2
Type: Research Article
ISSN: 0305-6120

Keywords

Article
Publication date: 3 November 2022

Xiaoping Lin, Xiaoyan Li, Jiming Yao, Xianghong Li and Jianlin Xu

To develop electrode materials for supercapacitor with superior electrochemical performance and simple preparation process, the purpose of this study is to prepare flexible…

Abstract

Purpose

To develop electrode materials for supercapacitor with superior electrochemical performance and simple preparation process, the purpose of this study is to prepare flexible CC/NiS/a-NiS electrodes with self-supporting structure by loading hydrothermally synthesized a-NiS particles along with nano-NiS on carbon cloth by electroplating method.

Design/methodology/approach

The effects of current densities, temperatures and pH values on the loading amount and uniformity of the active substances during the plating process were investigated on the basis of optimization of surface morphology, crystalline structure and electrochemical evaluation as the cyclic voltammetry curves, constant current charge–discharge curves and AC impedance.

Findings

The a-NiS particles on CC/NiS/a-NiS were mostly covered by the plated nano-NiS, which behaved as a bulge and provided a larger specific surface area. The CC/NiS/a-NiS electrode prepared with the optimized parameter exhibited a specific capacitance of 115.13 F/g at a current density of 1 A/g and a Coulomb efficiency of 84% at 5 A/g, which is superior to that of CC/NiS electrode prepared by electroplating at a current density of 10 mA/cm2, a temperature of 55°C and a pH of 4, demonstrating its fast charge response of the electrode and potential application in wearable electronics.

Originality/value

This study provides an integrated solution for the development of specifically structured NiS-based electrode for supercapacitor with simple process, low cost and high electrochemical charge/discharge performance, and the simple and easy-to-use method is also applicable to other electrochemically active composites.

Details

Pigment & Resin Technology, vol. 53 no. 3
Type: Research Article
ISSN: 0369-9420

Keywords

Article
Publication date: 23 February 2024

Guangwei Liang, Zhiming Gao, Cheng-Man Deng and Wenbin Hu

The purpose of this study is to reveal the effect of nano-Al2O3 particle addition on the nucleation/growth kinetics, microhardness, wear resistance and corrosion resistance of…

Abstract

Purpose

The purpose of this study is to reveal the effect of nano-Al2O3 particle addition on the nucleation/growth kinetics, microhardness, wear resistance and corrosion resistance of Co–P–xAl2O3 nanocomposite plating.

Design/methodology/approach

The kinetics and properties of Co–P–xAl2O3 nanocomposite plating prepared by electroplating were investigated by electrochemical measurements, scanning electron microscopy, X-ray diffraction, X-ray photoelectron spectroscopy, Vickers microhardness measurement, SRV5 friction and wear tester and atomic force microscopy.

Findings

A 12 g/L nano-Al2O3 addition in the plating solution can transform the nucleation/growth kinetics of the plating from the 3D progressive model to the 3D instantaneous model. The microhardness of the plating increased with the increase of nano-Al2O3 content in plating. The wear resistance of the plating did not adhere strictly to Archard’s law. An even and denser corrosion product film was generated due to the finer grains, with a high corrosion resistance.

Originality/value

The effect of different nano-Al2O3 addition on the nucleation/growth kinetics and properties of Co–P–xAl2O3 nanocomposite plating was investigated, and an anticorrosion mechanism of Co–P–xAl2O3 nanocomposite plating was proposed.

Details

Anti-Corrosion Methods and Materials, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 0003-5599

Keywords

Article
Publication date: 29 June 2023

Yesen Zhu, Cheng-Qing Gu, Jinliang Wang, Xiaohui Xi and Zhenbo Qin

The purpose of this paper is to study the effect of chromium content on the microstructure and corrosion resistance of Ni-Cr coating.

Abstract

Purpose

The purpose of this paper is to study the effect of chromium content on the microstructure and corrosion resistance of Ni-Cr coating.

Design/methodology/approach

Ni-Cr coating was prepared by pulse current electrodeposition with trivalent chromium. On the basis of studying effect of electroplating parameters on composition and morphology, Ni-Cr alloy coatings with various chromium contents were obtained. The microstructure was characterized by scanning electron microscopy, X-ray diffractometer and transmission electron microscopy. Corrosion behavior was studied by potentiodynamic polarization and electrochemical impedance spectroscopy techniques.

Findings

Electrodeposited chromium was solidly dissolved in nickel and refined the grain of the coating. With the increase of Cr content, the corrosion resistance of Ni-Cr coating was enhanced, which is due to the formation of continuous nickel hydroxide and compact chromium oxide passive films.

Originality/value

Ni-Cr alloy coating without penetration crack was prepared in trivalent chromium electrolyte, and the mechanism of its excellent corrosion resistance was proposed.

