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For many years C‐MAC has used thick film technology in many electronic products for a large range of customer applications. A high degree of integration has been achievable, together with high reliability. Recently, however, new materials have been developed allowing for a further miniaturization. This paper reports on the development of a multilayer technology, based on the combination of state‐of‐the‐art Fodel^® materials with Diffusion Patterning™ dielectric and and standard thick film materials. The combination of such materials allows for the manufacture of high density products, addressing the present and future needs of many new applications. Besides the process technology for manufacturing the substrate, different assembly technologies like dip and reflow soldering and chip and wire bonding have been successfully investigated. In comparison to LTCC, this technology offers the possibility of using only a few layers, therefore allowing for faster product development, more flexibility during manufacturing and optimisation of cost.

Potato (Solanum tuberosum L. cv. Kara) was grown in Open‐Top Chambers (OTCs) in Northern Egypt at ambient (ca 350 ppm) or doubled CO₂ (ca 690 ppm) either in charcoal‐filtered air (15 nl l‐1) or in non‐filtered ambient air (78 nll‐1 O₃) to investigate the changes in physiology and yield under long‐term elevated CO₂ and/or O₃ throughout 100 days. Ambient O₃ level reduced net photosynthetic rates, number and weight of tubers by 18 per cent, 41 per cent and 21 per cent, respectively, whereas elevated CO₂ caused the opposite effect where it increased the same parameters by 44 per cent, 37 per cent and 20 per cent, respectively. Significant O₃ x CO₂ interactions were detected. However, O₃ caused an increase in GR and POD by 18 per cent and 35 per cent, respectively, while CO₂ caused an increase in POD only by 46 per cent, and there was no effect of O₃ and/or CO₂ on other enzymes. The results of this study are discussed in relation to predicted atmospheric changes.