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The increasing use of high switching speed systems in both microwave electronics and high speed logic devices has created the need for printed circuit boards which are based on low dielectric constant and low loss materials. In addition, these circuit materials must be capable of withstanding elevated temperatures typical of hostile service environments and of board fabrication processes. Such low dielectric constant rigid boards are commercially available from a few sources. However, there is a growing demand for low dielectric constant flexible printed circuit boards for interconnecting rigid boards or in rigid/flex applications where high speed, fast rise times, controlled impedance and low crosstalk are important. A new family of thin laminates which are suitable for fabrication of flexible low dielectric constant printed circuit boards have been developed by Rogers Corporation. These circuit materials are called ROhyphen;2500 laminates and offer flexible interconnections in high speed electronic systems. RO‐2500 circuit materials are based on microglass reinforced fluorocarbon composites and have a typical dielectric constant of 25. The transmission line properties of these materials have been evaluated by the IPC‐FC‐201 test method. The results indicated that these circuit materials improve the propagation velocity by about 10% and the rise time by about 30% when compared with the same geometry, polyimide film based, flexible PCs in stripline constructions. Also, dimensional stability of these laminates after etch and heat ageing is improved over that of the standard flex circuit materials based on polyimide film. RO‐2500 laminate properties have been evaluated by the IPC‐TM‐650 test methods, which are widely accepted by the flexible PCB industry.

This paper aims to focus on the evaluation of the electrical properties of bio-based polyurethane material derived from cashew nut husk tannin and also the effect of temperature and frequency on the dielectric values and alternate current (AC) conductivity.

Bio-based polyurethane is prepared from cashew nut husk tannin as polyol, their dielectric constant and dielectric loss factor are measured using an inductance capacitance resistance (LCR) metre, and the AC conductivity is determined using dielectric constant and loss values.

The dielectric constant values are high, and the values decrease with an increase in frequency but increase with an increase in temperature. The AC conductivity values are low; hence, the material can be categorized as insulators or semi-conductors. Because the polyurethanes have a good dielectric value and are cost-effective, as they are derived from renewable biomaterial waste, they have promising applications for the future.

The experiment is carried out up to the frequency of 200 KHz because of the limitation in the instrument. But for the institute of printed circuits (IPC) and other specifications, the values of dielectric loss and dielectric constant will be generally coated for 1 MHz.

The high dielectric constant and loss values show that the polyurethane can be opted for use as capacitors in electronic devices, and the values are comparable to the requirements of IPC4101A/24IPC; hence, they are suitable for the application as printed circuit board (PCB) laminate.

The use of biomaterial waste in the production of polyurethane will bring down the dependence of polyurethane industry on fossil fuel reserve, reduce carbon dioxide foot print and reduce the cost of production.

The motivation of the work was its ecological aspect and also aims on the use of an alternative bio-based material in the PCB industry.

Low dielectric constant printed circuit board materials are becoming available. There are four or more materials that can produce boards with a dielectric constant of 28. This paper will discuss the electrical and system advantages of having a lower dielectric constant, and the advantages and disadvantages of each of the principal new materials. In particular, the use of lower dielectric to increase circuit density will be stressed, rather than the more usual expectation that the lower dielectric constant will be used to increase propagation velocity or reduce capacitance. The increase in circuit density will reduce the size of boards, and achieve the reduction in propagation delay even though the capacitance and characteristic impedance are unchanged.

The purpose of this paper is to analyse the influence of various firing profiles on microstructural and dielectric properties of low-temperature, co-fired ceramic (LTCC) substrates in a GHz frequency range. According these analyses, sintering process can be controlled and modified to achieve better performance of devices fabricated from LTCC substrates.

Samples from LTCC substrates GreenTape 951 and GreenTape 9K7 were sintered by four firing profiles. Basic firing profile recommended by the manufacturer was modified by increasing the peak temperature or the dwell time at the peak temperature. The influence of firing profile on microstructural properties was analysed according to measurements by X-ray diffractometer (application of the Cu K-alpha radiation and the Bragg-Brentano method), and the influence on dielectric properties (dielectric constant and dielectric losses) was analysed according to measurements by split cylinder resonator method at 9.7 and 12.5 GHz.

Rising of the peak temperature or extension of dwell time at this temperature has influence on all analysed properties of LTCC substrates. Size of crystallites can be changed by modification of firing profile as well as microdeformation. In addition, dielectric properties can be changed too by modification of the firing profile. Correlation between microdeformation and dielectric losses was observed.

The novelty of this work lies in finding the mutual relationship between changes in microstructural (size of grains and microdeformation) and dielectric properties (dielectric constant and dielectric losses) caused by different firing profiles.

This paper aims to present a method for the reduction of dielectric constant of low-temperature co-fired ceramics (LTCC) substrates with the use of controlled internal porosity.

A glass-ceramic green tape with addition of graphite as a pore former was developed. The green tapes were laminated and then sintered into multilayer structures with porous interior and thin external dense layers. Microstructure of green and fired structures was studied using optical and scanning microscopy. The behavior of the samples during heating was examined in a heating microscope. Impedance spectroscopy was applied for investigation of dielectric properties of the fabricated substrates.

Microstructure and dielectric properties of the fabricated LTCC structures were compared with the characteristics for non-porous samples with the similar composition. Introduction of 50 Wt.% admixture of graphite in the internal layers of the LTCC substrate was found to result in decrease in dielectric constant value down to about 3. Application of non-porous outer layers improved mechanical strength of the structure and smoothness of its surface, allowing screen printing of conductive pastes on both sides of the substrate.

The rapid growth of the wireless communication industry has created a great demand for the development of new and improved materials and devices operating properly at high frequencies. The fabricated materials can be useful for substrates of microwave devices.

