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The purpose of this study is to design and fabricate a simple passive sensor circuitry embedded into a printed circuit board (PCB) and then to examine its properties.

A passive sensor transponder integrated circuit (IC) working in the high frequency (HF) 13.56 MHz frequency band was selected for this study. A loop antenna was designed to make the reported sensor circuitry readable. Next, the sensor circuitry was fabricated and embedded into a PCB with the proposed technologies. Finally, properties of the embedded structures were examined as well-functional parameters of the sensor circuitries.

The described investigation results confirmed that the proposed technologies using an epoxy resin or standard materials used for PCB’s production allowed to successfully produce sensors embedded into PCBs. This technology did not have a negative significant impact either on quality of solder joints of the assembled transponder IC or on functional properties of the embedded sensor. Apart from the identification data, the reported sensor can provide information about a selected property of its environment, e.g. temperature when its internal temperature sensitive element is used or other factors with the use of external sensitive elements, such as humidity.

It is planned to carry on the reported investigations to examine other types of sensor circuitries capable of indicating e.g. humidity level and to evaluate influence of the proposed technology on their functional properties.

The reported sensor circuitries can be successfully used in electronic industry in internet of things systems not only to identify monitored electronic devices, but also to control selected parameters of external environment. This creates opportunity to detect device malfunction by detecting local temperature growth or to analyze its environment, which might allow to predict failure of controlled products using radio waves. This advantage seems to be extremely beneficial for applications, such as space, aviation or military, in which embedded sensor systems may lead to enhancing reliability of electronic devices by reacting on occurred failures in a more efficient way.

This study demonstrates valuable information for engineers conducting research on sensor components embedded into PCBs. The reported technologies are quite simple and cost-effective because of the use of standard materials known for PCB’s production or an epoxy resin which could be treated as an additional encapsulant material enhancing mechanical properties of the embedded sensor transponder IC.

The purpose of this study is to design, fabricate and investigate low-temperature co-fired ceramic (LTCC) structures with integrated microfluidic elements. Special attention is paid to the study of fluid properties of micro-channels and microvalves, which are important constitutive parts of both, microfluidic systems and individual microfluidic devices.

Several test patterns of fluid channels with different geometry and different types of valves were designed and realized in LTCC technology. All test structures were tested under the flow of two fluids (liquids): water and isopropyl alcohol. Flow rates at different applied pressure were measured and hydrodynamic resistance and diode effect were calculated.

The investigation of the channels showed that viscosity of fluidic media has significant influence on the hydrodynamic resistance in channels with rectangular cross-section, while this effect is small on channels with square cross-section. The viscosity also has a decisive influence on the diode effect of different shape of valves, and therefore, it is important in the selection of the valve in practical applications.

In this work, the investigation of hydrodynamic resistance of channels and diode effect of passive valves is limited on selected geometry and only on two fluidic media and two applied pressures. All these and some other parameters have a significant influence on fluidic properties, but this will be the topic of the next research work, which will be supported by numerical modelling.

The presented results are useful in the future designing process of LTCC-based microfluidic devices and systems.

Microfluidic in the LTCC structures is an unconventional use of this technology. Therefore, the fluid properties are relatively unsearched. On the other hand, the global use of microfluidic devices and systems is growing rapidly in various applications. They are mostly made by polymer materials, however, in more demanding applications; ceramic is a useful alternative.

The purpose of this paper is to form good cutting qualities in glass-epoxy material for opening flexible areas of rigid-flex printed circuit boards (PCB) by ultraviolet (UV) laser cutting.

The cut width and cut depth of glass-epoxy materials were both observed to evaluate their cutting qualities. The heat affected zone (HAZ) of the glass-epoxy material was also investigated after UV laser cutting. The relationships between the cut width and the parameters of various factors were analyzed using an orthogonal experimental design.

The cut width of the glass-epoxy material gradually increased with the increment of the laser power and Z-axis height, while cutting speed and laser frequency had less effect on the cut width. Optimal parameters of the UV laser process for cutting glass-epoxy material were obtained and included a laser power of 6W, a cutting speed of 170 mm/s, a laser frequency of 50 kHz and a Z-axis height of 0.6 mm, resulting in an average cut width of 25 μm and small HAZ.

Flexible areas of rigid-flex PCBs are in good agreement with the cutting qualities of the UV laser. The use of a UV laser process could have important potential for cutting glass-epoxy materials used in the PCB industry.

The purpose of this paper is to expand current knowledge about the recent trend of wearable technology to assess both its potential in the work environment and the challenges concerning the utilisation of wearables in the workplace.

After establishing exclusion and inclusion criteria, an independent systematic search of the ACM Digital Library, IEEE Xplore, ScienceDirect and Web of Science databases for relevant studies was performed. Out of a total of 359 articles, 34 met the selection criteria.

This review identifies 23 categories of wearable devices. Further categorisation of the devices based on their utilisation shows they can be used in the work environment for activities including monitoring, augmenting, assisting, delivering and tracking. The review reveals that wearable technology has the potential to increase work efficiency among employees, improve workers’ physical well-being and reduce work-related injuries. However, the review also reveals that technological, social, policy and economic challenges related to the use of wearable devices remain.

Many studies have investigated the benefits of wearable devices for personal use, but information about the use of wearables in the work environment is limited. Further research is required in the fields of technology, social challenges, organisation strategies, policies and economics to enhance the adoption rate of wearable devices in work environments.

Previous studies indicate that occupational stress and injuries are detrimental to employees’ health; this paper analyses the use of wearable devices as an intervention method to monitor or prevent these problems. Introducing a categorisation framework during implementation may help identify which types of device categories are suitable and could be beneficial for specific utilisation purposes, facilitating the adoption of wearable devices in the workplace.