Details

Anti-Corrosion Methods and Materials, vol. 70 no. 5
Type: Research Article
ISSN: 0003-5599

Keywords

Article
Publication date: 30 October 2023

Aizhan Doshibekova, Indira Jurinskaya, Salikh Tashpulatov, Raushan Zhilisbayeva, Lazzat Sarttarova, Rustam Akbarov and Marzhan Kalmakhanova

This paper aims to study the possibility of electroplating copper coatings on chemically and chemical-galvanically nickel-plated acrylic fibers, to be further processed into yarn…

Abstract

Purpose

This paper aims to study the possibility of electroplating copper coatings on chemically and chemical-galvanically nickel-plated acrylic fibers, to be further processed into yarn, fabrics, knitwear and nonwoven materials.

Design/methodology/approach

Electrically conductive fibers with different copper contents have been obtained, and the effect of electrolyte pH, its composition, current strength at the first and second cathodes, as well as the metallization time on the electrophysical, physical and mechanical properties of copper-containing fibers, has been studied.

Findings

The studies have shown that with an increase in the copper content, the electrical conductivity, the uniformity of the coating and the uniformity of the electrophysical properties (for chemical-galvanically nickel-plated fiber) increase. In the case of copper plating of chemically nickel-plated fiber, the coefficient of variation in electrical resistance increases with increasing plating time, even though the copper content increases, and the coefficient of variation in copper content and electrical resistance decreases. The physical and mechanical properties of copper-containing fibers differ slightly from the original (subjected to copper plating) and industrial Nitron fibers. With copper plating, the strength of the fiber practically does not decrease, and the elongation decreases somewhat, compared with the mass-produced Nitron fiber.

Originality/value

The physical and mechanical properties of copper-containing fibers are quite high, which makes it possible to be successfully further processed into yarn, fabrics, knitwear and nonwoven materials.

Details

Research Journal of Textile and Apparel, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 1560-6074

Keywords

Article
Publication date: 10 January 2024

Zhaozhi Li, Changfu Zhang, Hairong Zhang, Haihui Liu, Zhao Zhu and Liucheng Wang

This study aims to apply an electrochemical grinding (ECG) technology to improve the material removal rate (MRR) under the premise of certain surface roughness in machining U71Mn…

Abstract

Purpose

This study aims to apply an electrochemical grinding (ECG) technology to improve the material removal rate (MRR) under the premise of certain surface roughness in machining U71Mn alloy.

Design/methodology/approach

The effects of machining parameters (electrolyte type, grinding wheel granularity, applied voltage, grinding wheel speed and machining time) on the MRR and surface roughness are investigated with experiments.

Findings

The experiment results show that an electroplated diamond grinding wheel of 46# and 15 Wt.% NaNO3 + 10 Wt.% NaCl electrolyte is more suitable to be applied in U71Mn ECG. And the MRR and surface roughness are affected by machining parameters such as applied voltage, grinding wheel speed and machining time. In addition, the maximum MRR of 0.194 g/min is obtained with the 15 Wt.% NaCl electrolyte, 17 V applied voltage, 1,500 rpm grinding wheel speed and 60 s machining time. The minimum surface roughness of Ra 0.312 µm is obtained by the 15 Wt.% NaNO3 + 10 Wt.% NaCl electrolyte, 13 V applied voltage, 2,000 rpm grinding wheel speed and 60 s machining time.

Originality/value

Under the electrolyte scouring effect, the products and the heat generated in the machining can be better discharged. ECG has the potential to improve MRR and reduce surface roughness in machining U71Mn.

Peer review

The peer review history for this article is available at: https://publons.com/publon/10.1108/ILT-10-2023-0341/

Details

Industrial Lubrication and Tribology, vol. 76 no. 2
Type: Research Article
ISSN: 0036-8792

Keywords

Article
Publication date: 10 October 2023

Xiao He, Lijuan Huang, Meizhen Xiao, Chengyong Yu, En Li and Weiheng Shao

The purpose of this paper is to illustrate the new technical demands and reliability challenges to printed circuit board (PCB) designs, materials and processes when the…

Abstract

Purpose

The purpose of this paper is to illustrate the new technical demands and reliability challenges to printed circuit board (PCB) designs, materials and processes when the transmission frequency increases from Sub-6 GHz in previous generations to millimeter (mm) wave in fifth-generation (5G) communication technology.

Design/methodology/approach

The approach involves theoretical analysis and actual case study by various characterization techniques, such as a stereo microscope, metallographic microscope, scanning electron microscope, energy dispersive spectroscopy, focused ion beam, high-frequency structure simulator, stripline resonator and mechanical test.

