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The purpose of this study is to introduce a new type of sensor which uses microwave metamaterials and direct-coupled split-ring resonators (DC-SRRs) to measure the dielectric properties of solid materials in real time. The sensor uses a transmission line with a bridge-type structure to measure the differential frequency, which can be used to calculate the dielectric constant of the material being tested. The study aims to establish an empirical relationship between the dielectric properties of the material and the frequency measurements obtained from the sensor.

In the proposed design, the opposite arm of the bridge transmission line is loaded by DC-SRRs, and the distance between DC-SRRs is optimized to minimize the mutual coupling between them. The DC-SRRs are loaded with the material under test (MUT) to perform differential permittivity sensing. When identical MUT is placed on both resonators, a single transmission zero (notch) is obtained, but non-identical MUTs exhibit two split notches. For the design of differential sensors and comparators based on symmetry disruption, frequency splitting is highly useful.

The proposed structure is demonstrated using electromagnetic simulation, and a prototype of the proposed sensor is fabricated and experimentally validated to prove the differential sensing principle. Here, the sensor is analyzed for sensitivity by using different MUTs with relative permittivity ranges from 1.006 to 10 and with a fixed dimension of 9 mm × 10 mm ×1.2 mm. It shows a very good average frequency deviation per unit change in permittivity of the MUTs, which is around 743 MHz, and it also exhibits a very high average relative sensitivity and quality factor of around 11.5% and 323, respectively.

The proposed sensor can be used for differential characterization of permittivity and also as a comparator to test the purity of solid dielectric samples. This sensor most importantly strengthens robustness to environmental conditions that cause cross-sensitivity or miscalibration. The accuracy of the measurement is enhanced as compared to conventional single- and double-notch metamaterial-based sensors.

The purpose of this study is to utilize two types of gypsum mold wastes from two different factories as novel and economical reinforcing fillers for composites that may be useful for building materials and floors. Two types of gypsum mold wastes from two different factories as raw materials were incorporated into linear low density polyethylene (LLDPE) aiming to get rid of that waste in one hand and obtaining useful economical composites suitable for building materials and floors.

Composites were prepared from two types of gypsum mold wastes substituted with different ratios from raw gypsum and LLDPE throughout the melt blending technique. The physico-mechanical and electrical investigations in addition to the morphology of the composites were included.

The mechanical results illustrate that substituting commercial gypsum with gypsum mold waste positively affects tensile strength, flexural strength and hardness shore D for the LLDPE composites. The tensile strength increased from 5 MPa for LLDPE filled with commercial gypsum as blank samples to 11.2 and 13.2 MPa for LLDPE filled with D and S waste. Also, electrical properties which include both permittivity ɛ′ and dielectric loss ɛ″ increased with increasing the waste content in the LLDPE matrix. In addition to the electrical conductivity values, σ lies in the order of insulation materials. Consequently, it is possible to produce materials with a gypsum matrix by adding industrial waste, improving the behavior of the traditional gypsum and enabling those composites to be applied in various construction applications as eco-friendly tiles.

This study aims to prepare eco-friendly composites based on LLDPE and waste gypsum mold to preserve resources for the coming generations, other than lowering the environmental footprint and saving the costs of getting rid of it.

This study aims to get rid of non-degradable polyvinyl chloride (PVC) waste as well as sunflower seed cake (SSC) waste by preparing eco-friendly composites from both in different proportions to reach good mechanical and insulating properties for antimicrobial and antistatic applications.

Eco-friendly composite films based on waste polyvinylchloride (WPVC) and SSC of concentrations (0, 10, 20, 30 and 40 Wt.%) were prepared using solution casting method. Further, the effect of sunflower seed oil (SSO) on the biophysical properties of the prepared composites is also investigated. Fourier transform infrared spectroscopy, X-ray diffraction (XRD), scanning electron microscope, mechanical, thermal, dielectric properties were assessed. Besides, the antimicrobial and biodegradation tests were also studied.