The paper presents an innovative method of dielectric constant decrease of substrate materials. Getting insight into the phenomena responsible for formation of pores is crucial for designing materials for microwave electronics.

The purpose of this paper is to create multilayer substrate (composite) from various low temperature co-fired ceramic (LTCC) substrates by their mutual combinations and to analyse influence of these multilayer substrates on dielectric properties in GHz frequency range.

GreenTape 951, GreenTape 9K7 and Murata LFC were used to create compound multilayer substrates that include three layers: middle layer is from Murata LFC, and both upper and bottom layers are either from GreenTape 951 or GreenTape 9K7. Shrinkage in all x-, y- and z-axes of all substrates including multilayer substrates were analysed, and influence of different shrinkage on dielectric properties was examined by microstrip ring resonators applied on all mentioned of substrates.

The middle layer of Murata LFC has significant influence on shrinkage value of composites which has a good repeatability and minimalizes problems with design of multilayer LTCC devices. Impact of middle layer from Murata LFC on dielectric constant is not significant, but on the other hand Q factor (loss tangent) of these composites is increased according to inhomogeneity between single LTCC layers, especially at frequency around 6 GHz.

The novelty of this work lies in creating multilayers systems from different types of LTCC substrates to find combination with the most suitable physical and dielectric properties for various purposes in GHz range applications.

The purpose of this paper is to describe the use of copper‐substituted nickel manganite thick film and bulk ceramic superstrate on Ag thick film microstrip straight resonator (MSR), to modify its response and measure complex permittivity as a function of copper.

The glass frit free (fritless) copper‐substituted nickel manganite thick films were formulated on alumina substrate by screen printing technique from the powder synthesized by oxalic precursor method. A comparison has been made between the X band response of Ag thick film MSR due to perturbation of bulk and thick film Ni_(1−x)Cu_xMn₂O₄ (0≤x≤1) ceramic. The shift has been used to measure the permittivity of the ceramic. The dielectric constants obtained by superstrate technique on Ag thick film microstrip component are comparable to those obtained from theoretical calculations.

The resonance frequency of MSR shifts towards lower frequency due to the presence of Ni_(1−x)Cu_xMn₂O₄ (0≤x≤1) ceramic as superstrate. The dielectric constant of bulk and thick film match well with the theoretical values. The dielectric constant increases with copper concentration and shows reduction of power gain of MSR. The peak output (power gain) of MSR due to thick film NiMn₂O₄ increases by 10.19 per cent with decrease in bandwidth and increase in the quality factor with copper concentration.

The superstrate on Ag thick film straight resonator is an efficient tool capable of detecting the composition‐dependent changes in microwave properties of ceramic thick films. These Ni_(1−x)Cu_xMn₂O₄ ceramic being thermistor materials apart from modifying the response can also be used as power sensors providing cost‐effective miniaturization.

The purpose of this paper on the one hand is to reduce the sintering temperature, shorten the sintering time and improve the electrical properties of the sample through the two-step flash sintering method and on the other hand is to study the effect of electric field on the phase structure, microstructure and electrical properties of the flash sintering sample.

In this paper, (Mg_1/3Ta_2/3)_0.01Ti_0.99O₂ giant dielectric ceramics were prepared by conventional sintering and two-step flash sintering, respectively. Further, the effect of electric field (600–750 V/cm) on the electrical properties of (Mg_1/3Ta_2/3)_0.01Ti_0.99O₂ giant dielectric ceramics was studied.

The results show that compared with the conventional sintering, the sintering temperature of the two-step flash sintering can be reduced by 200°C and the sintering time can be shortened by 12 times. All sintered samples were single rutile TiO₂ structure. Compared with conventional sintering, two-step flash sintering samples have finer grain size. The two-step flash sintered sample has similar dielectric properties to the conventional sintered sample. The dielectric constant of flash sintered samples decreases with the increase of electric field. When the electric field is 700 V/cm, the ceramic sample has the optimal dielectric properties, where the dielectric constant is approximately 5.5 × 10³ and the dielectric loss is about 0.18 at 1 kHz. Impedance spectroscopy analysis shows that the excellent dielectric properties are attributed to the internal barrier layer capacitance model.

This paper not only provides a new method for the preparation of co-doped TiO₂ giant dielectric ceramics but also has great potential in greatly improving efficiency and saving energy.

This paper addresses materials and processes for printed wiring board compatible embedded capacitors using polymer/ceramic nanocomposites and hydrothermal barium titanate. Polymers allow low temperature fabrication appropriate to the board (MCM‐L) technology. The lower dielectric constants of the commercially available polymers can be greatly compensated by incorporating higher permittivity ceramic fillers. Materials requirements for higher capacitance density (>30 nF/cm²) have been addressed through implementation of a novel low‐temperature processable hydrothermal barium titanate film on a patterned titanium foil laminated to the PWB. Application of hydrothermal grown barium titanate is currently being evaluated using a multi‐layer system‐on‐package demonstration.

The purpose of this paper is to investigate and present the properties of a new substrate material based on thermoplastic polymers (so‐called LuVo Board) for high‐frequency applications.

The thermal, mechanical and electrical properties of a new thermoplastic substrate are investigated and compared to conventional substrates for printed circuit board (PCB) applications.

The new LuVo Board exhibits similar properties to commercially available high‐performance substrates. The main advantage of the LuVo Board is a reduction of manufacturing costs in comparison to conventional substrates, as a highly automated manufacturing process can be employed. Moreover, the LuVo Board exhibits some further advantages: the material is inherently flame resistant and can be thermally shaped after the assembly process.

This paper presents an entirely new thermoplastic substrate, which can be employed in high‐frequency applications. In comparison to standard materials, a further advantage of the thermoplastic substrate is lower production costs.