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The mechanical and thermal responses of encapsulated flip chip solder bumps on a surface laminar circuit (SLC) board have been determined in this study. The mechanical responses of the solder bumps and encapsulant have been obtained by shear, tension and torsion tests. The thermal stress and strain in the solder bumps and encapsulant have been determined by a non‐linear finite element method and the thermal fatigue life of the corner solder bump is then estimated based on the calculated plastic strains, Coffin‐Manson law and isothermal fatigue data of solders. Also, an assembly process of the test boards is presented.

During the first half of this year the Association has continued to expand its exhibition programme by increasing its presence at overseas shows. Two DTI sponsored joint venture groups have been formed, one to Nepcon West, the other to Nepcon Beijing. Anaheim saw the biggest UK group for over 10 years, with CEMA taking three separate blocks in different sectors of the show. There is no doubt from the reception we received that CEMA is now firmly established at Nepcon West. We enjoyed tremendous support from both the British Consulate and the British‐American Chamber of Commerce with their President making several visits to the CEMA booth.

President Bush recently announced that Northern Telecom had received a presidential award recognising innovation and leadership in protecting the environment. Fulfilling a pledge made in 1988, Northern Telecom became the world's first large electronics company to meet a public commitment to eliminate ozone‐depleting CFC‐113 solvents from its 42 worldwide manufacturing operations. The goal was achieved nine years ahead of the mandate set by the Montreal Protocol, an international agreement signed by 68 nations that calls for the elimination of CFCs and other ozone‐depleting substances by the year 2000.