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The purpose of this paper is to design a novel die-attach composite joint for high-temperature die-attach applications based on transient liquid phase bonding. Moreover, the microstructure, shear strength, electrical property, thermal conductivity and aging property of the composite joint were investigated.

The composite joint was made of microporous copper and Cu₃Sn. Microporous copper was immersed into liquid Sn to achieve Sn-microporous copper composite structure for die attachment. By the thermo-compression bonding, the Cu₃Sn-microporous copper composite joint with a thickness of 100 µm was successfully obtained after bonding at 350 °C for 5 min under a low pressure of 0.6 MPa.

After thermo-compression bonding, the resulting interconnection could withstand a high temperature of at most 676 °C, with the entire Sn transforming into Cu₃Sn with high remelting temperatures. A large shear strength could be achieved with the Cu₃Sn-microporous copper in the interconnections. The formed bondlines demonstrated a good electrical and thermal conductivity owing to the large existing amount of copper in the interconnections. Furthermore, the interconnection also exhibited excellent reliability under high temperature aging at 300 °C.

This die-attach composite joint was suitable for power devices operating under high temperatures or other harsh environments.

The purpose of this paper is to quickly manufacture full Cu₃Sn-microporous copper composite joints for high-temperature power electronics applications and study the microstructure evolution and the shear strength of Cu₃Sn at different bonding times.

In this paper, a novel structure of Cu/composite solder sheet/Cu was designed. The composite solder sheet was made of microporous copper filled with Sn. The composite joint was bonded by thermo-compression bonding under pressure of 0.6 MPa at 300°C. The microstructure evolution and the growth behavior of Cu₃Sn at different bonding times were observed by electron microscope and metallographic microscope. The shear strength of the joint was measured by shear machine.

At initial bonding stage the copper atoms in the substrate and the copper atoms in the microporous copper dissolved into the liquid Sn. Then the scallop-liked Cu₆Sn₅ phases formed at the interface of liquid Sn/microporous copper and liquid Sn/Cu substrates. During the liquid Sn changing to Cu₆Sn₅ phases, Cu₃Sn phases formed and grew at the interface of Cu₆Sn₅/Cu substrates and Cu₆Sn₅/microporous copper. After that the Cu₃Sn phases continued to grow and the Cu₃Sn-microporous copper composite joint with a thickness of 100 µm was successfully obtained. The growth rule of Cu₃Sn was parabolic growth. The shear strength of the composite joints was about 155 MPa.

This paper presents a novel full Cu₃Sn-microporous copper composite joint with high shear strength for high-temperature applications based on transient liquid phase bonding. The microstructure evolution and the growth behavior of Cu₃Sn in the composite joints were studied. The shear strength and the fracture mechanism of the composite joints were studied.

A series of composite solders in 63/37 Sn/Pb was prepared: Cu₆ Sn₅ (10, 20, 30 wt%); Cu₃ Sn (10, 20, 30 wt%); Cu (7.6 wt%); Ag (4 wt%); and Ni (4 wt%). These composite solders were prepared by two procedures: (A) admixture with solder paste; and (B) admixture with molten solder. The original particulates and the final composite solders were analysed and characterised by SEM (scanning electron microscopy) EDX (energy dispersive X‐ray), and ESCA (electron spectroscopy for chemicals analysis); or XPS (X‐ray photoelectron spectroscopy). A variety of morphological characterisations, intermetallics and porosities were noted. Good wetting was noted in all cases, and porosity was greater for method (A). The particulates all exhibited excellent binding to the solder matrix.

Composite solders were prepared by mechanically dispersing 15v% of Cu or Ag particles into the eutectic Sn‐3.5Ag solder. The average sizes for the nominally spherical Cu and Ag particles were 6 and 4 microns, respectively. Two different processing methods were used to prepare the composite solders: blending the powdered particles with solder paste, and adding particles to the molten solder at 2808C. The composite solders were characterised by studying the morphology, size and distribution of the reinforcing phase. Particular interest and emphasis are given towards the modifications of the reinforcements during the reflow process. Microstructural features and chemical analysis of the composite solders were studied using optical and scanning electron microscopy (SEM), and energy dispersive x‐ray (EDX) analysis. The effect of reflow and isothermal ageing on the microstructure as well as the morphological changes in the interfacial IM layer of the composite solders were extensively analysed. A mechanism for IM layer growth is proposed for solid state isothermal ageing.

