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The purpose of this paper is to study the insulation structure optimization method of multiwinding high-frequency transformer (HFT).

This paper takes 100 kW, 10 kHz multiwinding HFT as the research object. First, the distribution of electric field strength within the core window of multiwinding HFT with different winding configurations is simulated by the electrostatic field finite element method. The symmetrical hybrid winding structure with minimum electric field strength is selected as the insulation design. To reduce the electric field strength at the end region of the winding, the electrostatic ring and angle ring are designed based on the response surface method.

The optimal results show that the maximum electric field strength can be reduced by 15.4%, and the low voltage stress can be achieved.

The above research provides guidance and basis for the optimal design of insulation structure of multiwinding HFT.

The purpose of this paper is to present experimental research on the behaviour of a new electrorheological fluid (ETSERF).

The ETSERF is a suspension based on diatomite powders dispersed in silicon oil with a surfactant. A design of experiments is conducted to investigate the effects of electric field strength, particle concentration, surfactant percentage, particle size and shear rate on the efficiency of ETSERFs. The influence of the interactions on shear stresses is analyzed by varying all the combinations of the independent variables. The dielectric properties of the ETSERF are investigated in order to explain the interactions between these independent variables. Furthermore, a quantitative relationship between the dynamic shear stresses and the independent variables is developed.

The relationship provides a very useful explanation for the contributions of each independent variable to the viscosity and yield stress.

A new empirical model is proposed to explain the rheological behaviour of the ER fluids with a shear‐thinning behaviour.

The purpose of this paper is to design a novel die-attach composite joint for high-temperature die-attach applications based on transient liquid phase bonding. Moreover, the microstructure, shear strength, electrical property, thermal conductivity and aging property of the composite joint were investigated.

The composite joint was made of microporous copper and Cu₃Sn. Microporous copper was immersed into liquid Sn to achieve Sn-microporous copper composite structure for die attachment. By the thermo-compression bonding, the Cu₃Sn-microporous copper composite joint with a thickness of 100 µm was successfully obtained after bonding at 350 °C for 5 min under a low pressure of 0.6 MPa.

After thermo-compression bonding, the resulting interconnection could withstand a high temperature of at most 676 °C, with the entire Sn transforming into Cu₃Sn with high remelting temperatures. A large shear strength could be achieved with the Cu₃Sn-microporous copper in the interconnections. The formed bondlines demonstrated a good electrical and thermal conductivity owing to the large existing amount of copper in the interconnections. Furthermore, the interconnection also exhibited excellent reliability under high temperature aging at 300 °C.

This die-attach composite joint was suitable for power devices operating under high temperatures or other harsh environments.

The use of Taguchi experimental design techniques to examine the effects of package type, solder paste type and solder reflow technique on the quality of fine pitch surface mount IC package solder joints is described. In particular, the effect of the use of ceramic or plastic packages, copper or Alloy 42 leadframes, silver loaded or non‐silver loaded solder paste and infra‐red, laser or hot‐bar reflow on solder joint metallurgical structure, electrical resistance and mechanical strength is evaluated. In addition to these solder joint parameters, an associated visual inspection was used to find the best process parameters to minimise solder balling, bridging etc. and a correlation between paste contacts at placement and solder bridges after reflow was also conducted. The experiment used an L9 array to find the optimum parameters from three factors, each at three levels. An extension to the basic Taguchi array was included in the form of an outer (noise) factor to include the effect of climatic stress on the solder joints under investigation. Response tables separate out the contribution of each factor level to the mechanical strength and electrical resistance of the assemblies. By comparing the response tables before and after climatic testing it is possible to estimate the effect of each factor level on the long‐term quality of the solder joints. It is shown how Taguchi experimental design techniques can be used to minimise the number of experiments required to predict optimum solder assembly process parameters. The accuracy of the prediction is shown by the results of a confirmation run which yielded mechanical strengths very close to those predicted, both before and after highly accelerated stress testing of the solder assemblies.

Electrospinning is a method of the polymer super thin fibres formation by the electrostatic field. The distribution of electrostatic field affects the effectiveness of the electrospinning.

This paper presents various computer models that can improve the electrospinning process. The possibilities of modelling the electrostatic field in the design of electrospinning equipment are presented.

In the research part, the one focussed on finding a cylinder-shaped collector structure to limit the adverse effect of an uneven distribution of the electric field intensity on the collector.

The paper concerns the improvement of the electrospinning process with the use of electrostatic field modelling. In the first part, several possible applications of electrostatic models have been indicated, thanks to which the efficiency of the process has been improved. The original solution of the collector geometry was presented, which according to the authors, in comparison with previous models, gives the most promising results. In this solution, it was possible to obtain an even distribution of the electric field intensity while removing the unfavourable effect of the field strength increase on the outer edges of the collector. The most important aspect in this paper is electric field strength analysis.