The crystallinity increases by rising SSC concentration as revealed by XRD results. Additionally, the permittivity (ε′) increases by increasing SSC filler and SSO as well. A remarkable increase in dc conductivity was attained after the addition of SSO. While raw WPVC has very low bacterial activity. The composite films are found to be very effective against staphylococcus epidermidis, staphylococcus aureus bacteria and against candida albicans as well. On the other hand, the weight loss of WPVC increases by adding of SSC and SSO, as disclosed by biodegradation studies.

The study aims to reach the optimum method for safe and beneficial disposal of PVC waste as well as SSC for antistatic and antimicrobial application.

Among the various applications involving the use of microwave energy, its growing utility within the mining industry is particularly noteworthy. Conventional grinding processes are often overburdened by energy inefficiencies that are directly related to machine wear, pollution and rising project costs. In this work, we numerically investigate the effects of microwave pretreatment through a series of compression tests as a means to help mitigate these energy inefficiencies.

We investigate the effects of microwave pretreatment on various rock samples, as quantified by uniaxial compression tests. In particular, we assign sample heterogeneity based on a Gaussian statistical distribution and invoke a damage model for elemental tensile and compressive stresses based on the maximum tensile stress and the Mohr–Coulomb theories, respectively. We further couple the electromagnetic, thermal and solid displacement relations using finite element modeling.

(1) Increased power intensity during microwave pretreatment results in decreased axial compressive stress. (2) Leveraging statistics to induce variable compressive and tensile strength can greatly facilitate sample heterogeneity and prove necessary for damage modeling. (3) There exists a nonlinear trend to the reduction in smax with increasing power levels, implying an optimum energy output efficiency to create the maximum degradation-power cost relationship.

Previous research in this area has been largely limited to two-dimensional thermo-electric models. The onset of high-performance computing has allowed for the development of high-fidelity, three-dimensional models with coupled equations for electromagnetics, heat transfer and solid mechanics.

This paper aims to present the design development and measurement of two aerodynamic slotted X-bands back-to-back planer substrate-integrated rectangular waveguide (SIRWG/SIW) to Microstrip (MS) line transition for satellite and RADAR applications. It facilitates the realization of nonplanar (waveguide-based) circuits into planar form for easy integration with other planar (microstrip) devices, circuits and systems. This paper describes the design of a SIW to microstrip transition. The transition is broadband covering the frequency range of 8–12 GHz. The design and interconnection of microwave components like filters, power dividers, resonators, satellite dishes, sensors, transmitters and transponders are further aided by these transitions. A common planar interconnect is designed with better reflection coefficient/return loss (RL) (S₁₁/S₂₂ ≤ 10 dB), transmission coefficient/insertion loss (IL) (S₁₂/S₂₁: 0–3.0 dB) and ultra-wideband bandwidth on low profile FR-4 substrate for X-band and Ku-band functioning to interconnect modern era MIC/MMIC circuits, components and devices.

Two series of metal via (6 via/row) have been used so that all surface current and electric field vectors are confined within the metallic via-wall in SIW length. Introduced aerodynamic slots in tapered portions achieve excellent impedance matching and tapered junctions with SIW are mitered for fine tuning to achieve minimum reflections and improved transmissions at X-band center frequency.

Using this method, the measured IL and RLs are found in concord with simulated results in full X-band (8.22–12.4 GHz). RLC T-equivalent and p-equivalent electrical circuits of the proposed design are presented at the end.

The measurement of the prototype has been carried out by an available low-cost X-band microwave bench and with a Keysight E4416A power meter in the microwave laboratory.

The transition is fabricated on FR-4 substrate with compact size 14 mm × 21.35 mm × 1.6 mm and hence economical with IL lie within limits 0.6–1 dB and RL is lower than −10 dB in bandwidth 7.05–17.10 GHz. Because of such outstanding fractional bandwidth (FBW: 100.5%), the transition could also be useful for Ku-band with IL close to 1.6 dB.

