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This study aims to elucidate the reaction mechanism of electroless NiP deposits on conductive but non-catalytic Cu films on the basis of their nucleation and growth without Pd catalyst and to measure the deposition rate and activation energy of electroless NiP deposits on the non-catalytic Cu film at various deposition times (60, 120, 240 and 480 s) and temperatures (70, 80 and 90°C) at pH 4.6.

Specimens with and without Pd catalyst on Cu film were prepared as follows: the Pd catalyst was deposited on half of the Cu film using a deposition protector, and the specimen containing the Pd catalyst deposited on half of its area was immersed in electroless NiP solution. The growth of NiP on the Cu films with and without the Pd catalyst was observed.

The number of Pd nanoparticles increased with Pd activation time; the nucleation of Pd dominated over growth at 60 s. Lattice images show that the d-spacing of Ni nanoparticles doped with less than 10 at% P increased to 2.050 Å. Nucleation of NiP deposits occurred simultaneously in the specimens with and without the Pd catalyst, because electrons could be transferred via the conductive Cu. Therefore, the reaction mechanism of the electroless NiP deposited on Cu film appears to be electrochemical. The activation energies for NiP deposits (15 s Pd with catalytic Pd, 15 s Pd without catalytic Pd, 60 s Pd with catalytic Pd and 60 s Pd without catalytic Pd) on the Cu film are 65.8, 64.0, 64.3 and 58.1 kJ/mol, respectively. This demonstrates that, regardless of the volume and the presence of catalytic Pd, the activation energy of electroless NiP has a consistent value.

It is necessary to study the relationship between the volume of Pd nanoparticles and the nucleation rate of NiP at an initial stage, as there are limited data regarding the effect of Pd volume on the nucleation rate of NiP.

The reaction mechanism of the electroless NiP deposited on conductive but non-catalytic Cu film involves electrochemical reactions because the nucleation of NiP deposits occurs on conductive Cu film regardless of the presence of the Pd catalyst.

This paper aims to mainly report the impact of torch angle on the dynamic behavior of the weld pool which is recorded and monitored in real time with the aid of a high-speed camera system. The influence of depositing torch angle on the fluctuation behavior of weld pool and the quality of weld formation are compared and analyzed.

The FANUC controlled robotic manufacturing system comprised a Fronius cold metal transfer (CMT) Advanced 4000R power source, FANUC robot, water cooling system, wire feeding system and a gas shielding system. An infrared laser was used to illuminate the weld pool for high-speed imaging at 1,000 frames per second with CR600X2 high-speed camera. The high-speed camera was set up a 35 ° angle with the deposition direction to investigate the weld pool flow patterns derived from high-speed video and the effect of torch angles on the first layer of wire additive manufacture-CMT.

The experimental results demonstrated that different torch angles significantly influence on the deposited morphology, porosity formation rate and weld pool flow.

With regard to the first layer of wire arc additive manufacture of aluminum alloys, the change of torch angle is critical. It is clear that different torch angles significantly influence on the weld morphology, porosity formation and weld pool flow. Furthermore, under different torch angles, the deposited beads will produce different defects. To get well deposited beads, 0-10° torch could be made away from the vertical position of the deposition direction, in which the formation of deposited beads were well and less porosity and other defects.

Three types of pattern on the monocrystalline silicon surface were prepared by using laser surface processing equipment. The DLC film and Si-DLC film on the patterning surface were deposited by using PECVD-2D plasma chemical vapor deposition sets. The paper aims to discuss these issues.

The tribological properties of the films were investigated by using the UMT-2 micro friction and wear tester. The surface topography, composition, hardness and elastic modular of the films were determined by Raman spectrum, nano mechanics tester and three-dimensional topography instrument. The worn surface topographies of the surface patterning films were tested by scanning electron microscopy.

The results show that the patterning monocrystalline silicon substrate surface has good anti-friction property under low load. The patterning DLC film and Si-DLC film surface have very good anti-friction property under all the test loads. The reason of these results is that the surface patterning film not only reduces the real contact area of the friction pairs but also has low surface bonding force.

This paper prepared three kinds of microscopic patterns on the monocrystalline silicon surface by using laser surface processing equipment. And then deposited DLC film and Si-DLC film on the patterning surface. All kinds of surface patterning monocrystalline silicon had very good anti-friction property under low load. And all kinds of surface patterning nano-hard film had perfect anti-friction property under all test loads.

