Search results

1 – 10 of 16
Article
Publication date: 7 August 2017

Darko Belavič, Andraž Bradeško, Tomaz Kos and Tadej Rojac

In this contribution, the design and integration of a piezoelectric vibrating device into low-temperature, co-fired ceramic (LTCC) structures are presented and discussed. The…

Abstract

Purpose

In this contribution, the design and integration of a piezoelectric vibrating device into low-temperature, co-fired ceramic (LTCC) structures are presented and discussed. The mechanical vibration of the diaphragm was stimulated with a piezoelectric actuator, which was integrated onto the diaphragm. Three different methods for the integration were designed, fabricated and evaluated.

Design/methodology/approach

The vibrating devices were designed as an edge-clamped diaphragm with an integrated piezoelectric actuator at its centre, whose role is to stimulate the vibration of the diaphragm via the converse piezoelectric effect. The design and feasibility study of the vibrating devices was supported by analytical methods and finite-element analyses.

Findings

The benchmarking of the ceramic vibrating devices showed that the thick-film piezoelectric actuator responds weakly in comparison with both the bulk actuators. On the other hand, the thick-film actuator has the lowest dissipation factor and it generates the largest displacement of the diaphragm with the lowest driving voltage. The resonance frequency of the vibrating device with the thick-film actuator is the most sensitive for an applied load (i.e. mass or pressure).

Research limitations/implications

Research activity includes the design and the fabrication of a piezoelectric vibrating device in the LTCC structure. The research work on the piezoelectric properties of integrated piezoelectric actuators was limited.

Practical implications

Piezoelectric vibrating devices were used as pressure sensors.

Originality/value

Piezoelectric vibrating devices could be used not only for pressure sensors but also for other type of sensors and detectors and for microbalances.

Details

Microelectronics International, vol. 34 no. 3
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 2 July 2018

Darko Belavic, Andraž Bradeško and Hana Uršič

The purpose of this study is to design, fabricate and investigate low-temperature co-fired ceramic (LTCC) structures with integrated microfluidic elements. Special attention is…

Abstract

Purpose

The purpose of this study is to design, fabricate and investigate low-temperature co-fired ceramic (LTCC) structures with integrated microfluidic elements. Special attention is paid to the study of fluid properties of micro-channels and microvalves, which are important constitutive parts of both, microfluidic systems and individual microfluidic devices.

Design/methodology/approach

Several test patterns of fluid channels with different geometry and different types of valves were designed and realized in LTCC technology. All test structures were tested under the flow of two fluids (liquids): water and isopropyl alcohol. Flow rates at different applied pressure were measured and hydrodynamic resistance and diode effect were calculated.

Findings

The investigation of the channels showed that viscosity of fluidic media has significant influence on the hydrodynamic resistance in channels with rectangular cross-section, while this effect is small on channels with square cross-section. The viscosity also has a decisive influence on the diode effect of different shape of valves, and therefore, it is important in the selection of the valve in practical applications.

Research limitations/implications

In this work, the investigation of hydrodynamic resistance of channels and diode effect of passive valves is limited on selected geometry and only on two fluidic media and two applied pressures. All these and some other parameters have a significant influence on fluidic properties, but this will be the topic of the next research work, which will be supported by numerical modelling.

Practical implications

The presented results are useful in the future designing process of LTCC-based microfluidic devices and systems.

Originality/value

Microfluidic in the LTCC structures is an unconventional use of this technology. Therefore, the fluid properties are relatively unsearched. On the other hand, the global use of microfluidic devices and systems is growing rapidly in various applications. They are mostly made by polymer materials, however, in more demanding applications; ceramic is a useful alternative.

Details

Microelectronics International, vol. 35 no. 3
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 12 January 2021

Kostja Makarovič, Darko Belavič, Barbara Malič, Andreja Benčan, Franci Kovač and Janez Holc

The purpose of this study is the design, fabrication and evaluation of a miniature ozone generator using the principle of electric discharge are presented.

Abstract

Purpose

The purpose of this study is the design, fabrication and evaluation of a miniature ozone generator using the principle of electric discharge are presented.

Design/methodology/approach

The device was fabricated using a low-temperature co-fired ceramics (LTCC) technology, by which a multilayered ceramic structure with integrated electrodes, buried channels and cavities in micro and millimeter scales was realized.

Findings

The developed ozone generator with the dimensions of 63.6 × 41.8 × 1.3 mm produces approximately 1 vol. % of ozone in oxygen flow of 15 ml/min, at an applied voltage of 7 kV.