This paper aims to introduce a new numerical model that predicts the flashover voltage (FOV) value in the presence of polluted air surrounding a high-voltage insulator. The model focuses on simulating the propagation of arcs and aims to improve the accuracy and reliability of FOV predictions under these specific conditions.

This arc propagation method connecting the high voltage fitting and the grounded insulator cap involves a two-step process. First, the electric field distribution in the vicinity of the insulator is obtained using finite element method analysis software. Subsequently, critical areas with intense electric field strength are identified. Random points within these critical areas are then selected as initial points for simulating the growth of electric arcs.

by increasing the electric voltage applied to the insulator fittings, the arc path is, step by step, generated until a breakdown occurs on the polluted air surrounding the insulator surface, and thus a prediction of the FOV value.

The proposed model for the FOV prediction can be a very interesting alternative to dangerous and costly experimental tests requiring an investment in time and materials.

Some works were done trying to reproduce discharge propagation but it was always with simplified models such as propagation in one direction from a point to a plane. The difficulty and the originality of the present work is the geometry complexity of the insulator with arc propagation in three distinct directions that will require several proliferation conditions.

The purpose of this paper is to illustrate the new technical demands and reliability challenges to printed circuit board (PCB) designs, materials and processes when the transmission frequency increases from Sub-6 GHz in previous generations to millimeter (mm) wave in fifth-generation (5G) communication technology.

The approach involves theoretical analysis and actual case study by various characterization techniques, such as a stereo microscope, metallographic microscope, scanning electron microscope, energy dispersive spectroscopy, focused ion beam, high-frequency structure simulator, stripline resonator and mechanical test.

To meet PCB signal integrity demands in mm-wave frequency bands, the improving proposals on copper profile, resin system, reinforcement fabric, filler, electromagnetic interference-reducing design, transmission line as well as via layout, surface treatment, drilling, desmear, laminating and electroplating were discussed. And the failure causes and effects of typical reliability issues, including complex permittivity fluctuation at different frequencies or environments, weakening of peel strength, conductive anodic filament, crack on microvias, the effect of solder joint void on signal transmission performance and soldering anomalies at ball grid array location on high-speed PCBs, were demonstrated.

The PCB reliability problem is the leading factor to cause failures of PCB assemblies concluded from statistical results on the failure cases sent to our laboratory. The PCB reliability level is very essential to guarantee the reliability of the entire equipment. In this paper, the summarized technical demands and reliability issues that are rarely reported in existing articles were discussed systematically with new perspectives, which will be very critical to identify potential reliability risks for PCB in 5G mm-wave applications and implement targeted improvements.

Gas insulated systems, such as gas insulated lines (GIL), use insulating gas, mostly sulfur hexalfluoride (SF₆), to enable a higher dielectric strength compared to e.g. air. However, under high voltage direct current conditions, charge accumulation and electric field stress may occur, which may lead to partial discharge or system failure. Therefore, numerical simulations are used to design the system and determine the electric field and charge distribution. Although the gas conduction shows a more complex current–voltage characteristic compared to solid insulation, the electric conductivity of the SF₆ gas is set as constant in most works. The purpose of this study is to investigate different approaches to address the conduction in the gas properly for numerical simulations.

In this work, two approaches are investigated to address the conduction in the insulating gas and are compared to each other. One method is an ion-drift-diffusion model, where the conduction in the gas is described by the ion motion in the SF₆ gas. However, this method is computationally expensive. Alternatively, a less complex approach is an electro-thermal model with the application of an electric conductivity model for the SF₆ gas. Measurements show that the electric conductivity in the SF₆ gas has a nonlinear dependency on temperature, electric field and gas pressure. From these measurements, an electric conductivity model was developed. Both methods are compared by simulation results, where different parameters and conditions are considered, to investigate the potential of the electric conductivity model as a computationally less expensive alternative.

