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While the interest in alternative metalization processes for the manufacturing of printed wiring boards is extremely keen, the long‐term reliability of plated through holes fabricated with these electroless copper alternatives remains in question. However, during the last three years, significant process improvements have been made in the direct metalization process based on a patented dispersion of graphite. This paper will describe the technology in detail and present data on the reliability and versatility of the graphite based direct metalization process.

In the preceding three parts of this series, the authors have extensively reviewed and quantified the special processing sequences required for the ‘additive’ and ‘semi‐additive’ process strategies of PWB manufacture. In this, the fourth part of the series of five, they wish to present a series of full build processes which meet all the interconnect requirements of the 1990s while eliminating the drawbacks traditionally associated with additive processes.

The purpose of this paper is to investigate if copper nanoparticles could be utilized for two types of through hole plating in printed circuit boards, namely: as a catalytic material to initiate the electroless copper deposition process; and as a “conductive” layer which is coherent and conductive enough to allow “direct” electroplating of the through hole. The employment of nanoparticles means that an effective method of dispersion is required and this paper studies the use of mechanical agitation and ultrasound for this purpose.

The paper utilized drilled, copper clad FR4 laminate. The through holes were functionalized using a commercially available “conditioner” before being immersed in a solution of copper nanoparticles which were dispersed using either a magnetic stirrer or ultrasound (40 kHz). When the copper nanoparticles were utilized as a catalytic material for electroless copper plating, the efficacy of the technique was assessed using a standard “backlight” test which allowed the plating coverage of the through holes to be determined. As a control, a standard palladium catalysed electroless copper process was employed. The morphology of the electroless copper deposits was also analysed using scanning electron microscopy. In the “direct plate” approach, after immersion in the copper nanoparticle dispersion, the through holes were electroplated at 3 Adm⁻² for 15 min, sectioned and examined using an optical microscope. The distance that the copper electroplate had penetrated down the through hole was then determined.

The paper has shown that copper nanoparticles can be used as a catalytic material for electroless copper plating. The coverage of the electroless copper in the through hole improves as the copper nanoparticle concentration increases and, at the highest copper nanoparticle concentrations employed, good, but not complete, electroless copper coverage is obtained. Dispersion of the copper nanoparticles using ultrasound is critical to the process. Ultrasonically dispersed copper nanoparticles achieve some limited success as a conductive layer for “direct” electroplating with some penetration of the electroplated deposit into the through hole. However, if mechanical agitation is employed to mix the nanoparticles, no through hole plating obtaines.

The paper has demonstrated the “proof of concept” that copper nanoparticles can be utilized to catalyse the electroless copper process, as well as their potential to replace costly palladium‐based activators. The paper also illustrates the potential for copper nanoparticles to be used as a “direct plate process” and the necessity for using ultrasound for their dispersion in either process.

In this paper, reproduced by permission of the Institute of Printed Circuits (USA), the author discusses the factors which can affect the quality and adhesion of electroless copper plating on printed circuit boards and recommends procedures to ensure optimum results.

Until recently the majority of catalysts used in through‐hole plating of printed circuits have been based on processes containing tin and palladium. These have been adequate although, with the ever increasing demands on quality of subsequently assembled printed circuits, they have shortcomings which are functions of the basic formulae and mechanisms of operation. The new non‐precious metal catalyst based on copper operates over a much wider range of conditions and, unlike palladium catalysts, promotes complete coverage of epoxy glass laminates. The operation of both catalyst systems is discussed in depth and compared, significant emphasis being placed on the mechanism of surface activation.

The aim of this paper is to present results of investigations carried out on the front electrode of solar cells. Nowadays, most worldwide solar cell production is dominated by monocrystalline and polycrystalline silicon as a base material. In such cells, the electrical carriers are collected by the system of metallic paths fabricated on a silicon surface. One possible way to increase cell efficiency and reduce the production costs of solar modules is to replace the expensive silver by cheaper copper in front metallic electrodes.

