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This paper aims to present a digital image processing (DIP)-based discrete element method (DEM) for the analysis of heterogeneous geomaterials. Taking a soil and rock mixture as an example, the direct shear test is used to illustrate the application of this method. The numerical result is validated by the laboratory experiment and implies its feasibility in the analysis of heterogeneous geomaterials.

This method has two major steps. Based on a modification of the connected-component labeling algorithm, a novel vectorization method, which can transform the digital photos to vectorized geometry automatically, is proposed first. Then, a simple yet effective method for the generation of heterogeneous DEM models is presented using the simulation of simplicity technique.

DIP-DEM method is a feasible approach for the analysis of mechanical behavior of heterogeneous material. For soil and rock mixtures (SRM), the horizantal deformation at peak shear point becomes larger with the normal stress. Compared with pure soil, the rock aggregates mainly improve the friction angle of SRM.

As a universal method taking advantage of both DIP and DEM, this method has broad application prospects in related fields.

Aluminium-doped zinc oxide thin films exhibit interesting optoelectronic properties, which make them suitable for fabrication of photovoltaic cell, flat panel display electrode, etc. It has been shown that aluminium dopant concentration and annealing treatment in reduced atmosphere are the major factors affecting the electrical and optical properties of aluminium doped zinc oxide (AZO) film. Here, the authors report the structural, optical and electrical properties of aluminium-doped zinc oxide thin films fabricated by dip coating technique and annealed in air atmosphere, thereby avoiding hazardous environments such as hydrogen. The aim of this paper was to systematically investigate the effect of annealing temperature on the electrical properties of dip-coated film.

Aluminium-doped ZnO thin films were prepared on corning substrates by dip coating method. Aluminium concentration in the film varied from 0.8 to 1.4 mol per cent. Films have been characterized by X-ray diffraction, scanning electron microscopy, atomic force microscopy, UV-visible spectroscopy and Hall measurements. The deposited films were heat treated at 450-600°C, in steps of 50°C for 1 h in air to study the improvement in electrical properties. Films were also prepared by annealing at 600°C in air for durations of 1, 2, 4 and 6 h. Envelope method was used to calculate the variation of the refractive index and extinction coefficient with wavelength.

The electrical resistivity is found to decrease considerably when the annealing time is increased from 1 to 4 h. The films exhibited high transmittance (>90 per cent) in the visible range, and the optical band gaps were found to change as per the Moss–Burstien effect, and this was consistent with the observed changes in the carrier concentration.

The study shows the effect of annealing in air, avoiding hazardous reduced environment, such as hydrogen, to study the improvement in electrical and optical properties of aluminum-doped zinc oxide films. Envelope method was used to calculate the variation of optical constants with wavelength.

This paper introduced the simple synthesis process of self-cleaning coating with fog-resistance property using hydrophobic polydimethylsiloxane (PDMS) polymer and nano-calcium carbonate (nano-CaCO₃) and titanium dioxide (TiO₂).

The synthesis method of PDMS/nano-CaCO₃-TiO₂ is based on sol-gel process. The crosslinking between PDMS and nanoparticles is driven by the covalent bond at temperature of 50°C. The 3-Aminopropyltriethoxysilane is used as binder for nanoparticles attachment in polymer matrix. Two fabrication methods are used, which are dip- and spray-coating methods.

The prepared coated glass fulfilled the requirement of standard self-cleaning and fog-resistance performance. For the self-cleaning test BS EN 1096-5:2016, the coated glasses exhibited the dust haze value around 20%–25% at tilt angle of 10°. For the antifog test, the coated glasses showed the fog haze value were below 2% and the gloss value were above 85%. The obtained results completely achieved the standard antifog value ASTM F659-06 protocol.

Findings will provide an infrastructure support for the building glass to enhance building’s energy efficiency, cleaning performance and friendly environment.

This study proposed the simple synthesis method using hydrophobic polymer and nano-CaCO₃ and nano-TiO₂, which can achieve optimum self-cleaning property at low tilt angle and fog-resistance performance for building glass.

The research findings have high potential for building company, cleaning building company and government sector. The proposed project capable to reduces the energy consumption about 20% per annum due to labor cost, time-consuming and safety during manual cleaning.

The novel method to develop self-cleaning coating with fog-resistance using simple synthesis process and fabrication method for building glass application.

This paper aims to comprehensively review the preparation methods of superhydrophobic surfaces (SHPS) for corrosion protection of Mg alloy in recent years.