Introduces the fourth and final chapter of the ISEF 1999 Proceedings by stating electric and magnetic fields are influenced, in a reciprocal way, by thermal and mechanical fields. Looks at the coupling of fields in a device or a system as a prescribed effect. Points out that there are 12 contributions included ‐ covering magnetic levitation or induction heating, superconducting devices and possible effects to the human body due to electric impressed fields.

The purpose of this paper is to increase the reliability of manufactured electronics and to reveal reliability significant factors. The experiments were focused especially on the influence of the reflow oven parameters presented by a heating factor.

The shear strength of the surface mount device (SMD) resistors and their joint resistance were analyzed. The resistors were assembled with two Sn/Ag/Cu-based and one Bi-based solder pastes, and the analysis was done for several values of the heating factor and before and after isothermal aging. The measurement of thickness of intermetallic compounds was conducted on the micro-sections of the solder joints.

The shear strength of solder joints based on the Sn/Ag/Cu-based solder alloy started to decline after the heating factor reached the value of 500 s · K, whereas the shear strength of the solder alloy based on the Bi alloy (in the measured range) always increased with an increase in the heating factor. Also, the Bi-based solder joints showed shear strength increase after isothermal aging in contrast to Sn/Ag/Cu-based solder joints, which showed shear strength decrease.

The interpretation of the results of such a comprehensive measurement leads to a better understanding of the mutual relation between reliability and other technological parameters such as solder alloy type, surface finish and parameters of the soldering process.

The term “partial discharges” (PD) is a common term for various phenomena: discharges at points or edges of cylindrical conductors, in gases and gas insulated devices, liquid insulation materials, at borders between different insulation materials and, of course, in solid dielectrics. These phenomena result in insulation breakdowns, various disturbances to the environment, and after longer periods, some large‐scale failures. This paper presents the results of theoretical research of the behavior of a system of medium voltage covered conductors. This research work has been elaborated by the use of computer aided electric field calculations. For the confirmation of theoretical findings, practical measurements of partial discharges have been made.

The purpose of this paper is to present a new calculation method for increasing the shielded volume in which the external electromagnetic field is maximally reduced. In a space shielded in the way mentioned in this paper, it is possible to introduce measurement instruments and increase the accuracy of results obtained with them, as well as reduce the risk of unwanted electrostatic field influence on living organisms.

A new numerical procedure for the optimization of the coaxial ring conductor system for electrostatic shielding is developed in the paper. The optimization of the functional that consists of electrostatic energy density and a system of equations derived from the equipotential character of the conductor system is used. The system of nonlinear equations is obtained and then numerically solved by minimizing this functional. The first presented optimization procedure is based on the analytical optimization method using the Lagrange coefficients and gradient of the objective function.

It is possible to design a large number of protective ring formations. Applying the differential evolution optimization method, an optimal arrangement can be obtained for any specific number of rings. The differential evolution optimization method, which belongs to the class of evolutionary algorithms, is used for solving this very complex optimization problem. In combination with the above-mentioned method, excellent results in the elimination of the external electric field have been obtained. Although a larger number of rings provides more efficient protection, this number is limited from the economic point of view. Therefore, it is necessary to achieve a compromise between the number of rings, the size of volume shielded and the quality of protection.

There are few papers that address this problem, although the elimination of the influence of the external electromagnetic field has gained more importance lately. The presented method can be applied to increase the reliability of measured data, protection of the environment, in space research, etc. The main limiting factor for using a larger number of rings that provide better protection is the economical one.

The proposed method is suitable for the generalization of procedures, for the protection of the space where the external electric field needs to be reduced or eliminated.

This paper aims to introduce a new numerical model that predicts the flashover voltage (FOV) value in the presence of polluted air surrounding a high-voltage insulator. The model focuses on simulating the propagation of arcs and aims to improve the accuracy and reliability of FOV predictions under these specific conditions.

This arc propagation method connecting the high voltage fitting and the grounded insulator cap involves a two-step process. First, the electric field distribution in the vicinity of the insulator is obtained using finite element method analysis software. Subsequently, critical areas with intense electric field strength are identified. Random points within these critical areas are then selected as initial points for simulating the growth of electric arcs.

by increasing the electric voltage applied to the insulator fittings, the arc path is, step by step, generated until a breakdown occurs on the polluted air surrounding the insulator surface, and thus a prediction of the FOV value.

The proposed model for the FOV prediction can be a very interesting alternative to dangerous and costly experimental tests requiring an investment in time and materials.

Some works were done trying to reproduce discharge propagation but it was always with simplified models such as propagation in one direction from a point to a plane. The difficulty and the originality of the present work is the geometry complexity of the insulator with arc propagation in three distinct directions that will require several proliferation conditions.