This study examines solvent extract conductivity (SEC) testing, e.g., Ionograph or Omega Meter testing, which measures ionic cleanliness of printed wiring boards (PWBs). SEC has been a quality control (QC) monitor to assure product electrical reliability. Typical SEC measurements occur after wave soldered products have been solvent‐cleaned. This study concerns SEC testing on new wave soldering processes that involve no solvent cleaning, i.e., inert gas soldering with ‘no clean’ fluxes. Results show ionic residues from ‘no clean’ fluxes may have other characteristics that make QC testing for ionic cleanliness inappropriate. However, SEC may be appropriate as a process control monitor after soldering with these fluxes. An Ionograph measured SEC response for the following chemicals: NaCl, NaF, NaBr, KCl, MgCl2, CaCl2, HCl, succinic acid, malic acid, glutaric acid, adipic acid and ethylene glycol. The list includes inorganic salts, strong electrolytes, which may arise from manufacturing or PWB materials. The list also includes weak organic acids (WOAs) common to ‘no clean’ fluxes. One non‐ionic hygroscopic chemical, ethylene glycol, was studied. Ionograph response was measured via (i) direct injection of aqueous solutions and (ii) immersion of PWBs with individual chemicals as surface deposits. All ionisable compounds, including all WOAs, produced substantial SEC response. Surface conductivity was measured at 35°C/90% relative humidity (RH) with controlled amounts of the above chemicals deposited on clean PWB test circuits. Surface loadings corresponded to the molar‐ionic equivalent of 2.0 ?g/cm2 NaCl. In addition, NaCl, adipic acid and polyethylene glycol (PEG 400) were examined as a function of concentration. Several ionisable chemicals including all WOAs produced no measurable effect, i.e., surface conductivities were indistinguishable on clean and deposited specimens. Surface conductivity increased for ionic contaminants with critical RH below ∼80% and for the non‐ionic hygroscopic glycol. SEC measurements and surface conductivities were compared. The latter is more directly related to electrical reliability. Although all ionic compounds including the WOAs showed a SEC response, not all enhanced surface conductivity. Achievement of critical RH appears to be the important factor. Adipic acid required the presence of hygroscopic glycol to enhance surface conductivity. Therefore, SEC can be a misleading QC test for electrical reliability when WOA flux residues are present.

This paper aims to summarize the influence law of hybrid deposited and micro-rolling (HDMR) technology on the bead morphology and overlapping coefficient. A better bead topology positively supports the overlapping deposited in multi-beads between layers while actively assisting the subsequent layer's deposition in the wire and arc additive manufacturing (WAAM). Hybrid-deposited and micro-rolling (HDMR) additive manufacturing (AM) technology can smooth the weld bead for improved surface quality. However, the micro-rolling process will change the weld bead profile fitting curve to affect the overlapping coefficient.

Weld bead contours for WAAM and HDMR were extracted using line lasers. A comparison of bead profile curves was conducted to determine the influence law of micro-zone rolling on the welding bead contour and fitting curve. Aiming at the optimized overlapping coefficient of weld bead in HDMR AM, the optimal HDMR overlapping coefficient curve was proposed which varies with the reduction based on the best surface flatness. The mathematical model for overlapping in HDMR was checked by comparing the HDMR weld bead contours under different rolling reductions.

A fitting function of the bead forming by HDMR AM was proposed based on the law of conservation of mass. The change rule of the HDMR weld bead overlapping spacing with the degree of weld bead rolling reduction was generated using the flat-top transition calculation for this model. Considering the damming-up impact of the first bead, the overlapping coefficient was examined for its effect on layer surface flatness.

Using the predicted overlapping model, the optimal overlapping coefficients for different rolling reductions can be achieved without experiments. These conclusions can encourage the development of HDMR technology.

This study aims to investigate the effect of electrodeposition parameters (i.e. time and voltage) on the properties of hydroxyapatite (HA) coating fabricated on Ti6Al4V surface.

A full factorial design along with response surface methodology was utilized to evaluate the main effect of independent variables and their relative interactions on response variables. The effect of electrodeposition voltage and deposition time on HA coatings Ca/P molar ratio and the size of deposited HA crystals were examined by structural equation modeling (SEM). The formation of plate-like and needle-like HA crystals was observed for all experiments.

The results obtained showed that the higher electrodeposition voltage leads to lower Ca/P values for HA coatings. This is more significant at lower deposition times, where at a 20-minute deposition time, the voltage increased from 2 to 3 V and the Ca/P decreased from 2.27 to 1.52. Full factorial design results showed that electrodeposition voltage has a more significant effect on the size of the deposited HA crystal. With increasing the voltage from 2 to 3 V at a deposition time of 20 min, the HA crystal size varied from 99 to 36 µm.

The investigation delved into the impact of two critical parameters, deposition time and voltage, within the electrodeposition process on two paramount properties of HA coatings. Analyzing the alterations in coating characteristics relative to variations in these process parameters can serve as a foundational guide for subsequent research in the domain of calcium-phosphate deposition for implants.

The deposition of particles onto a substrate during the cold spraying (CS) process relies on severe plastic deformation, so there are various micro-defects induced by insufficient deformation and severe crushing. To solve the problems, many post-treat techniques have been used to improving the quality by eliminating the micro-defects. This paper aims to help scholars and engineers in this field a better and systematic understand of CS technology by summarizing the post-treatment technologies that have been investigated recently years.