The preparation methods, wettability and corrosion resistance of SHPS on Mg alloy in the past three years are systematically described in this paper.

Two types of SHPS, including single-layer and multilayer coatings for corrosion protection of Mg alloy are summarized. Preparing multilayered coatings with multifunction is the current trend in developing SHPS on Mg alloy.

This paper reviewed the preparation methods and corrosion resistance of SHPS on Mg alloys. It provides a valuable reference for researchers to develop highly durable SHPS with excellent corrosion resistance for Mg alloys.

The purpose of this paper is to investigate growth kinetics of interfacial Cu-Sn intermetallic compound (IMC) at the solid Cu/liquid Sn interface.

The Sn/Cu solid–liquid interfacial IMCs are fabricated under various soldering temperatures (240°C-270°C) and soldering times (5-240 s) by dipping method. The thickness and morphology of IMC are observed and analyzed by the optical microscope and scanning electron microscope.

Holding at 260°C, Cu/Sn solid–liquid interface Cu₆Sn₅ growth index experience a change from 0.08 to 0.30 within 10-190 s. The growth index is 0.08 in 10-40 s; the growth index is 0.30 in 40-190 s. Cu₆Sn₅ grain coarsening index is constant within 10-190 s. It is 0.13. The result of the index of Cu₆Sn₅ grain coarsening is different from predecessors 27 results Cu₆Sn₅ grain coarsening index for 1/3. This is because Cu₆Sn₅ grain grows at the expense of its near small grain to reduce the surface Gibbs free energy, and its morphology changes from regular shape to irregular shape. It sets up the mathematical expression about the initial formation time and temperature of Cu₃Sn in 240°C-270°C.

It obtains a mathematical model to express the changes of solid–liquid interface frontier concentration which has an effect on the interfacial Cu₆Sn₅ layer growth index and the Cu₆Sn₅ grain coarsening index. Different indexes can be obtained by establishing relevance equations, which can be used to predict the growth of the interface IMC layer. This mathematical model is established to design the solder pads and the sizes of the solder joints.

The purpose of this paper is to design a novel optimized biped robot gait generator which plays an important role in helping the robot to move forward stably. Based on a mathematical point of view, the gait design problem is investigated as a constrained optimum problem. Then the task to be solved is closely related to the evolutionary calculation technique.

Based on this fact, this paper proposes a new way to optimize the biped gait design for humanoid robots that allows stable stepping with preset foot-lifting magnitude. The newly proposed central force optimization (CFO) algorithm is used to optimize the biped gait parameters to help a nonlinear uncertain humanoid robot walk robustly and steadily. The efficiency of the proposed method is compared with the genetic algorithm, particle swarm optimization and improved differential evolution algorithm (modified differential evolution).

The simulated and experimental results carried out on the small-sized nonlinear uncertain humanoid robot clearly demonstrate that the novel algorithm offers an efficient and stable gait for humanoid robots with respect to accurate preset foot-lifting magnitude.

This paper proposes a new algorithm based on four key gait parameters that enable dynamic equilibrium in stable walking for nonlinear uncertain humanoid robots of which gait parameters are initiatively optimized with CFO algorithm.

The purpose of this paper is to introduce the simple synthesis process of thermal-insulation coating by using three different nanoparticles, namely, nano-zinc oxide (ZnO), nano-tin dioxide (SnO₂) and nano-titanium dioxide (TiO₂), which can reduce the temperature of solar cells.

The thermal-insulation coating is designed using sol-gel process. The aminopropyltriethoxysilane/methyltrimethoxysilane binder system improves the cross-linking between the hydroxyl groups, -OH of nanoparticles. The isopropyl alcohol is used as a solvent medium. The fabrication method is a dip-coating method.

The prepared S1B1 coating (20 Wt.% of SnO₂) exhibits high transparency and great thermal insulation property where the surface temperature of solar cells has been reduced by 13°C under 1,000 W/m² irradiation after 1 h. Meanwhile, the Z1B2 coating (20 Wt.% of ZnO) reduced the temperature of solar cells by 7°C. On the other hand, the embedded nanoparticles have improved the fill factor of solar cells by 0.2 or 33.33%.

Findings provide a significant method for the development of thermal-insulation coating by a simple synthesis process and low-cost materials.

The thermal-insulation coating is proposed to prevent exterior heat energy to the inside solar panel glass. At the same time, it can prevent excessive heating on the solar cell’s surface, later improves the efficiency of solar cell.