The simulation results of both simulation approaches show similar results, proving the electric conductivity for the SF₆ gas as a valid alternative. Using the electro-thermal model approach with the application of the electric conductivity model enables a solution time up to six times faster compared to the ion-drift-diffusion model. The application of the model allows to examine the influence of different parameters such as temperature and gas pressure on the electric field distribution in the GIL, whereas the ion-drift-diffusion model enables to investigate the distribution of homo- and heteropolar charges in the insulation gas.

This work presents numerical simulation models for high voltage direct current GIL, where the conduction in the SF₆ gas is described more precisely compared to a definition of a constant electric conductivity value for the insulation gas. The electric conductivity model for the SF₆ gas allows for consideration of the current–voltage characteristics of the gas, is computationally less expensive compared to an ion-drift diffusion model and needs considerably less solution time.

Electrical characteristics of transformer oil (TO) have been studied during normal and thermal aging conditions. In this paper, breakdown voltage (BDV), partial discharge (PD), heat transfer results and the physical mechanisms considering the impact of varying the diameter of Al₂O₃ nanoparticles (NPs) have been investigated. Different quantities of the two sizes of Al₂O₃ were added to the oil using a two-step method to determine the positive effect of NPs on the electrical and thermal properties of TO. Finally, the physical mechanisms related to the obtained experimental results have been performed.

The implementation of nanoparticles in this paper was provided by US Research Nanomaterials, Inc., USA. The provided Al₂O₃ NPs have an average particle size of 20–80 nm and a specific surface area of 138 and 58 m²/g, respectively, which have a purity of over 99%. Thermal aging has been done. The IEC 60156 standard has been implemented to calculate the BDV, and a 500-mL volume test cell (Apar TO 1020) has been used. PD test is performed according to Standard IEC 60343, and a JDEVS-PDMA 300 device was used for this test.

BDV tests indicate that 20 nm Al₂O₃ is more effective at improving BDV than 80 nm Al₂O₃, with an improvement of 113% compared to 99% for the latter. The analysis of Weibull probability at BDV indicates that 20 nm Al₂O₃ performs better, with improvements of 141%, 125% and 112% at probabilities of 1, 10 and 50%, respectively. The results of the PD tests using the PDPR pattern also show that 20 nm Al₂O₃ is superior. For the heat transfer test, 0.05 g/L of both diameters were used to ensure fair conditions, and again, the advantage was with 20 nm Al₂O₃ (23% vs 18%).

The effect of Al₂O₃ NP diameter (20 and 80 nm) on various properties of virgin and aged TO has been investigated experimentally in this paper to examine the effect of proposed NP on electrical improvement of TO.

This study aims to design and validate a theoretical model for capacitive imaging (CI) sensors that incorporates the interelectrode shielding and surrounding shielding electrodes. Through experimental verification, the effectiveness of the theoretical model in evaluating CI sensors equipped with shielding electrodes has been demonstrated.

The study begins by incorporating the interelectrode shielding and surrounding shielding electrodes of CI sensors into the theoretical model. A method for deriving the semianalytical model is proposed, using the renormalization group method and physical model. Based on random geometric parameters of CI sensors, capacitance values are calculated using both simulation models and theoretical models. Three different types of CI sensors with varying geometric parameters are designed and manufactured for experimental testing.

The study’s results indicate that the errors of the semianalytical model for the CI sensor are predominantly below 5%, with all errors falling below 10%. This suggests that the semianalytical model, derived using the renormalization group method, effectively evaluates CI sensors equipped with shielding electrodes. The experimental results demonstrate the efficacy of the theoretical model in accurately predicting the capacitance values of the CI sensors.

The theoretical model of CI sensors is described by incorporating the interelectrode shielding and surrounding shielding electrodes into the model. This comprehensive approach allows for a more accurate evaluation of the detecting capability of CI sensors, as well as optimization of their performance.