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The purpose of this study is to provide a theoretical basis for the study of the galvanic corrosion mechanism of copper coupled silver-coating under a thin electrolyte layer in electronic systems.

Electrochemical measurements and surface characterizations.

The results indicate that the potential difference between copper and silver electrodes first quickly increases, and then reaches a relatively stable and large value with the extension of the immersion time. With the significant increase in the cathode/anode area ratio in electronic systems, the area ratio effect obviously accelerates the corrosion of copper due to the remarkable promotion of the cathode process. For a large cathode/anode area ratio, the galvanic current density always maintains a large value and exhibits an increasing trend with the extension of the immersion time, which is attributed that the area ratio effect reduces the protection of corrosion products. For the same area of cathode and anode, the galvanic current density always maintains a small value with the extension of the immersion time due to a low galvanic effect and protective corrosion products.

This work provides some information for the establishment of reliably protective measures for electronic systems in service.

This work not only provides some information for the establishment of reliably protective measures for electronic systems in service, but also provides a theoretical basis for the selection of metal materials in microelectronic systems.

This work provides not only a theoretical basis for the study of the galvanic corrosion mechanism of Cu/Ag under a thin electrolyte layer, but also provides some information for the establishment of reliably protective measures for electronic systems in service.

The purpose of this paper is to report thick film environmental and chemical sensor arrays designed for deployment in both subterranean and submerged aqueous applications.

Various choices of materials for reference electrodes employed in these different applications have been evaluated and the responses of the different sensor types are compared and discussed.

Results indicate that the choice of binder materials is critical to the production of sensors capable of medium term deployment (e.g. several days) as the binders not only affect the tradeoff between hydration time and drift but also have a significant bearing on device sensitivity and stability. Sensor calibration is shown to remain an issue with long‐term deployments (e.g. several weeks) but this can be ameliorated in the medium term with the use of novel device fabrication and packaging techniques.

The reported results indicate that is possible through careful choice of materials and fabrication methods to achieve near stable thick film reference electrodes that are suitable for use in solid state chemical sensors in a variety of different application areas.

The purpose of this paper is to provide useful information pertaining to the corrosion inhibition mechanism of BTA and its derivatives on copper.

The photoelectrochemical behavior of copper electrodes in buffered borax solutions (pH 9.2) containing BTA and its derivatives was comparatively studied by using a photoelectrochemical technique. It was possible to analyze the inhibition mechanism of the derivatives of BTA for copper corrosion from the photoelectrochemical results. The photoresponse of the Cu electrode in buffered borax solutions containing BTA and its derivatives was measured. Different concentrations and different kinds of inhibitors may result in different photoresponses on the Cu electrode in buffered borax solutions.

The photoresponse for copper electrodes in solutions containing a certain amount of BTA exhibits an n‐type response during anodic polarization and, the greater the n‐type photoresponse, the better the performance of the inhibitor. The photoresponse for copper electrodes in solutions containing 4CBTA, or 5CBTA, or CBT‐1, always exhibited p‐type behavior during anodic polarization, but the photoresponse changed very evidently during cathodic polarization. The larger the maximum cathodic photocurrent, then the greater was the effectiveness of the corrosion inhibitor. In consequence, it is possible to evaluate inhibitors according to Φ_V and i_ph at more negative potentials. The more negative the Φ_V and i_ph, the better is the inhibition. It was shown that the inhibition mechanism of the derivatives of BTA with a −COOH group was different from that occurring with ester groups. The former could make the Cu₂O film on the Cu electrode thicker. The photocurrent was observed to increase when the potential was scanned to more negative potentials in the presence of certain concentrated inhibitors. It is therefore possible to evaluate the performance of inhibitors according to the value of the cathodic photocurrent. The larger the cathodic photocurrent, the better is the inhibition effect of the compound. The latter could increase the density of the polymer film on the copper electrode and prevent O²⁻ in the solution from entering the copper surface and changing the stoichiometric ratio of Cu₂O. The photocurrent type could transfer from p‐ to n‐type according to the action of certain concentrated inhibitors when the potential was scanned to more positive potentials. The value of the anodic photocurrent can be used to evaluate the effectiveness of inhibition. The larger the anodic photocurrent, the greater is the inhibition effect.

The paper provides useful information pertaining to the corrosion inhibition mechanism of BTA and its derivatives on copper. The photoelectrochemical technique is an effective method with which to evaluate the effectiveness of corrosion inhibitors and to investigate the mechanism of corrosion inhibition on copper.

The purpose of this paper is to comprehensively review most of the significant works ever done worldwide to study the effects of essential parameters on pulsed plasma thruster (PPT) performance and to analyze the effects of each parameter on PPT performance.