This review summarizes the types of micro-defects and introduces the effect of micro-defects on the properties of CS coating/additive manufactured, illustrates the post-treatment technologies and its effect on the microstructure and performances, and finally outlooks the future development trends of post-treatments for CS.

There are significant discoveries in post-treatment technology to change the performance of cold spray deposits. There are also many limitations for post-treatment methods, including improved performance and limitations of use. Thus, there is still a strong requirement for further improvement. Hybrid post-treatment may be a more ideal method, as it can eliminate more defects than a single method. The proposed ultrasonic impact treatment could be an alternative method, as it can densify and flatten the CS deposits.

It is the first time to reveal the influence factors on the performances of CS deposits from the perspective of microdefects, and proposed corresponding well targeted post-treatment methods, which is more instructive for improving the performances of CS deposits.

The paper aims to examine the enrichment of Cu, and the type of attack occurring during the dissolution of Al‐3.84%Cu alloy in 0.5 M NaCl.

The approach is to use scanning electron microscopy (SEM) and energy dispersive X‐ray spectroscopy (EDX) and solution analyses using atomic absorption spectrophotometry.

Examination of the surface after five days of immersion showed that Cu clusters had concentrated around the edges of the specimens and two types of localized corrosion were evident, pitting corrosion and the intergranular attack, which were concentrated mainly around the Cu clusters and in the regions where a higher concentration of Cu was evident. After 80 days of immersion, the higher concentration of Cu was distributed over nearly the entire surface and its concentration differed from one site to another.

The analysis results of the study confirmed the mechanism of simultaneous dissolution.

Laser additive manufacturing (LAM) technology based on powder bed has been used to manufacture complex geometrical components. In this study, IN625 superalloys were fabricated by high-power fiber laser without cracks, bounding errors or porosity. Meanwhile, the objectives of this paper are to systemically investigate the microstructures, micro-hardness and the precipitated Laves phase of deposited-IN625 under different annealing temperatures.

The effects of annealing temperatures on the microstructure, micro-hardness and the precipitated Laves phase were studied by optical microscope (OM), scanning electron microscopy (SEM), X-ray diffraction (XRD), energy dispersive spectrometer (EDS), selected area electron diffraction (SAED), backscattered electron (BSE) imaging in the SEM and transmission electron microscopy (TEM), respectively. The thermal stability of the dendritic morphology about IN625 superalloys was investigated through annealing at temperatures range from 1,000°C to 1,200°C.

It is found that the microstructure of deposited-IN625 was typical dendrite structure. Besides, some Laves phase precipitated in the interdendritic region results in the segregation of niobium and molybdenum. The thermal stability indicate that the morphology of dendrite can be stable up to 1,000°C. With the annealing temperatures increasing from 1,000 to 1,200°C, the Laves phase partially dissolves into the γ-Ni matrix, and the morphology of the remaining Laves phase is changing from irregular shape to rod-like or block-like shape.

The heat treatment used on the IN625 superalloys is helpful for knowing the evolution of microstructures and precipitated phases thermal stability and mechanical properties.

Due to the different kinds of application conditions, the original microstructure of the IN625 superalloys fabricated by LAM may not be ideal. So exploring the influence of annealing treatment on IN625 superalloys can bring theory basis and guidance for actual production.

This study continues valuing the fabrication of IN625 by LAM. It shows the effect of annealing temperatures on the shape, size and distribution of Laves phase and the microstructures of deposited-IN625 superalloys.

This paper aims to coat ternary composite NiBP-graphite films by Dynamic Chemical Plating “DCP” technique with a growth rate of at least 5 μm/h, which makes this technique a worthy candidate for production of composite films. Electroless nickel plating method can be used to deposit nickel–phosphorous and nickel–boron coatings on metals or plastic surface. However, restrictions such as toxicity, short lifetime of the plating-bath and limited plating rate have limited applications of conventional electroless processes.

DCP is an alternative for producing metallic deposits on non-conductive materials and can be considered as a modified electroless coating process. Using a double-nozzle gun, two different solutions containing the precursors are sprayed simultaneously and separately onto the surface. With this technique, NiBP-graphite films are fabricated and their corrosion and tribological properties are investigated.

With a film thickness of 2 μm, tribological analysis confirms that these coatings have favorable anti-friction and anti-wear properties. Corrosion resistance of NiBP-graphite composite films was investigated, and it was found that graphite incorporation significantly enhances corrosion resistance of NiBP films.

DCP is faster and simpler to perform compared to other electroless deposition techniques. Using a double-nozzle gun, metal salt solution and reducing agents are sprayed to the surface, forming a deposit. Previously, coatings such as Cu, Cu-graphite, Cu-PTFE, Ni-B-TiO2, Ni-P, Ni-B-P and Ni-B-Zn with favorable compactness and adherence by DCP were reported. In this paper, the authors report the application of the DCP technique for depositing NiBP-PTFE nanocomposite films.