Copper matrix composites are widely used in high-voltage switches, electrified railways and other electric friction fields. The purpose of this study is to improve its wear resistance and investigate the effect of hybrid carbon nanotubes (CNTs) and titanium diboride (TiB₂) particles reinforced copper matrix composites on electrical wear performance.

CNTs and TiB₂ particles were introduced into copper matrix simultaneously by powder metallurgy combined with electroless copper plating. Electrical wear performance of the composites was studied on self-made pin on disk electrical wear tester.

The results show that the friction coefficient and wear rate of (1CNTs–4TiB₂)/Cu composite are respectively reduced by 40% and 25.3%, compared with single TiB₂/Cu composites. The micron-sized TiB₂ particles can hinder the plastic deformation of composites, and bear part of the load to weaken the wear rate of composites. CNTs with the self-lubricating property can form lubricating layer to reduce the friction coefficient of composites.

This work can provide a design method for further improving the wear properties of TiB₂/Cu composites.

The purpose of this study is to investigate the effect of the sintering temperature on the microstructural, mechanical and physical properties of Cu-SiC composites.

The powder metallurgy route was used to fabricate the samples. Cold compaction of powders was conducted at 250 MPa which was followed by sintering at 850°C–950°C at the interval of 50 °C in the open atmospheric furnace. SiC was used as a reinforcement and the volumetric fraction of the SiC was varied as 10%, 15% and 20%. The processed samples were metallurgically characterized by the scanning electron microscope (SEM). Mechanical characterization was done using tensile and Vickers’ micro-hardness testing to check the hardness and strength of the samples. Archimedes principle and Four-point collinear probe method were used to measure the density and electrical resistivity of the samples.

SEM micrograph reveals the uniform dispersion of the SiC particles in the Cu matrix element. The results revealed that the Hardness and tensile strength were improved due to the addition of SiC and were maximum for the samples sintered at 950 °C. The addition of SiC has also increased the electrical resistivity of the Cu-SiC composite and was lowest for Cu 100% while the relative density has shown the reverse trend. Further, it was found that the maximum hardness of 91.67 Hv and ultimate tensile strength of 312.93 MPa were found for Cu-20% SiC composite and the lowest electrical resistivity of 2.017 µ- Ω-cm was found for pure Cu sample sintered at 950 °C, and this temperature was concluded as the optimum sintering temperature.

The powder metallurgy route for the fabrication of the composites is a challenging task as the trapping of oxygen cannot be controlled during the compaction process as well as during the sintering process. So, a more intensive study is required to overcome these kinds of limitations.

As of the author’s best knowledge, no work has been reported on the effect of sintering temperature on the properties of the Cu-SiC composites which has huge potential in the industries.

This study aims to investigate the behavior of the green biomass-derived copper (lignin/silica/fatty acids) complex, copper lignin/silica/fatty acids (Cu-LSF) complex, when incorporated into the nonpolar ethylene propylene diene (EPDFM) rubber matrix, focusing on its reinforcing and antioxidant effect on the resulting EPDM composites.

The structure of the prepared EPDM composites was confirmed by Fourier-transform infrared spectroscopy, and the dispersion of the additive fillers and antioxidants in the EPDM matrix was investigated using scanning electron microscopy. Also, the rheometric characteristics, mechanical properties, swelling behavior and thermal gravimetric analysis of all the prepared EPDM composites were explored as well.

Results revealed that the Cu-LSF complex dispersed well in the nonpolar EPDM rubber matrix, in thepresence of coupling system, with enhanced Cu-LSF-rubber interactions and increased cross-linking density, which reflected on the improved rheological and mechanical properties of the resulting EPDM composites. From the various investigations performed in the current study, the authors can suggest 7–11 phr is the optimal effective concentration of Cu-LSF complex loading. Interestingly, EPDM composites containing Cu-LSF complex showed better antiaging performance, thermal stability and fluid resistance, when compared with those containing the commercial antioxidants (2,2,4-trimethyl-1,2-dihydroquinoline and N-isopropyl-N’-phenyl-p-phenylenediamine). These findings are in good agreement with our previous study on polar nitrile butadiene rubber.

The current study suggests the green biomass-derived Cu-LSF complex to be a promising low-cost and environmentally safe alternative filler and antioxidant to the hazardous commercial ones.