Originality/value

A miniature ozone generator, manufactured in LTCC technology, produces high amount of ozone and more than it is described in the available references or in datasheets of commercial devices of similar size.

Details

Microelectronics International, vol. 38 no. 1
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 1 December 2002

Marko Pavlin, Darko Belavic, Marina Santo Zarnik, Marko Hrovat and Matej Mozek

Pressure‐sensor miniaturization requires high‐density packaging. This means that designers are constantly faced with all kinds of challenging, and sometimes impossible…

Abstract

Pressure‐sensor miniaturization requires high‐density packaging. This means that designers are constantly faced with all kinds of challenging, and sometimes impossible, requirements. In this paper we will present three examples with specific technologies and aspects of miniaturization and packaging. The first example is a pressure switch, the second a pressure sensor and the third a smart pressure sensor.

Details

Microelectronics International, vol. 19 no. 3
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 3 August 2015

Darko Belavič, Marko Hrovat, Kostja Makarovič, Gregor Dolanč, Andrej Pohar, Stanko Hočevar and Barbara Malič

– The purpose of this paper is to present the research activity and results to research and development society on the field of ceramic microsystems.

Abstract

Purpose

The purpose of this paper is to present the research activity and results to research and development society on the field of ceramic microsystems.

Design/methodology/approach

The chemical reactor was developed as a non-conventional application of low temperature co-fired ceramic (LTCC) and thick-film technologies. In the ceramic reactor with a large-volume, buried cavity, filled with a catalyst, the reaction between water and methanol produces hydrogen and carbon dioxide (together with traces of carbon monoxide). The LTCC ceramic three-dimensional (3D) structure consists of a reaction chamber, two inlet channels, an inlet mixing channel, an inlet distributor, an outlet collector and an outlet channel. The inlet and outlet fluidic barriers for the catalyst of the reaction chamber are made with two “grid lines”.

Findings

A 3D ceramic structure made by LTCC technology was successfully designed and developed for chemical reactor – methanol decomposition.

Research limitations/implications

Research activity includes the design and the capability of materials and technology (LTCC) to fabricate chemical reactor with large cavity. But further dimensions-scale-up is limited.

Practical implications

The technology for the fabrication of LTCC-based chemical reactor was developed and implemented in system for methanol decomposition.

Originality/value

The approach (large-volume cavity in ceramic structure), which has been developed, can be used for other type of reactors also.

Details

Microelectronics International, vol. 32 no. 3
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 18 April 2008

Marina Santo Zarnik, Darko Belavic and Srecko Macek

The successful use of piezoceramic thick films in sensors and actuators requires a thorough understanding of their electrical and electromechanical characteristics. Since these…

Abstract

Purpose

The successful use of piezoceramic thick films in sensors and actuators requires a thorough understanding of their electrical and electromechanical characteristics. Since these characteristics depend not only on the material's composition but also on its compatibility with various substrates and a number of processing parameters, accurate measurements of the material's parameters are essential. Here, the aim of this paper is to present a procedure for characterising lead‐zirconate‐titanate (PZT) thick films on pre‐fired low‐temperature co‐fired ceramic (LTCC) substrates performed in order to determine the material parameters for numerical modelling.

Design/methodology/approach

Owing to the lack of standard procedures for measuring the elastic and piezoelectric properties of the films, the compliance parameters were evaluated from the results of nano‐indentation tests, and a substrate‐flexure method was used to evaluate the transverse piezoelectric coefficients.

Findings

The validation of the material model and the finite‐element (FE) analysis of the demonstrator sensor/actuator structures are shown to be in agreement with the FE model, even if not an exact fit.

Originality/value

This paper focuses on a characterisation of PZT thick films screen‐printed on pre‐fired LTCC substrates.

Details

Microelectronics International, vol. 25 no. 2
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 2 August 2011

Marina Santo Zarnik, Darko Belavič and Srečko Maček

The purpose of this paper is to consider a capacitive pressure sensor fabricated using low‐temperature cofired ceramic (LTCC) materials and technology as a candidate for an…

Abstract

Purpose

The purpose of this paper is to consider a capacitive pressure sensor fabricated using low‐temperature cofired ceramic (LTCC) materials and technology as a candidate for an energy‐autonomous sensor application. Designing the 3D capacitive sensor structure, with the cofired thick‐film electrodes inside the narrow air gap in the LTCC substrate, was a challenging task, particularly due to the presence of the parasitic elements influencing the sensor's characteristics.