All the important works studying PPT performance are categorized by the parameter they have studied and its effect on the thruster performance, and their works have been reviewed to analyze the influence of each parameter.

The analysis leads to elucidation of the effects of different geometrical parameters including aspect ratio, electrode width, electrode spacing, electrode shape, electrode length, and flare angle, in addition to the effects of other parameters such as electrode material, propellant type, propellant temperature, spark distance from propellant, pulse repetition frequency, discharge energy, capacitance, and hood angle on PPT performance.

The analysis is mainly focused on parallel‐rail breech‐fed PPTs and side‐fed PPTs and does not deal with co‐axial PPTs.

The paper reviews and analyses many of the considerable works ever done to contribute to clarify the effects of different parameters on PPT performance. The results of the current analysis can be of invaluable assistance in PPT design and optimization procedure and help the designer to develop a system with better performance characteristics.

Crystallization is the process widely used for components separation and solids purification. The systems for crystallization process evaluation applied so far, involve numerous non-invasive tomographic measurement techniques which suffers from some reported problems. The purpose of this paper is to show the abilities of three-dimensional Electrical Capacitance Tomography (3D ECT) in the context of non-invasive and non-intrusive visualization of crystallization processes. Multiple aspects and problems of ECT imaging, as well as the computer model design to work with the high relative permittivity liquids, have been pointed out.

To design the most efficient (from a mechanical and electrical point of view) 3D ECT sensor structure, the high-precise impedance meter was applied. The three types of sensor were designed, built, and tested. To meet the new concept requirements, the dedicated ECT device has been constructed.

It has been shown that the ECT technique can be applied to the diagnosis of crystallization. The crystals distribution can be identified using this technique. The achieved measurement resolution allows detecting the localization of crystals. The usage of stabilized electrodes improves the sensitivity of the sensor and provides the images better suitable for further analysis.

The dedicated 3D ECT sensor construction has been proposed to increase its sensitivity in the border area, where the crystals grow. Regarding this feature, some new algorithms for the potential field distribution and the sensitivity matrix calculation have been developed. The adaptation of the iterative 3D image reconstruction process has also been described.

Digital microfluidic devices have been demonstrated to have great potential for a wide range of applications. These devices need expensive photolithography process and clean room facilities, while printed circuit board (PCB) technology provides high configurability and at low cost. This study aims to investigate the mechanism of electrowetting-on-a-dielectric (EWOD) on PCB by solving the multiphysics interaction between fluid droplet and electric field. The performance of system will be improved by inducing an efficient electric field inside the droplet.

To induce an electric field inside the droplet on a PCB and change the initial contact angle, the mechanism of EWOD is studied based on energy minimization method and a set of simulations are carried out by considering multiphysics interaction between the fluid droplet and external electric field. The performance of EWOD on a PCB system is investigated using different electrode structures.

Surface tension plays an efficient role in smaller sizes and can be used to move and control a fluid droplet on a surface by changing the interfacial surface tension. EWOD on a PCB system is studied. and it revealed that any change in electric field affects the droplet contact angle and as a result droplet deformation and movement. The electrode pattern is an important parameter which could change the electric potential distribution inside the droplet. Array of electrodes with square, zigzag interdigitated and crescent shapes are studied to enhance the EWOD force on a PCB substrate. Based on the results, the radial shape of the crescent electrodes keeps almost the same actuated contact line, applies uniform force on the droplet periphery and prevents the droplet from large deformation. A droplet velocity of 0.6 mm/s is achieved by exciting the crescent electrodes at 315 V. Furthermore, the behavior of system is characterized for process parameters such as actuation voltage, dielectric constant of insulator layer, fluidic material properties and the resultant velocity and contact angle. The study of contact angle distribution and droplet motion revealed that it is helpful to generate EWOD mechanism on a PCB which does not need more complicated fabrication processes.

The ability to handle and manipulate the droplets is very important for chemistry on-chip analysis such as immunoassay chips. Furthermore, a PCB-based electrowetting-on-dielectric device is of high interest because it does not need cleanroom facilities and avoids additional high-cost fabrication processes. In the present research, the EWOD mechanism is studied on a PCB by using different electrode patterns.

The purpose of this paper is to produce electric discharge machining (EDM) electrodes by using stereolithography (SLA) rapid prototyping technique and investigate the machining performance of these electrodes. In the experimental part of the study, the performance of solid copper and copper‐coated SLA (cc/SLA) electrodes are observed and compared.

The performance outputs such as material removal rate, machining depth, workpiece surface roughness and electrode front surface wear are used as metrics of comparison. The temperature measurements taken from the face of both solid copper and cc/SLA electrodes indicated that the heat build up during machining significantly accelerated the failure of cc/SLA electrodes.