The purpose of this paper is to develop a new composite solder to improve the reliability of composite solder joints. Nano-particles modified multi-walled carbon nanotubes (Ni-MWCNTs) can indeed improve the microstructure of composite solder joints and improve the reliability of solder joints. Although many people have conducted in-depth research on the composite solder of Ni-MWCNTs. However, no one has studied the performance of Ni-MWCNTs composite solder under different aging conditions. In this article, Ni-MWCNTs was added to Sn-Ag-Cu (SAC) solder, and the physical properties of composite solder, the microstructure and mechanical properties were evaluated.

In this study, the effect of different aging conditions on the intermetallic compound (IMC) layer growth and shear strength of Ni-modified MWCNTs reinforced SAC composite solder was studied. Compared with SAC307 solder alloy, the influence of Ni-MWCNTs with different contents (0, 0.1 and 0.2 Wt.%) on composite solder was examined. To study the aging characteristics of composite solder joints, the solder joints were aged at 80°C, 120°C and 150°C.

The experimental results show that the content of Ni-MWCNTs affects the morphology and growth of the IMC layer at the interface. The microhardness of the solder increases and the wetting angle decreases. After aging at moderate (120°C) and high temperature (150°C), the morphology of the Cu6Sn5 IMC layer changed from scallop to lamellar and the grain size became coarser. The following two different phase compositions were observed in the solder joints with Ni-MWCNTs reinforcement: Cu3Sn and (Cu, Ni)6Sn5. The fracture surface of the solder joints all appeared ductile dents, and the size of the pits increased significantly with the increase of the aging temperature. Through growth kinetic analysis, Ni-modified MWCNTs in composite solder joints can effectively inhibit the diffusion of atoms in solder joints. In short, when the addition amount of Ni-MWCNTs is 0.1 Wt.%, the solder joints exhibit the best wettability and the highest shear strength.

In this study, the effects of aging conditions on the growth and shear strength of the IMC layer of Ni modified MWCNTs reinforced SAC307 composite solder were studied. The effects of Ni MWCNTs with different contents (0, 0.1 and 0.2 Wt.%) on the composite solder were examined.

Cu‐ZrB₂ shell electrodes were fabricated by composite electroforming to improve the spark‐resistance of the electrical discharge machining (EDM) electrodes made by rapid tooling.

Cu‐ZrB₂ shell electrodes were fabricated using composite electroforming, separating and backing. EDM performance evaluation of the Cu‐ZrB₂ shell electrodes is performed using tool steel as the cathode workpiece and the Cu‐ZrB₂ composite as the anode tool. The effects of ZrB₂ content on the electrode and workpiece removal rate, wear ratio of the electrode to workpiece, and surface quality of workpiece and electrode were studied.

Compared with the conventional electroformed copper tools, Cu‐ZrB₂ shell electrodes yield higher workpiece removal rate and lower tool wear ratio. Scanning electron microscopy (SEM) and electron microprobe analysis reveal that, due to the large difference between the melting point of ZrB₂ and copper, the heat generated by the sparks is conducted mainly through the copper matrix, reducing the erosion of ZrB₂ particles. The refractory ZrB₂ particles then act as barriers to the flowing and outburst of melted copper and enhance the resistance to erosion of the electrodes.

The use of Cu‐ZrB₂ shell electrodes improves the anti‐erosion properties of the EDM electrodes made by rapid tooling, especially in finish machining conditions. Such electrodes will not only reduce the failure of the EDM electrodes but also improve the machining precision due to the less dimension loss of the electrodes during machining.

Calcium and Zinc lignates were proven to be good antioxidants for rubber composites. The purpose of this paper is to evaluate the copper lignate antioxidant activity along with evaluating its electrical conductivity in rubber composites.

The antioxidant activity of the Cu-LSF complex was compared with that of standard commercial antioxidant additives as a green alternative. The rheological characteristics, thermal aging and mechanical and electrical properties were evaluated for the NBR vulcanizates containing the different antioxidants in the presence or absence of coupling agents.

Results revealed that the Cu-LSF complex (5 phr) can function as a compatibilizing, antioxidant and electrical conductivity agent.

The new copper complex prepared from paper-pulping black liquor of wastes could be used as a green antioxidant and electrical conductivity agent in rubber composites.