The paper presents results of investigations performed on the front electrode of the solar cell. The investigations were focused on the modification of typical screen printing fabrication of the thin electrical finger paths of the front solar cell electrode. The resulting contacts were characterized morphologically (the dimensions and geometry of the front contacts) by scanning electron microscopy. The composition of finger path covered with copper was analyzed using energy-dispersive X-ray spectroscopy and X-ray photoelectron spectroscopy techniques.

In this work, the front electrodes were screen printed with the use of conventional silver-paste on a p-type Cz–Si-textured wafer with a n+ emitter and with an antireflection coating. After that, the fired front electrode was electroless coated with copper. The electroless copper deposition was performed in two stages. First, the surface of the photovoltaic cell was dipped in an aqueous solution of CuSO₄ and then dried in air at room temperature. When the surface dried, the cell was immersed in hydrogen fluoride solution (5 per cent) for 1 s followed by rinsing in deionization water.

The experiments confirmed the potential application of copper as an additional layer of the solar cell front metal electrode. On the one hand, this process is very simple and, on the other, the authors demonstrate a problem with the mechanical stability of the covered paths leading to electrode delamination.

Electroless plating is an important process in printed circuit board and electronics manufacturing but typically requires temperatures of 70‐95°C to give a suitable deposition rate. This is becoming problematic in industry due to the rising price of energy and is a major contribution to production costs. Previous studies have noted beneficial effects of ultrasonic irradiation upon electroless plating processes and it has been reported that sonication can increase the plating rate and produce changes to the chemical and physical properties of the deposited coating. The purpose of this paper is to reduce the operating temperature of an electroless nickel bath by introducing ultrasound to the process.

The deposition rate of an electroless nickel solution was determined by two techniques. In the first method, test coupons were plated in an electroless nickel solution at temperatures ranging from 50‐90°C and the plating rate was calculated by weight gain. In the second approach the mixed potential (and hence the current density at the mixed potential) was determined by electrochemical analysis of the anodic and cathodic reactions. In both cases the plating rate was found with and without the application of an ultrasonic field (20 kHz). The electroless nickel deposits obtained in the plating tests were also analysed to determine the phosphorus content, microhardness and brightness.

The plating rates under ultrasonic agitation were always higher than under “silent” conditions. Most importantly, considering the objectives of this study, the deposition rate under sonication at 70°C was significantly higher than that found with mechanical agitation at 90°C. In addition, the results indicated that the deposits produced in an ultrasonic field had consistently lower phosphorus content, higher microhardness and were brighter than those prepared in an electroless nickel bath that was not sonicated.

Although previous work has been performed on the effect of ultrasound on electroless plating, all these studies have been carried out at the normal operating temperature of the electroless process. In this paper, ultrasound has been applied at temperatures well below those normally used in electroless nickel deposition to determine whether sonication can enable low temperature electroless plating.

Data from laboratory and production scale tests are given that show that the efficiency of catalyst adsorption controls the coverage by the electroless copper deposit in plated‐through‐holes in FR‐4 laminate, and that this, in turn, governs the outgassing performance of the finished board. The nature of electroless copper nucleation and growth is discussed and the reasons for the formation of voids in the deposit are identified.

In order for system designers to make full use of the successive generations of semiconductor devices it is becoming increasingly necessary to choose interconnection systems that are tailored to the application. As this trend becomes more pronounced, the limitations of traditional methods of constructing boards onto which electronic components can be assembled are becoming more obvious. In this paper the application of selective electroplating, a technique that has been in use for many years but has not previously been fully exploited, is discussed. It is shown by examining a number of case studies that with a small amount of innovation this basic technique can be extended to meet the needs of a number of application areas while still operating within the normal processing windows of the materials.

The copper plating of through holes and PCB surfaces in the additive process places high demands on the chemical copper bath and the resultant deposit. This paper illustrates the extent to which specific characteristics of the deposition and inhibition mechanism can be used to advantage.