The paper finds that circulating the cooling liquid inside the internal cooling channels formed with SLA technique, elongated the life of cc/SLA electrodes by dissipating the heat from the coating.

The Fluent Computational Fluid Dynamics (CFD) Software is used to numerically analyze various aspects of cooling of cc/SLA electrodes. The key findings of the study are presented in this paper.

The purpose of this paper is to present the sensing mechanism, design issues, performance evaluation and applications for planar capacitive sensors. In the context of characterisation and imaging of a dielectric material under test (MUT), a systematic study of sensor modelling, features and design issues is needed. In addition, the influencing factors on sensitivity distribution, and the effect of conductivity on sensor performance need to be further studied for planar capacitive sensors.

While analytical methods can provide accurate solutions to sensors of simple geometries, numerical modelling is preferred to obtain sensor response to different design parameters and properties of MUT, and to derive the sensitivity distributions of various electrode designs. Several important parameters have been used to evaluate the response of the sensors in different sensing modes. The designs of different planar capacitive sensor arrays are presented and experimentally evaluated.

The response features and design guidelines for planar capacitive sensors in different sensing modes have been summarised, showing that the sensor in the transmission mode or the single‐electrode mode is suitable for material characterisation and imaging, while the sensor in the shunt mode is suitable for proximity/displacement measurement. The sensitivity distribution of the sensor depends largely on the geometry of the electrodes. Conductivity causes positive changes for the sensor in the transmission and single‐electrode mode, but negative changes for the sensor in the shunt mode. Experimental results confirm that sensing depths of the sensor arrays and the influence of buried conductor on capacitance measurements are in agreement with simulations.

Experimental verification is needed when a sensor is designed.

This paper provides a comprehensive study for planar capacitive sensors in terms of sensor design, evaluation and applications.

The purpose of this paper is to report on the feasibility of the manufacture of printed rechargeable power sources incorporating, in the first instance, electrode structures from the previous study, and moving on to improved electrode structures fabricated, via flexographic printing, using commercially available inks. It has been shown previously that offset lithography, a common printing technique, can be used to make electrodes for energy storage devices such as primary cells.

A pair of the original Ag/C electrodes, printed via offset lithography, were sandwiched together with a PVA-KOH gel electrolyte and then sealed. The resultant structures were characterised using electrochemical techniques and the performance as supercapacitors assessed. Following these studies, electrode structures of the same dimensions, consisting of two layers, a silver-based current collector covered with a high surface area carbon layer, were printed flexographically, using inks, on a melinex substrate. The characterisation and assessment of these structures, as supercapacitors, was determined.

It was found that the supercapacitors constructed using the offset lithographic electrodes exhibited a capacitance of 0.72 mF/cm2 and had an equivalent series resistance of 3.96 Ω. The structures fabricated via flexography exhibited a capacitance of 4 mF/cm2 and had an equivalent series resistance of 1.25 Ω The supercapacitor structures were subjected to bending and rolling tests to determine device performance under deformation and stress. It was found that supercapacitor performance was not significantly reduced by bending or rolling.

This paper provides insight into the use of printed silver/carbon electrodes within supercapacitor structures and compares the performance of devices fabricated using inks for offset lithographic printing presses and those made using commercially available inks for flexographic printing. The potential viability of such structures for low-end and cheap energy storage devices is demonstrated.

A contactless electromyography (EMG) electrodes design and development for prosthetics, particularly the Touch Hand 3, was the main objective of this paper. The correlation between EMG electrodes and patch antenna are described, with the problem relating to the dimensions of the covidien electrodes. The purpose of this paper is to improve the signal strength of the EMG electrodes and having them to not be in contact with the skin to cause irritation in the person.

A combination of the contact covidien electrodes and aluminium foil was used to develop electrodes that were in a similar configuration than a Yagi antenna. Different layers of patch elements were designed, developed and implemented.

Different layers of Yagi-patch electrodes are tested with different volunteers and compared with the average signal strengths obtained from the covidien electrodes. An improvement in signal strength with the Yagi-patch electrodes has been found.

The purpose of the work was to design, develop and test EMG electrodes that are cost-effective, reusable and able to improve the signal strengths that are recorded, for better functionality of prosthetic devices.

The integration of EMG and antennae theory to implement a Yagi-patch EMG electrode to improve on signal reception. The electrodes have the properties of being cheap, easy available, can eliminate direct contact and avoiding patches on the skin. Comparison of different layered electrodes with the contactless electrodes close to the skin. Comparison of the different electrodes on a silicone sleeve, which are commonly worn by amputees, placed between the skin and the prosthetic’s socket. Testing the Yagi-patch electrodes with an application with the prosthetic Touch Hand, to allow for the control of a system such as the Touch Hand.