Design/methodology/approach

In this work, different design variants for the thick‐film electrodes of the capacitive sensing structure were studied and compared. The test sensors were designed for the pressure range 0‐10 kPa and manufactured with readout electronics based on a capacitance‐to‐digital conversion.

Findings

The typical sensitivity obtained was 4 fF/kPa, and the temperature coefficient of the sensitivity was 0.03%/°C. The design variant with the guard‐ring electrode showed the best rms resolution of 50 Pa. One drawback of the application could be the sensitivity to atmospheric humidity and the influence of the different media.

Originality/value

This paper focuses on the design of a capacitive gas‐pressure sensor in a 3D LTCC structure. The present study provides a good basis for further optimisation of the design of the cofired electrodes in the capacitive sensing structure.

Details

Microelectronics International, vol. 28 no. 3
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 1 August 2003

Darko Belavic, Marko Hrovat, Marina Santo Zarnik, Andreja Bencan, Walter Smetana, Roland Reicher and Heinz Homolka

Strain gauges can be realised by printing and firing thick‐film resistors on ceramic substrates that are usually based on alumina. However, sensing elements made on some other…

Abstract

Strain gauges can be realised by printing and firing thick‐film resistors on ceramic substrates that are usually based on alumina. However, sensing elements made on some other substrates – tetragonal zirconia or stainless steel – would exhibit some improved characteristics, either due to a lower modulus of elasticity or a higher mechanical strength. As thick‐film resistors are developed for firing on alumina substrates their compatibility and possible interactions with other kinds of substrates have to be evaluated. The sheet resistivities and noise indices of the resistors were comparable, whereas the gauge factors were lower for the dielectric‐on‐steel substrates. The temperature coefficients of resistivity (TCR) of the resistors on the ZrO2 and dielectric‐on‐steel substrates were higher than the TCRs on the alumina substrates, which was attributed to the higher thermal expansion coefficient of the tetragonal zirconia and the stainless steel.

Details

Microelectronics International, vol. 20 no. 2
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 26 April 2013

Kostja Makarovič, Anton Meden, Marko Hrovat, Darko Belavič, Janez Holc and Marija Kosec

In this manuscript the purpose is to present and evaluate the developed non‐destructive method for analysing the phase composition of LTCC Du Pont “Green Tape 951” material fired…

207

Abstract

Purpose

In this manuscript the purpose is to present and evaluate the developed non‐destructive method for analysing the phase composition of LTCC Du Pont “Green Tape 951” material fired in the temperature range from 800 to 1,000°C using X‐ray powder diffraction and Rietveld refinement.

Design/methodology/approach

The method uses the crystalline Al2O3 which is already present in the material as an internal standard since its mass fraction was previously found to be constant in the described temperature range.

Findings

The results of the non‐destructive analyses and the classical destructive analyses are comparable and the estimated error of the destructive phase analyses and the calculated errors for the non‐destructive phase analyses are of the same order.

Practical implications

The described method can be used also for analysing another type of LTCC material. In this case it is necessary to check whether the mass fraction of any crystalline phase present in the sample is constant in the given temperature range, because only in this case can it be used as an internal standard for a determination of the phase composition.

Originality/value

The non‐destructive method is a fast and easy approach for analysing the fired samples and is also suitable for controlling the phase composition of LTCC materials on 3D complex structures without destroying them, just by using the X‐ray diffraction patterns collected from their surface.

Details

Microelectronics International, vol. 30 no. 2
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 1 December 2004

Janusz Sitek, Dubravka Ročak, Krystyna Bukat, Janeta Fajfar‐Plut and Darko Belavič

The European Commission has decided that from the second half of 2006 only lead‐free solder pastes will be permitted for use in the electronics industry. Earlier results of…

Abstract

The European Commission has decided that from the second half of 2006 only lead‐free solder pastes will be permitted for use in the electronics industry. Earlier results of testing showed that lead‐free solder pastes may not be appropriate for both printed‐circuit‐board (PCB) and hybrid‐circuit applications, because of the materials' compatibility with the soldering process and with the solder pads. The basic properties of the investigated pastes show which of the tested solder pastes can be used for both applications. After selection of the appropriate solder pastes, reliability tests were conducted. The surface insulation resistance was tested for both the hybrid circuits and PCBs, whereas the mechanical strength of the soldered joints of components was only tested for the PCBs.

Details

Soldering & Surface Mount Technology, vol. 16 no. 3
Type: Research Article
ISSN: 0954-0911

Keywords

1 – 10 of 16