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Recently great interest has developed for a high speed, flexible machine vision system which can accurately determine solder paste and component placement for both process verification and quality control inspection. Present SMT inspection systems must cope with the unpredictable appearance of components and backgrounds and are often used only to determine presence and absence. This paper describes a new approach which combines greyscale data with a three‐dimensional map of the board under test. Originally this method was proposed as a robust technique for locating components in low contrast greyscale images. However, experience working with manufacturers and developers of placement equipment has shown that emerging SMT inspection requirements indicate the importance of three‐dimensional information. In addition to the detection of components and measurement of orientation, examples are shown of solder paste volume measurements, lead co‐planarity, and tombstone effect detection.

STRIPE — Scanning Triangulation Range Imaging Package for Engineering is examined by the National Engineering Laboratory.

The Benelux chapter has made a habit of organising meetings with a scientific and commercial accent more or less alternately. This approach has proven to be successful in the past three years. The 1986 Autumn meeting will be another display meeting. A number of papers will be presented by suppliers of materials and equipment for the hybrid and surface mounting industry. In a 300 m2 exhibition room about 25 companies will display their products. The programme of the day leaves ample opportunity for meeting colleagues and suppliers. The meeting will be held in the ‘Jaarbeurs Vergadercentrum’ in Utrecht on 16 October from 9.30–17.00. The annual ISHM‐Benelux general membership meeting will precede the lectures.

Electronics manufacturing throughout the world now uses an increasing percentage of Surface Mount Technology (SMT). The compact and light‐weight surface‐mounted components offer a number of advantages to manufacturers. Unfortunately, however, these same beneficial characteristics make the quality of the product difficult to guarantee. As miniaturisation continues, the inspection problem becomes worse, and so advanced methods of inspection are required. Automatic inspection systems already exist, although an effective, inexpensive and reliable system has yet to be found. Recent work carried out within the Coherent and Electro‐Optics Research Group at Liverpool Polytechnic has looked at the feasibility of applying some of its established inspection methods to the problem of solder joint inspection. Extensive development must still take place; however, the methods employed have shown promise. The system uses structured light techniques to add height information to an image of the solder joint under inspection. In this way a 3‐D image of the joint may be built up, digitised and processed in a computer at high speed in order to determine its quality.