Findings

To meet PCB signal integrity demands in mm-wave frequency bands, the improving proposals on copper profile, resin system, reinforcement fabric, filler, electromagnetic interference-reducing design, transmission line as well as via layout, surface treatment, drilling, desmear, laminating and electroplating were discussed. And the failure causes and effects of typical reliability issues, including complex permittivity fluctuation at different frequencies or environments, weakening of peel strength, conductive anodic filament, crack on microvias, the effect of solder joint void on signal transmission performance and soldering anomalies at ball grid array location on high-speed PCBs, were demonstrated.

Originality/value

The PCB reliability problem is the leading factor to cause failures of PCB assemblies concluded from statistical results on the failure cases sent to our laboratory. The PCB reliability level is very essential to guarantee the reliability of the entire equipment. In this paper, the summarized technical demands and reliability issues that are rarely reported in existing articles were discussed systematically with new perspectives, which will be very critical to identify potential reliability risks for PCB in 5G mm-wave applications and implement targeted improvements.

Details

Microelectronics International, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 21 December 2022

Vimal Kumar Deshmukh, Mridul Singh Rajput and H.K. Narang

The purpose of this paper is to present current state of understanding on jet electrodeposition manufacturing; to compare various experimental parameters and their implication on…

Abstract

Purpose

The purpose of this paper is to present current state of understanding on jet electrodeposition manufacturing; to compare various experimental parameters and their implication on as deposited features; and to understand the characteristics of jet electrodeposition deposition defects and its preventive procedures through available research articles.

Design/methodology/approach

A systematic review has been done based on available research articles focused on jet electrodeposition and its characteristics. The review begins with a brief introduction to micro-electrodeposition and high-speed selective jet electrodeposition (HSSJED). The research and developments on how jet electrochemical manufacturing are clustered with conventional micro-electrodeposition and their developments. Furthermore, this study converges on comparative analysis on HSSJED and recent research trends in high-speed jet electrodeposition of metals, their alloys and composites and presents potential perspectives for the future research direction in the final section.

Findings

Edge defect, optimum nozzle height and controlled deposition remain major challenges in electrochemical manufacturing. On-situ deposition can be used as initial structural material for micro and nanoelectronic devices. Integration of ultrasonic, laser and acoustic source to jet electrochemical manufacturing are current trends that are promising enhanced homogeneity, controlled density and porosity with high precision manufacturing.

Originality/value

This paper discusses the key issue associated to high-speed jet electrodeposition process. Emphasis has been given to various electrochemical parameters and their effect on deposition. Pros and cons of variations in electrochemical parameters have been studied by comparing the available reports on experimental investigations. Defects and their preventive measures have also been discussed. This review presented a summary of past achievements and recent advancements in the field of jet electrochemical manufacturing.

Open Access
Article
Publication date: 29 February 2024

Guanchen Liu, Dongdong Xu, Zifu Shen, Hongjie Xu and Liang Ding

As an advanced manufacturing method, additive manufacturing (AM) technology provides new possibilities for efficient production and design of parts. However, with the continuous…

Abstract

Purpose

As an advanced manufacturing method, additive manufacturing (AM) technology provides new possibilities for efficient production and design of parts. However, with the continuous expansion of the application of AM materials, subtractive processing has become one of the necessary steps to improve the accuracy and performance of parts. In this paper, the processing process of AM materials is discussed in depth, and the surface integrity problem caused by it is discussed.

Design/methodology/approach

Firstly, we listed and analyzed the characterization parameters of metal surface integrity and its influence on the performance of parts and then introduced the application of integrated processing of metal adding and subtracting materials and the influence of different processing forms on the surface integrity of parts. The surface of the trial-cut material is detected and analyzed, and the surface of the integrated processing of adding and subtracting materials is compared with that of the pure processing of reducing materials, so that the corresponding conclusions are obtained.

Findings

In this process, we also found some surface integrity problems, such as knife marks, residual stress and thermal effects. These problems may have a potential negative impact on the performance of the final parts. In processing, we can try to use other integrated processing technologies of adding and subtracting materials, try to combine various integrated processing technologies of adding and subtracting materials, or consider exploring more efficient AM technology to improve processing efficiency. We can also consider adopting production process optimization measures to reduce the processing cost of adding and subtracting materials.

Originality/value

With the gradual improvement of the requirements for the surface quality of parts in the production process and the in-depth implementation of sustainable manufacturing, the demand for integrated processing of metal addition and subtraction materials is likely to continue to grow in the future. By deeply understanding and studying the problems of material reduction and surface integrity of AM materials, we can better meet the challenges in the manufacturing process and improve the quality and performance of parts. This research is very important for promoting the development of manufacturing technology and achieving success in practical application.

Details

Journal of Intelligent Manufacturing and Special Equipment, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 2633-6596

Keywords

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