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Electroless plating is an important process in printed circuit board and electronics manufacturing but typically requires temperatures of 70‐95°C to give a suitable deposition rate. This is becoming problematic in industry due to the rising price of energy and is a major contribution to production costs. Previous studies have noted beneficial effects of ultrasonic irradiation upon electroless plating processes and it has been reported that sonication can increase the plating rate and produce changes to the chemical and physical properties of the deposited coating. The purpose of this paper is to reduce the operating temperature of an electroless nickel bath by introducing ultrasound to the process.

The deposition rate of an electroless nickel solution was determined by two techniques. In the first method, test coupons were plated in an electroless nickel solution at temperatures ranging from 50‐90°C and the plating rate was calculated by weight gain. In the second approach the mixed potential (and hence the current density at the mixed potential) was determined by electrochemical analysis of the anodic and cathodic reactions. In both cases the plating rate was found with and without the application of an ultrasonic field (20 kHz). The electroless nickel deposits obtained in the plating tests were also analysed to determine the phosphorus content, microhardness and brightness.

The plating rates under ultrasonic agitation were always higher than under “silent” conditions. Most importantly, considering the objectives of this study, the deposition rate under sonication at 70°C was significantly higher than that found with mechanical agitation at 90°C. In addition, the results indicated that the deposits produced in an ultrasonic field had consistently lower phosphorus content, higher microhardness and were brighter than those prepared in an electroless nickel bath that was not sonicated.

Although previous work has been performed on the effect of ultrasound on electroless plating, all these studies have been carried out at the normal operating temperature of the electroless process. In this paper, ultrasound has been applied at temperatures well below those normally used in electroless nickel deposition to determine whether sonication can enable low temperature electroless plating.

This paper aims to investigate the layer of material deposited on a sample of acrylic resin by electroless nickel plating process. Acrylic resin is a popular material in rapid prototyping (RP) which uses the additive manufacturing technique to build prototypes for visual inspection, assembly, etc. Metallization of the RP materials can extend application envelop of RP techniques, as they can be used in decorative or functional applications.

Unlike electroless nickel plating on a metal substrate, the plating process for an acrylic resin substrate is different, as there is no metal ion for the auto-catalytic electroless reaction. Pre-treatment processes are performed on an acrylic resin sample to initiate electroless nickel plating. The morphology, chemical composition and structure of the layer deposited on the sample are examined using scanning electron microscopy, energy-dispersive spectroscopy and X-ray diffraction.

The investigation shows that a nickel phosphorous alloy layer is plated on to the substrate surface of the acrylic resin sample.

Plating a layer of nickel phosphorous alloy layer on an acrylic resin RP material can widen the application of RP technology. An application of nickel plated acrylic resin sample to rapid tooling for low-volume production plastic parts is presented.

Trials have been performed to assess the practicability of the electroless nickel plating method applied to textile fabrics with various fabric constructions including polyester woven fabrics and polyester meshes. The effect of electroless nickel plating on different polyester fabric constructions had been studied. The results displayed that the nickel could be successfully plated on various fabric structures. In this study, it was found that fabric constructions can influence the appearance of electroless nickel-plated fabrics and generate different metallic effects. Fabric structure is considered to be a very important factor for determining the desired appearances of electroless nickel-plated fabrics. Moreover, electroless nickel plating is able to simulate the metallic effects of hard metal products on non-conductive fabrics with soft handle. Such findings could give inspiration to designers to design fabrics with different brilliant textures.

The purpose of the investigation was to research the best process of electroless nickel (EN) plating on AZ91D magnesium alloy and the performance of EN plating coating.

Through single factor test and orthogonal test, EN plating on AZ91D magnesium alloy was researched. The plating rate and porosity were analyzed. The coating appearance of EN plating coating and magnesium alloy substrate was evaluated. The electrochemical properties of EN plating coating and substrate were researched using electrochemical workstation, and their compositions and structure were examined using X-ray diffraction and scanning electron microscopy.

The results made by combination of experimental and orthogonal test showed that the best formula of EN plating was 8.8 g·L⁻¹ nickel ion, 25 g·L⁻¹ lactic acid, 28 g·L⁻¹ reducing agent, 1.8 ml·L⁻¹ corrosion inhibitor, 1 mg·L⁻¹ stabilizer, temperature at 85°C and pH value at 5.5. The plating was uniform, dense and with no cracks. The electrochemical tests showed that the corrosion resistance of EN plating was better than that of magnesium alloy substrate.

The results indicated that the corrosion resistance of magnesium alloy improved markedly after EN plating at the best formula and the plating covered magnesium alloy completely.

