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The chapter is devoted to considering the aspects of the COVID-19 pandemic influence on the global and Russian electronics industry. The work aims to examine the impact of the COVID-19 pandemic on the electronic industry in the world and Russia from various angles. As a result of the study, the main features of the global electronic industry are highlighted, including leadership of Western European countries, Japan and the United States in the segment of high price electronics; the leadership of the new industrial countries in a lower price segment; active development of microelectronics as an electronics industry segment and its colossal role in the economy of modern countries; the trend towards acquisitions of small companies by large corporations and other industry. Key problems of the Russian electronics are identified, including a small fraction of the global electronics dependence of Russian industry on imported electronic components, a huge backlog of electronic industry of Russia in comparison of world leaders and the newly industrialized countries, technological backwardness of many enterprises of electronic industry, the low level of qualification as a whole industry. The novelty of the research is highlighting the impact of the COVID-19 pandemic on the electronics industry. The study highlights both negative consequences (decline in production of many electronic enterprises, disruption of supply chains, insufficient financing of the industry) and positive aspects (active growth of the segment of household appliances and electronics), as well as an impetus to the development of new directions of world electronics (radio-photonics, optoelectronic and quantum technologies, artificial intelligence, laser technology).

Drive east from Frankfurt, upstream along the valley of the River Main, and in 25 kilometres or so you will reach Hanau, where once the brothers Grimm lived and collected the folklore which we now know as the famous Tales. Here too, in 1856, Wilhelm Carl Heraeus, a chemist and pharmacist, proprietor of the pharmacy which had carried the family name for many generations, succeeded in producing temperatures approaching 2000°C from an oxy‐hydrogen flame, temperatures sufficiently high to achieve the melting point of platinum and to allow him to melt substantial quantities of this metal for the first time. Hanau was then a centre for the jewellery manufacturing industry (and remains so today) so the smelting of platinum and other precious metals had an immediate commercial relevance.

Flextronic Ltd, a UK leader in the manufacture and assembly of flexible circuits, have appointed Rob Lomer to the post of Quality Manager for both of their Chichester sites. Mr Lomer has extensive quality management experience in the electronics environment, having introduced total quality management initiatives as well as statistical process control in previous posts. He is also intimately familiar with BS 7000/BS 5750 and ISO 9000/ EN 2900 in the USA as well as in the UK and mainland Europe.

The purpose of the present study was to review the thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components (SMCs). The topics of the review include challenges in modelling of the reflow soldering process, optimization and the future challenges in the reflow soldering process. Besides, the numerical approach of lead-free solder reliability is also discussed.

Lead-free reflow soldering is one of the most significant processes in the development of surface mount technology, especially toward the miniaturization of the advanced SMCs package. The challenges lead to more complex thermal responses when the PCB assembly passes through the reflow oven. The virtual modelling tools facilitate the modelling and simulation of the lead-free reflow process, which provide more data and clear visualization on the particular process.

With the growing trend of computer power and software capability, the multidisciplinary simulation, such as the temperature and thermal stress of lead-free SMCs, under the influenced of a specific process atmosphere can be provided. A simulation modelling technique for the thermal response and flow field prediction of a reflow process is cost-effective and has greatly helped the engineer to eliminate guesswork. Besides, simulated-based optimization methods of the reflow process have gained popularity because of them being economical and have reduced time-consumption, and these provide more information compared to the experimental hardware. The advantages and disadvantages of the simulation modelling in the reflow soldering process are also briefly discussed.

This literature review provides the engineers and researchers with a profound understanding of the thermo-mechanical challenges of reflowed lead-free solder joints in SMCs and the challenges of simulation modelling in the reflow process.

The unique challenges in solder joint reliability, and direction of future research in reflow process were identified to clarify the solutions to solve lead-free reliability issues in the electronics manufacturing industry.