This study presents a the novel method to develop and compare the thermal-insulation coating by using various nanoparticles, namely, nano-TiO₂, nano-SnO₂ and nano-ZnO at different weight percentage.

The paper aims to design the optimum formulation of the nano-titanium dioxide (TiO2) hydrophilic coating system using the synthetic polypropylene glycol (PPG), which can create the reflection and absorption property.

TiO2 nanoparticles are used as fillers, and PPG has been blended at the proper ratio of 1PPG: 0.2TiO2. The prepared resin has been applied onto the glass substrate at different numbers of glass immersions during the dip-coating fabrication process. One-time glass immersion is labeled as T1 coating, two-time glass immersion is labeled as T2 coating and three-time glass immersion is labeled as T3 coating. All the prepared coating systems were left dry at ambient temperature.

T3 coating showed the lowest reading of WCA value at 40.50°, due to higher surface energy at 61.73 mN/m. The T3 coating also shows the greatest absorbance property among the prepared coating systems among the prepared coating. In terms of reflectance property, the T2 coating system has great reflectance in UV region and near-infrared region, which is 16.47% and 2.77 and 2.73%, respectively. The T2 coating also has great optical transmission about 75.00% at the visible region.

The development of thermal insulation coating by studying the relationship between convection heat and reflectance at different wavelengths of incident light.

The developed coating shows high potential for glass window application.

The application of the hydrophilic coating on light absorption, reflectance and transmission at different wavelengths.

The aim of the present study was to gather and review all the important properties of the Sn–Ag–Cu (SAC) solder alloy. The SAC solder alloy has been proposed as the alternative solder to overcome the environmental concern of lead (Pb) solder. Many researchers have studied the SAC solder alloy and found that the properties such as melting temperature, wettability, microstructure and interfacial, together with mechanical properties, are better for the SAC solder than the tin – lead (SnPb) solders. Meanwhile, addition of various elements and nanoparticles seems to produce enhancement on the prior bulk solder alloy as well. These benefits suggest that the SAC solder alloy could be the next alternative solder for the electronic packaging industry. Although many studies have been conducted for this particular solder alloy, a compilation of all these properties regarding the SAC solder alloy is still not available for a review to say.

Soldering is identified as the metallurgical joining method in electronic packaging industry which uses filler metal, or well known as the solder, with a melting point < 425°C (Yoon et al., 2009; Ervina and Marini, 2012). The SAC solder has been developed by many methods and even alloying it with some elements to enhance its properties (Law et al., 2006; Tsao et al., 2010; Wang et al., 2002; Gain et al., 2011). The development toward miniaturization, meanwhile, requires much smaller solder joints and fine-pitch interconnections for microelectronic packaging in electronic devices which demand better solder joint reliability of SAC solder Although many studies have been done based on the SAC solder, a review based on the important characteristics and the fundamental factor involving the SAC solder is still not sufficient. Henceforth, this paper resolves in stating all its important properties based on the SAC solder including its alloying of elements and nanoparticles addition for further understanding.

Various Pb-free solders have been studied and investigated to overcome the health and environmental concern of the SnPb solder. In terms of the melting temperature, the SAC solder seems to possess a high melting temperature of 227°C than the Pb solder SnPb. Here, the melting temperature of this solder falls within the range of the average reflow temperature in the electronic packaging industry and would not really affect the process of connection. A good amendment here is, this melting temperature can actually be reduced by adding some element such as titanium and zinc. The addition of these elements tends to decrease the melting temperature of the SAC solder alloy to about 3°C. Adding nanoparticles, meanwhile, tend to increase the melting temperature slightly; nonetheless, this increment was not seemed to damage other devices due to the very slight increment and no drastic changes in the solidification temperature. Henceforth, this paper reviews all the properties of the Pb-free SAC solder system by how it is developed from overcoming environmental problem to achieving and sustaining as the viable candidate in the electronic packaging industry. The Pb-free SAC solder can be the alternative to all drawbacks that the traditional SnPb solder possesses and also an upcoming new invention for the future needs. Although many studies have been done in this particular solder, not much information is gathered in a review to give better understanding for SAC solder alloy. In that, this paper reviews and gathers the importance of this SAC solder in the electronic packaging industry and provides information for better knowledge.

This paper resolves in stating of all its important properties based on the SAC solder including its alloying of elements and nanoparticles addition for further understanding.