To study the influence of storage time and environment on the solderability of electroless nickel plated samples with Sn‐3.8Ag‐0.7Cu and Sn‐3.5Ag lead‐free solders and to provide criteria for the use of an electroless nickel (Ni‐P) under bump metallization (UBM) without immersion gold protection.

Electroless nickel coatings were deposited onto pure aluminium foil through a procedure developed for the UBM of wafers prior to flip chip bumping. Their solderability with lead‐free solders was studied using the wetting balance technique. Samples stored in different environments for different periods of time were tested to study the dependence of the solderability of Ni‐P coatings on the storage time and temperature. The degree of oxidation of the Ni‐P coatings was examined by means of X‐ray photoelectron spectroscopy and the surface microstructure and roughness of the coatings were analyzed by scanning electron microscopy and atomic force microscopy.

It was found that the Ni‐P coatings were unacceptable for direct soldering without the assistance of a flux, due to poor wettability, even when using a freshly prepared Ni‐P coating. Therefore, a suitable flux with nitrogen inerting had to be applied to assist the soldering process. The results also show that the solderability of Ni‐P coatings was affected by the phosphorus content, and the Ni‐P coating with high phosphorus content had a good solderability. The storage time and temperature did not influence the wettability significantly with the assistance of strong flux.

The stability of the plating solution and the consistence of the phosphorus content in the coating are not easily controlled. This has resulted in implications for surface analysis and wetting testing. Ni‐P coatings with different levels of phosphorus content are being investigated in detail.

The value of the paper lies in its study on the solderability of lead‐free solders to Ni‐P coating after storage in different environments and for different periods, which can provide some criteria for the use of Ni‐P UBM without immersion gold protection.

An article in this journal has described the basic mechanism of electroless nickel plating, as well as the main properties of the resultant plate. The present article describes certain practical aspects of electroless plating.

The purpose of this paper is to report the effect of cerium addition on plating rate, microstructure and electrochemical behaviour of electroless nickel‐phosphorus coatings.

The methodology comprised preparation of coatings with different concentration of cerium added in plating bath by electroless, then test coating properties by SEM, XRD and electrochemical workstation.

Coatings prepared with 10 mg/L cerium added in electroless bath have the best corrosion resistance and high deposition rate, smooth and mirror‐like micrograph.

The nickel‐phosphorus coating has obtained best corrosion resistance performance (icorr=1.35 μA cm⁻²) when cerium addition concentration is 10 mg L⁻¹.

The paper aims to introduce the process flow of electroless nickel (EN) plating on carbon fiber surfaces, the effect of former processing on the properties of coating and the dynamics of the process.

The coated fibers were mounted in cold-setting epoxy resin, and transverse cross-section of the coated fibers were examined under an optical microscope to ascertain the thickness, uniformity and continuity of the coating over the fiber surface. The coating morphology was studied by using a scanning electron microscope (SEM). This study also determined the activation energy and electrical properties of EN coated on carbon fibers.

Activation temperatures have a greater impact on the quality of EN. At a temperature of 80°C, the EN layer prepared was uniform and compact and fully coated the carbon fibers. The optimum components of the EN plating process is NiSO₄: 28 g/L; NaH₂PO₂: 30 g/L; NaAc: 20 g/L; Na₃C₆H₅O₇:10 g/L; C₄O₆H₂KNa: 2 g/L; (NH₄)₂SO₄: 18 g/L; thiourea and lead acetate: trace; operating conditions: pH = 8.5, temperature: 70°C; time: 0.5 h). The activation energy of the EN plating on carbon fiber is 12 kJ/mol, and the electrical conductivity of nickel-plated carbon fiber in 80 mL of distilled water is 16.5 μs/cm.

This paper determined the optimum processing conditions and the activation energy of the EN plating on carbon fiber.

In this paper, the optimisation of electroless nickel plating is investigated through the Orthogonal Array Testing Strategy. It was found that the electroless nickel plating process at the deposition stage with various parameters, i.e. temperature = 40°C, time = 20 minutes and pH = 10, is the most effective method in improving the metal adhesion performance. The performance of nickel-plated polyester fabrics was found to be dependent on the amount of nickel particles adhered on the fabric surface. The properties of optimised nickel-plated polyester were enhanced in term of fabric weight, fabric thickness and tensile strength. However, there was a moderate decrease in tearing strength and crocking fastness.

Electroless plating treatment is one surface modification technique. An added effect due to electroless plating is expected, and the vibration damping capacity of the structures may be improved by this technique. In the present study, the vibration damping capacity of such electroless plated structures is measured experimentally. Damping capacity can be improved regardless of the plated film materials. Improvement efficiency with an electroless plating film with dispersed foreign particles such as SiC ceramics is higher than with a uniform electroless plating film.