Discusses the benefits of establishing an electronic office in an organization. Examines the potential applications of an electronic office in Nigerian libraries. Discusses the technical and economic problems that might inhibit thc establishment of an electronic office in these libraries. Makes an attempt to provide solutions to the highlighted problems.

Notwithstanding the novelty and importance of wearable fitness devices, few studies have focussed on comparing the drivers of adoption and usage of wearable fitness in the context of developing countries. This study aims to explore factors that drive overall acceptance of wearable fitness devices in developing countries (India and the Philippines) and whether the impact of these factors on the intention to adopt (INT) differs by country and gender.

The study extends the existing body of knowledge by developing a model that integrates the impact of various perceived benefits (health, autonomy, social, hedonic, symbolic), health self-efficacy (HEALTHSE) and individual characteristics (technological innovativeness [TI]) on the INT wearable fitness devices and the moderating impact of country and gender. The analysis was carried out using partial least square and data of 343 respondents.

This study finds that the INT wearable fitness devices by consumers in developing countries are positively impacted by hedonic, health and autonomy, HEALTHSE and TI. Symbolic and social factors do not have any significant impact on the overall INT wearable fitness devices. However, there are country and gender-specific differences that are consequential to the development of marketing strategies.

The framework and results are specific to the two countries and limited by convenience sampling. Future research can focus on replication across different countries and extend the model with additional contextual factors such as perceived risks.

To the best knowledge of the authors, this is one of the few studies to examine and compare the drivers of adoption of wearable fitness devices in lesser researched developing countries. Also, it is one of the few studies to compare the moderating impact of country and gender in the context of the INT wearable devices. The study provides a theoretical and methodological foundation for future research, as well as practical implications for global companies developing and promoting wearable fitness devices.

The purpose of this paper is to form copper coin-embedded printed circuit board (PCB) for high heat dissipation.

Manufacturing optimization of copper coin-embedded PCB involved in the design and treatment of copper coin, resin flush removal and flatness control. Thermal simulation was used to investigate the effect of copper coin on heat dissipation of PCB products. Lead-free reflow soldering and thrust tests were used to characterize the reliable performance of copper coin-embedded PCB.

The copper coin-embedded PCB had good agreement with resin flush removal and flatness control. Thermal simulation results indicated that copper coin could significantly enhance the heat-dissipation rate by means of a direct contact with the high-power integrated circuit chip. The copper coin-embedded PCB exhibited a reliable structure capable of withstanding high-temperature reflow soldering and high thrust testing.

The use of a copper coin-embedded PCB could lead to higher heat dissipation for the stable performance of high-power electronic components. The copper coin-embedded method could have important potential for improving the design for heat dissipation in the PCB industry.

The purpose of this paper is to provide a review of recent developments in nanoelectronic devices, with an emphasis on the materials and fabrication technologies employed.

This paper focuses on three critical fields of nanoelectronics: integrated circuits (ICs), sensors and displays. It describes recent developments and considers the materials and techniques used in their fabrication.

This paper shows that nanoelectronic developments, particularly experimental ICs, are progressing very rapidly but all manner of different materials and non‐standard fabrication processes are involved. Major efforts are underway to develop simple and cost‐effective techniques which will allow the high volume production of suitable nanomaterials and their incorporation into commercial nanoelectronic devices.

The paper provides an up‐to‐date review of nanoelectronic device developments and fabrication technologies.

Aims to review polymeric materials used as adhesives and the related bonding procedures applicable in the medical industry.

The main types of polymeric materials used as adhesives are described. Details and the main points of the adhesive bonding processes are also described with comments on their adaptability to automated assembly. Finally, typical examples of the use of adhesives in medical device applications are provided.

Review paper with examples of applications of adhesives in assembly of medical materials and devices.

The appropriate selection of adhesive types and bonding parameters are critical for successful application of this technology in joining medical materials. Most currently available medical grade adhesives are only suitable for short‐term (<30 days) implantable application. The users must ensure that the properties of the selected adhesives, particularly the relevant biocompatibility and toxicity data are available and fully comply with any specific medical device application and regulation.

Although this is a general review paper, it contains information about new materials and processing techniques applied in successful application of adhesive bonding technology in medical devices. The information provided is expected to be of significant benefit to material scientists and design engineers evaluating and identifying suitable joining techniques for the assembly of medical devices.

This paper aims to explore factors impacting wearable fitness tracking (WFT) device continued usage intention from perspectives of technology attributes (autonomy benefits), health attributes (self-health management benefits, diet-control benefits and health self-efficacy), and consumer attributes (age, gender, technological innovativeness, symbolic benefits, social benefits and hedonic benefits).

The study integrates constructs from the technology acceptance theories and the health promotion model to develop the research model and hypothesis. The empirical analysis was conducted using data from 217 respondents from India. Logistic regression was used to identify factors that discriminate between groups with low and high continued usage intentions.

Results indicate higher continued usage intention for WFT devices is driven by perceived benefits-health, autonomy, social and hedonic, and individual characteristics-technological innovativeness and perceived health self-efficacy. Further, perceived symbolic benefits, diet control benefits, age, and gender does not discriminate between the groups with low and high continued usage intentions.

The results may be limited to the context of the sample and the factors considered. The study suggests future research areas.

The paper offers insights for marketers, governments, insurance firms, and related healthcare services on promoting higher usage of WFT devices to yield dual benefits of preventive healthcare and higher profitability.

The study extends existing research by examining factors across consumer, health, and technological domains in a single framework and adds to the limited research in the context of usage of WFT devices in developing countries.